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Patent Searching and Data


Title:
VINYL CHLORIDE RESIN COMPOSITION FOR POWDER MOLDING, VINYL CHLORIDE RESIN MOLDED BODY, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/050027
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a vinyl chloride resin composition for powder molding, which is capable of forming a vinyl chloride resin molded body having excellent alcohol resistance and low temperature flexibility. This vinyl chloride resin composition for powder molding contains (a) a vinyl chloride resin and (b) a 3-methyl-1,5-pentane diol sebacic acid polyester containing a structural unit derived from sebacic acid and a structural unit derived from 3-methyl-1,5-pentane diol. This vinyl chloride resin composition for powder molding is preferably used in powder slush molding.

Inventors:
FUJIWARA TAKANORI (JP)
Application Number:
PCT/JP2021/029844
Publication Date:
March 10, 2022
Filing Date:
August 13, 2021
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
B32B5/24; B29C41/18; B32B27/30; C08G63/12; C08L27/06; C08L67/02
Domestic Patent References:
WO2021176901A12021-09-10
WO2020090556A12020-05-07
WO2016098344A12016-06-23
Foreign References:
JPS63218750A1988-09-12
JPS6178827A1986-04-22
JP2001089694A2001-04-03
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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