Title:
VINYL CHLORIDE RESIN COMPOSITION FOR POWDER MOLDING, VINYL CHLORIDE RESIN MOLDED BODY, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/050027
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a vinyl chloride resin composition for powder molding, which is capable of forming a vinyl chloride resin molded body having excellent alcohol resistance and low temperature flexibility. This vinyl chloride resin composition for powder molding contains (a) a vinyl chloride resin and (b) a 3-methyl-1,5-pentane diol sebacic acid polyester containing a structural unit derived from sebacic acid and a structural unit derived from 3-methyl-1,5-pentane diol. This vinyl chloride resin composition for powder molding is preferably used in powder slush molding.
Inventors:
FUJIWARA TAKANORI (JP)
Application Number:
PCT/JP2021/029844
Publication Date:
March 10, 2022
Filing Date:
August 13, 2021
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
B32B5/24; B29C41/18; B32B27/30; C08G63/12; C08L27/06; C08L67/02
Domestic Patent References:
| WO2021176901A1 | 2021-09-10 | |||
| WO2020090556A1 | 2020-05-07 | |||
| WO2016098344A1 | 2016-06-23 | |||
| WO2016098344A1 | 2016-06-23 |
Foreign References:
| JPS63218750A | 1988-09-12 | |||
| JPS6178827A | 1986-04-22 | |||
| JP2001089694A | 2001-04-03 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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