Title:
WAFER MIRROR SURFACE CHAMFERING METHOD, WAFER MANUFACTURING METHOD, AND WAFER
Document Type and Number:
WIPO Patent Application WO/2020/054811
Kind Code:
A1
Abstract:
Provided is a wafer mirror surface chamfering method by which corner burrs at the boundaries between main surfaces and chamfered surfaces of the wafer can be reduced. The present invention is a wafer mirror surface chamfering method by which chamfered surfaces of a wafer (W) are mirror-polished using polishing pads (4, 6), the method being characterized in that respective angles (α1, α2) between main surfaces of polishing pads (4, 6) and main surfaces of a wafer (W) are set to at most a target value of a chamfering angle at the time of chamfering.
Inventors:
YAMASHITA KENJI (JP)
Application Number:
PCT/JP2019/035936
Publication Date:
March 19, 2020
Filing Date:
September 12, 2019
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B9/00
Domestic Patent References:
WO2018037755A1 | 2018-03-01 | |||
WO2013168444A1 | 2013-11-14 |
Foreign References:
JP2002187050A | 2002-07-02 | |||
JPH1029142A | 1998-02-03 | |||
JP2016111116A | 2016-06-20 | |||
JP2017117915A | 2017-06-29 | |||
JPH02301135A | 1990-12-13 | |||
DE102013210057A1 | 2014-12-04 | |||
JP2009119537A | 2009-06-04 | |||
JP2000141190A | 2000-05-23 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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