Title:
WAFER PLACEMENT STAND
Document Type and Number:
WIPO Patent Application WO/2023/037698
Kind Code:
A1
Abstract:
A wafer placement stand 10 is equipped with a ceramic substrate 20 which has a wafer placement surface 22a on the top surface thereof and integrally houses an electrode 26 therein, a cooling substrate 30 which has a coolant channel 32 formed therein and is formed from a metal-ceramic composite material, and a metal joining layer 40 which joins the bottom surface of the ceramic substrate 20 to the top surface of the cooling substrate 30. The thickness of the portion of the cooling substrate 30 which is below the coolant channel 32 thereof is at least 13mm, or is at least 43% of the thickness of the cooling substrate 30 overall.
Inventors:
INOUE Seiya (JP)
TAKEBAYASHI Hiroshi (JP)
KUNO Tatsuya (JP)
TAKEBAYASHI Hiroshi (JP)
KUNO Tatsuya (JP)
Application Number:
PCT/JP2022/025141
Publication Date:
March 16, 2023
Filing Date:
June 23, 2022
Export Citation:
Assignee:
NGK INSULATORS, LTD. (JP)
International Classes:
H01L21/683; H02N13/00
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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