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Patent Searching and Data


Title:
WAFER POLISHING HEAD, METHOD FOR MANUFACTURING WAFER POLISHING HEAD, AND WAFER POLISHING APPARATUS COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/066242
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a wafer polishing head, the method comprising the steps of: coupling a guide ring consisting of a plurality of layers to the edge of a base substrate; rounding the edge of the guide ring; forming a first coating layer on the rounded surface of the guide ring through coating; fixing a rubber chuck to the base substrate; and forming a second coating layer on the outer circumferential surfaces of an adhesive and an adhesive material through coating, from the rubber chuck to the first coating layer.

Inventors:
SUNG JAE CHEL (KR)
Application Number:
PCT/KR2019/013927
Publication Date:
April 08, 2021
Filing Date:
October 23, 2019
Export Citation:
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Assignee:
SK SILTRON CO LTD (KR)
International Classes:
B24B37/14; B24B37/32; B24D3/00; B24D3/28
Foreign References:
KR20110037848A2011-04-13
JP2001287157A2001-10-16
KR20110037662A2011-04-13
JP2004327779A2004-11-18
JP2010244774A2010-10-28
Attorney, Agent or Firm:
LEE, Seung Chan (KR)
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