WAFER PROCESSING DEVICE

WIPO Patent Application WO/2021/112130

A1

Provided is a wafer processing device capable of performing wafer processing in a shorter tact time. The wafer processing device 1 is provided with: a chamber 11 including an upper unit 21 and a lower unit 22 opposing the upper unit 21, forming an accommodating space 22c for accommodating a wafer 2, the chamber 11 being used for subjecting the wafer to predetermined processing using a supercritical fluid; an upper heater provided on the upper unit 21 so as to be rotatable about a vertical axis and having a support means provided on a lower surface thereof for supporting the wafer, which is horizontally loaded; an open/close means 12 for opening and closing the chamber 11 by causing at least one of the upper and lower units 21, 22 to be moved in up/down directions; and a rotating means 30 for causing the upper heater to rotate about the vertical axis. The rotating means 30 causes the upper heater to rotate so that a wafer loading direction into the upper heater and a wafer unloading direction from the upper heater form a predetermined angle.

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HIFUMI MASATERU (JP)
KUNISHIGE HIDENORI (JP)
SEKIGUCHI HIROFUMI (JP)
ASHIHARA AKIRA (JP)
HYODO KOSUKE (JP)

PCT/JP2020/044878

June 10, 2021

December 02, 2020

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REXXAM CO LTD (JP)

H01L21/304; H01L21/683

JP2013033962A	2013-02-14
JP2017183579A	2017-10-05
JP2011009299A	2011-01-13
JP2013030502A	2013-02-07
JP2013131729A	2013-07-04

TANIGAWA, Hidekazu (JP)

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