Title:
WASHING METHOD OF SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT HAVING GAS HOLES
Document Type and Number:
WIPO Patent Application WO/2021/039838
Kind Code:
A1
Abstract:
In this method of washing a semiconductor manufacturing device component having gas holes used in a single-wafer semiconductor manufacturing device for processing semiconductor wafers, the semiconductor manufacturing device component having gas holes is provided with a dispersion plate which is formed from aluminum or an aluminum alloy and which has a plurality of gas holes, and involves a step (1) for scanning a laser beam on the gas injection surface, which is the surface of the dispersion plate facing the wafer, and a step (2) for bringing the gas injection surface and the inside of the gas holes into contact with a cleaning liquid that contains an inorganic acid.
Inventors:
MATSUMURA TOMOHIRO (JP)
MATSUMOTO AKIHIRO (JP)
MATSUMOTO AKIHIRO (JP)
Application Number:
PCT/JP2020/032168
Publication Date:
March 04, 2021
Filing Date:
August 26, 2020
Export Citation:
Assignee:
SHINRYO CORP (JP)
International Classes:
B08B3/04; B08B7/00; C23C16/44; H01L21/3065; H01L21/31
Foreign References:
| JP2012064773A | 2012-03-29 | |||
| JP2011184774A | 2011-09-22 | |||
| JP2009054997A | 2009-03-12 | |||
| JP2019155485A | 2019-09-19 | |||
| JP2005167087A | 2005-06-23 | |||
| JP4668915B2 | 2011-04-13 |
Other References:
See also references of EP 4023349A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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