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Title:
WAVE CONTROL MEDIUM, WAVE CONTROL ELEMENT, WAVE CONTROL MEMBER, WAVE CONTROL DEVICE, AND METHOD FOR MANUFACTURING WAVE CONTROL MEDIUM
Document Type and Number:
WIPO Patent Application WO/2022/113551
Kind Code:
A1
Abstract:
Provided is a wave control medium capable of absorbing and controlling waves while decreasing the size of a metamaterial or the like and increasing the bandwidth of the metamaterial or the like. The wave control medium 5 comprises a three-dimensional microstructure that has a base 2, a spiral section 3, and a matching element 6 disposed between the base 2 and the spiral section 3. The three-dimensional microstructure is formed from one or a combination of a plurality selected from metal, a dielectric, a magnetic body, a semiconductor, and a superconductor. The wave control medium 5 smooths changes in overall impedance values and enables waves to be absorbed, as a result of comprising the matching element 6 disposed between the base 2 and the spiral section 3.

Inventors:
IGARASHI ERI (JP)
KAWAMURA TAKASHI (JP)
Application Number:
PCT/JP2021/037892
Publication Date:
June 02, 2022
Filing Date:
October 13, 2021
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
H01Q17/00; H01Q15/14
Domestic Patent References:
WO2010026907A12010-03-11
Foreign References:
KR20180054105A2018-05-24
US20050008308A12005-01-13
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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