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Patent Searching and Data


Title:
WAVEGUIDE INTEGRATED SUBSTRATE AND FABRICATING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/066365
Kind Code:
A1
Abstract:
Provided are a substrate integrated waveguide and a manufacturing method thereof. A base substrate extends in a propagation direction of an electromagnetic wave signal and formed from a glass material. A plurality of vias formed from metal extend through the base substrate from an upper surface to a lower surface, aligned in the propagation direction of the electromagnetic wave signal. An upper electric conductor is formed on the upper surface of the base substrate and connected to the plurality of vias. A lower electric conductor is formed on the lower surface of the base substrate and connected to the upper electric conductor through the plurality of vias. A pitch of adjacent vias is two to eight times as great as a diameter of the via. The thickness of the glass substrate and the diameters and the pitch of vias are optimized for the glass substrate.

Inventors:
KANG BYOUNG-GWAN (KR)
KAHNG SUNGTEK (KR)
KIM SANG-TAE (KR)
MOON HYUNG-SOO (KR)
LEE CHANGHYEONG (KR)
Application Number:
PCT/KR2020/012672
Publication Date:
April 08, 2021
Filing Date:
September 18, 2020
Export Citation:
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Assignee:
INCHEON NATIONAL UNIV RESEARCH & BUSINESS FOUNDATION (KR)
CORNING INC (US)
International Classes:
H01P11/00; H01P3/12
Foreign References:
US20170186710A12017-06-29
US20120274419A12012-11-01
KR101407727B12014-06-13
CN109728389A2019-05-07
US20150303870A12015-10-22
Attorney, Agent or Firm:
KIM, Seon-Min (KR)
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