Title:
WEB BONDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/225283
Kind Code:
A1
Abstract:
A laminating apparatus (web bonding apparatus) (1) comprises: a first conveyance device (15) for conveying, to a bonding position (100), a base (first web) (10) on which a predetermined pattern (11) is formed; a second conveyance device (25) for conveying, to the bonding position (100), a masking material (second web) (20) to be bonded to the base (10); a CCD camera (35) (image detection unit) for acquiring image information on the base (10) on the upstream side of the bonding position (100) in a first conveyance path (110); and a laser processing device (30) for performing laser processing on the masking material (20) on the upstream side of the bonding position (100) in a second conveyance path (120). A conveyance error of the base (10) is acquired on the basis of the image information acquired by the CCD camera (35), and laser processing on the masking material (20) is adjusted on the basis of the conveyance error.
Inventors:
TAKAGI TAKASHI (JP)
SATO TAKAYUKI (JP)
SATO TAKAYUKI (JP)
Application Number:
PCT/JP2017/041719
Publication Date:
December 13, 2018
Filing Date:
November 20, 2017
Export Citation:
Assignee:
FUJISHOKO MACHINERY CO LTD (JP)
International Classes:
B65H39/16; B23K26/38; B65H41/00
Domestic Patent References:
| WO2014192098A1 | 2014-12-04 |
Foreign References:
| JP2006520700A | 2006-09-14 | |||
| JPH0558543A | 1993-03-09 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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