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Patent Searching and Data


Title:
WIRE ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/258038
Kind Code:
A1
Abstract:
The present invention relates to the technical field of wires, and in particular to a wire assembly and an electronic device. The wire assembly comprises a conductive member, a transmission line, and a conductive adhesive. A strip-shaped recess is provided on the conductive member. The transmission line is inserted in the recess. The transmission line comprises a substrate covering an opening of the recess, a signal line located in the substrate, and a first ground wire and a second ground wire respectively provided on two sides of the substrate. The first ground wire is exposed outside the opening of the recess. The first ground wire and the conductive member are electrically and fixedly connected to each other. The second ground wire is fixedly connected to the bottom of the recess by means of the conductive adhesive. The electronic device comprises the above wire assembly. The conductive member of the wire assembly is a metal frame of the electronic device. The wire assembly and the electronic device of the present invention are small in size, and have good signal transmission performance.

Inventors:
CHEN YONGLI (CN)
WANG JIANAN (CN)
XU XINYING (CN)
Application Number:
PCT/CN2019/092825
Publication Date:
December 30, 2020
Filing Date:
June 25, 2019
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC MODULE TECH CHANGZHOU CO LTD (CN)
International Classes:
H01P3/08; H05K7/02
Foreign References:
JPH02113702A1990-04-25
CN106960997A2017-07-18
CN101686614A2010-03-31
CN201282187Y2009-07-29
Attorney, Agent or Firm:
GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE (CN)
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