CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Chinese Patent Application No.201710352835.7 filed on May 18, 2017 in the State Intellectual Property Office of China, the whole disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION

Field of the Invention

At least one embodiments of the present invention relates to a wire automatic soldering system.

Description of the Related Art

In a field of manufacturing an electrical device, solder paste, for example, tinol, is often used to solder a lead or pin of the electrical device. In the relevant art, the lead or pin of the electrical device is generally soldered by manual, for example, an operator usually use an iron head to heat a solder paste placed on the lead or pin of the electrical device, so that the solder paste is melted and liquefied. After the solder paste is cured, the soldering of the lead or pin of the electrical device is realized.

However, the efficiency of manual soldering is very low. It is only suitable for a task of soldering a single product and not suitable for a task of soldering mass products.

SUMMARY OF THE INVENTION

The present invention has been made to overcome or alleviate at least one aspect of the above mentioned disadvantages.

According to an object of the present invention, there is provided a wire automatic soldering system which may automatically perform a task of soldering wires of an electrical product. According to an aspect of the present invention, there is provided a wire automatic soldering system, comprising: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to contain a solder paste; and a heater configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid, wherein the robot is adapted to move wires of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container.

According to an exemplary embodiment of the present invention, the wire automatic soldering system further comprises a vision detection system configured to detect whether an actual soldering length of a soldered part of the wires by the solder paste is equal to or larger than a first predetermined length; and if the actual soldering length is less than the first predetermined length, the robot moves the wires into the solder paste container again, so as to further solder the wires until the actual soldering length is equal to or larger than the first predetermined length.

According to another exemplary embodiment of the present invention, the vision detection system is further configured to detect whether an actual soldering quality of the soldered part of the wires is conformed to a predetermined soldering quality; if the actual soldering quality is not conformed to the predetermined soldering quality, the robot moves the wires into the solder paste container again, so as to further solder the wires until the actual soldering quality is conformed to the predetermined soldering quality.

According to another exemplary embodiment of the present invention, the wire automatic soldering system further comprises a cutting mechanism configured to cut off a segment of end portion of the soldered part of the wires, so that the length of the soldered part of the wires is equal to a second predetermined length which is less than the first predetermined length.

According to another exemplary embodiment of the present invention, the vision detection system is further configured to detect whether the length of the soldered part of the wires after the segment of end portion of the soldered part is cut off is larger than the second predetermined length; and if the length of the soldered part of the wires after the segment of end portion of the soldered part is cut off is larger than the second predetermined length, the robot moves the wires to the cutting mechanism again, so as to cut the soldered part of the wires again until the length of the soldered part of the wires is equal to the second predetermined length.

According to another exemplary embodiment of the present invention, the wire automatic soldering system further comprises a waste recycling bin configured to receive the end portion cut off from the wires. The waste recycling bin is positioned so that the end portion cut off from the wires falls directly into the waste recycling bin.

According to another exemplary embodiment of the present invention, the wire automatic soldering system further comprises a solder paste syringe configured to inject the solder paste into the solder paste container.

According to another exemplary embodiment of the present invention, the wire automatic soldering system further comprises a first moving mechanism adapted to move the solder paste syringe in a vertical direction to an injection position. An injection port of the solder paste syringe is inserted into the solder paste container when the solder paste syringe is moved to the injection position.

According to another exemplary embodiment of the present invention, the wire automatic soldering system further comprises a second moving mechanism adapted to move the solder paste container in a horizontal direction to an injection station. The solder paste container is aligned with the solder paste syringe in the vertical direction when the solder paste container is moved to the injection station.

According to another exemplary embodiment of the present invention, the solder paste syringe comprises an electric syringe, and the amount of solder paste injected by the solder paste syringe in a single injection happens to fully fill the solder paste container.

According to another exemplary embodiment of the present invention, the wire automatic soldering system further comprises a cleaning brush adapted to remove impurities from a surface of the solder paste in the solder paste container.

According to another exemplary embodiment of the present invention, the wire automatic soldering system further comprises a visual inspection system configured to inspect whether there are the impurities on the surface of the solder paste in the solder paste container. The cleaning brush is controlled to remove the impurities in time once the impurities are inspected by the visual inspection system.

According to another exemplary embodiment of the present invention, the robot has a gripper adapted to grip the carrier on which the electrical product is loaded.

According to another exemplary embodiment of the present invention, the wires of the electrical product to be soldered are clamped and fixed on the carrier, parts of the wires to be soldered together extend out of the carrier and adapted to be inserted into the solder paste container.

In the above various exemplary embodiments of the present invention, the wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:

Fig.l is an illustrative perspective view of a wire automatic soldering system according to an exemplary embodiment of the present invention; and

Fig.2 is an illustrative perspective view of a robot of the wire automatic soldering system of Fig. l. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE

IVENTION

Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein the like reference numerals refer to the like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the concept of the disclosure to those skilled in the art.

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed

embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

According to a general concept of the present invention, there is provided a wire automatic soldering system, comprising: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to contain a solder paste; and a heater configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid, wherein the robot is adapted to move wires of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container.

Fig.l is an illustrative perspective view of a wire automatic soldering system according to an exemplary embodiment of the present invention; and Fig.2 is an illustrative perspective view of a robot 100 of the wire automatic soldering system of Fig. l.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system mainly comprises a carrier 120, a robot 100, a solder paste container 200, and a heater 220. An electrical product 10 to be soldered is loaded on the carrier 120. The robot 100 is adapted to grip and move the carrier 120 on which the electrical product 10 is loaded. The solder paste container 200 is configured to contain a solder paste. The heater 220 is configured to heat the solder paste contained in the solder paste container 200, so that the solder paste is melted into liquid.

As shown in Figs.1-2, in an embodiment, the robot 100 is a robot with multiple degrees of freedom. The robot 100 is adapted to move wires 11 of the electrical product 10 into the solder paste container 200, so that parts of the wires 11 to be soldered together are immersed in the molten solder paste in the solder paste container 200. In this way, the wires 11 may be soldered together by the solder paste in the solder paste container 200. As shown in Fig.2, in an embodiment, the electrical product 10 has two wires 11 to be soldered together. The two wires 11 are held side by side and fixed on the carrier 120. As shown in Fig.2, parts of the wires 11 to be soldered together extend out of the carrier 120 and adapted to be inserted into the solder paste container 200.

As shown in Fig.2, in an embodiment, the robot 100 has a gripper 110 adapted to grip the carrier 120 on which the electrical product 10 is loaded.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a vision detection system 500. The vision detection system 500 is configured to detect whether an actual soldering length of a soldered part of the wires 11 by the solder paste is equal to or larger than a first predetermined length. If the actual soldering length is less than the first predetermined length, the robot 100 moves the wires 11 into the solder paste container 200 again, so as to further solder the wires 11 until the actual soldering length is equal to or larger than the first predetermined length.

As shown in Figs.1-2, in an embodiment, the vision detection system 500 is also configured to detect whether an actual soldering quality of the soldered part of the wires 11 is conformed to a predetermined soldering quality. If the actual soldering quality is not conformed to the predetermined soldering quality, the robot 100 moves the wires 11 into the solder paste container 200 again, so as to further solder the wires 11 until the actual soldering quality is reached the predetermined soldering quality.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a cutting mechanism 400. The cutting mechanism 400 is configured to cut off a segment of end portion of the soldered part of the wires 11, so that the length of the soldered part of the wires 11 is equal to a second predetermined length which is less than the first predetermined length.

As shown in Figs.1-2, in an embodiment, the vision detection system 500 is also configured to detect whether the length of the soldered part of the wires 11, after the segment of end portion of the soldered part is cut off, is larger than the second predetermined length. If the length of the soldered part of the wires 11 , after the segment of end portion of the soldered part is cut off, is larger than the second predetermined length, the robot 100 moves the wires 11 to the cutting mechanism 400 again, so as to cut the soldered part of the wires 11 again until the length of the soldered part of the wires 11 is equal to the second predetermined length.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a waste recycling bin 410. The waste recycling bin 410 is configured to receive the end portion cut off from the wires 11 by the cutting mechanism 400. In an example, the waste recycling bin 410 may be positioned below the cutting mechanism 400, so that the end portion cut off from the wires 11 may fall directly into the waste recycling bin 410. As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a solder paste syringe 300. The solder paste syringe 300 is configured to inject the solder paste into the solder paste container 200.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a first moving mechanism 310. The first moving mechanism 310 is adapted to move the solder paste syringe 300 in a vertical direction to an injection position. An injection port of the solder paste syringe 300 is inserted into the solder paste container 200 when the solder paste syringe 300 is moved to the injection position.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a second moving mechanism 210. The second moving mechanism 210 is adapted to move the solder paste container 200 in a horizontal direction to an injection station. The solder paste container 200 is aligned with the solder paste syringe 300 in the vertical direction when the solder paste container 200 is moved to the injection station.

As shown in Figs.1-2, in an embodiment, the solder paste syringe 300 may comprise an electric syringe, and the amount of solder paste injected by the solder paste syringe 300 in a single injection may happen to fully fill the solder paste container 200.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a cleaning brush 230. The cleaning brush 230 is adapted to remove impurities from a surface of the solder paste in the solder paste container 200. In an embodiment, the impurities may include, for example, oxides floating on the surface of the molten solder paste in solder paste container 200.

As shown in Figs.1-2, in an embodiment, the wire automatic soldering system may further comprise a visual inspection system 240. The visual inspection system 240 is configured to inspect whether there are the impurities on the surface of the solder paste in the solder paste container 200. The cleaning brush 230 is controlled to remove the impurities in time once the impurities are inspected by the visual inspection system 240.

Hereafter, it will describe the working process of the wire automatic soldering system with reference to Figs.1-2.

Firstly, the electrical product 10 is loaded onto the carrier 120;

Then, the robot 100 grips the carrier 120, on which the electrical product 10 is loaded, by the gripper 110;

Then, the robot 100 moves the electrical product 10, so as to insert the parts of the wires 11 to be soldered into the molten solder paste in the solder paste container 200;

Then, the robot 100 moves the electrical product 100 near the vision detection system 500, and the vision detection system 500 is operated to detect whether an actual soldering length of a soldered part of the wires 11 by the solder paste is equal to or larger than a first predetermined length, and whether an actual soldering quality of the soldered part of the wires 11 is conformed to a predetermined soldering quality. If the actual soldering length is less than the first predetermined length or if the actual soldering quality is not conformed to the predetermined soldering quality, the robot 100 moves the wires 11 into the solder paste container 200 again, so as to further solder the wires 11 until the actual soldering length is equal to or larger than the first predetermined length and the actual soldering quality is reached the predetermined soldering quality.

Then, the cutting mechanism 400 is driven to cut off a segment of end portion of the soldered part of the wires 11.

Then, the vision detection system 500 is operated to detect whether the length of the soldered part of the wires 11 after the segment of end portion of the soldered part is cut off is larger than the second predetermined length; if the length of the soldered part of the wires 11 after the segment of end portion of the soldered part is cut off is larger than the second predetermined length, the robot 100 moves the wires 11 to the cutting mechanism 400 again, so as to cut the soldered part of the wires 11 again until the length of the soldered part of the wires 11 is equal to the second predetermined length.

In this way, the task of soldering the wires 11 of the electrical product 10 is finished.

It should be appreciated for those skilled in this art that the above embodiments are intended to be illustrated, and not restrictive. For example, many modifications may be made to the above embodiments by those skilled in this art, and various features described in different embodiments may be freely combined with each other without conflicting in configuration or principle.

Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.

As used herein, an element recited in the singular and proceeded with the word "a" or

"an" should be understood as not excluding plural of said elements or steps, unless such exclusion is explicitly stated. Furthermore, references to "one embodiment" of the present invention are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments "comprising" or "having" an element or a plurality of elements having a particular property may include additional such elements not having that property.