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Patent Searching and Data


Title:
WIRE BUNDLE MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/065755
Kind Code:
A1
Abstract:
In this wire bundle manufacturing device, each time a prescribed length L1 of a wire Sg is supplied, two linked holding units 2(2r, 2f) move in the supply direction at a speed corresponding to the supply speed Ts1 of the wire Sg and grasp the wire Sg in the front and back, in the supply direction, of a position that is the prescribed length L1 from the end of the wire Sg in the supply direction, a cutter 4 cuts wire Sg at the position that is the prescribed length L1 from the end of the wire Sg in the supply direction, forming a wire section Sgc of a prescribed length, and the wire section Sgc is conveyed by the holding units 2(2f, 2r) to a wire section accumulation area 6.

Inventors:
OKAZAKI Yoshiyuki (Ltd. 377-1 Yodomizu-cho, Fushimi-ku, Kyoto-Sh, Kyoto 16, JP)
TANAKA Atsushi (Ltd. 377-1 Yodomizu-cho, Fushimi-ku, Kyoto-Sh, Kyoto 16, JP)
TANAKA Hiroaki (Ltd. 377-1 Yodomizu-cho, Fushimi-ku, Kyoto-Sh, Kyoto 16, JP)
HONJOH AKIRA (Ltd. 377-1 Yodomizu-cho, Fushimi-ku, Kyoto-Sh, Kyoto 16, JP)
Application Number:
JP2020/036478
Publication Date:
April 08, 2021
Filing Date:
September 25, 2020
Export Citation:
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Assignee:
KYOTO SEISAKUSHO CO., LTD. (Yodomizu-cho Fushimi-ku, Kyoto-Sh, Kyoto 16, JP)
International Classes:
B26D1/60; B26D5/00; B65H51/18; D06H7/02
Attorney, Agent or Firm:
SANO PATENT OFFICE (2-6 Tenmabashi-Kyomachi, Chuo-Ku, Osaka-Sh, Osaka 32, JP)
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