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Patent Searching and Data


Title:
WIRE DRAWING DIE
Document Type and Number:
WIPO Patent Application WO/2022/044802
Kind Code:
A1
Abstract:
A wire drawing die 1 that comprises a non-diamond material, is provided with a die hole 1h, and has a reduction 1c and a bearing 1d that is positioned downstream of the reduction 1c. The reduction angle γ, which is the opening angle of the die hole 1h at the reduction 1c, is no more than 17°, and the surface roughness Ra of the die hole 1h within ±20 μm from a specific position inside the bearing 1d in a circumferential direction of the die hole 1h that is perpendicular to the wire drawing direction is no more than 0.025 μm.

Inventors:
KURAMOTO KOHEI (JP)
KINOSHITA TAKUYA (JP)
KOBAYASHI YUTAKA (JP)
YUKAWA MAKOTO (JP)
KIMURA KOHICHIROH (JP)
SHIRO KENTARO (JP)
Application Number:
PCT/JP2021/029606
Publication Date:
March 03, 2022
Filing Date:
August 11, 2021
Export Citation:
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Assignee:
ALMT CORP (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B21C3/02
Domestic Patent References:
WO2018123513A12018-07-05
WO2013031681A12013-03-07
Foreign References:
JP2007090371A2007-04-12
JPH038518A1991-01-16
JP2020140863A2020-09-03
JPH026011A1990-01-10
JPH02127912A1990-05-16
JPH04147713A1992-05-21
JP2014034487A2014-02-24
JPS5698405A1981-08-07
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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