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Patent Searching and Data


Title:
WIRELESS COMMUNICATION MODULE
Document Type and Number:
WIPO Patent Application WO/2021/240861
Kind Code:
A1
Abstract:
A wireless communication module according to the present invention comprises a mounting substrate that has a first surface and a second surface, an antenna substrate that is mounted to the first surface, and an IC package that has an RFIC and is mounted to the second surface. Formed in the mounting substrate are a heat dissipation via that passes through the mounting substrate and that extends between the first surface and the second surface, a heat dissipation pattern that is formed on the first surface and that is connected to the heat dissipation via, and a non-heat-dissipation via that transmits an electric signal or electric current. In a planar view from the thickness direction of the mounting substrate, the heat dissipation via is connected to the RFIC at a position that overlaps with the RFIC, and the heat dissipation pattern extends to outside the antenna substrate.

Inventors:
TOMITA MICHIKAZU (JP)
Application Number:
PCT/JP2021/000429
Publication Date:
December 02, 2021
Filing Date:
January 08, 2021
Export Citation:
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Assignee:
FUJIKURA LTD (JP)
International Classes:
H01Q23/00; H04B1/38
Domestic Patent References:
WO2008129923A12008-10-30
Foreign References:
US20100225539A12010-09-09
US20190355680A12019-11-21
JP2009038696A2009-02-19
JP2009158744A2009-07-16
JP2020091692A2020-06-11
JP2019097026A2019-06-20
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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