Title:
WIRING BOARD, ANTENNA MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090391
Kind Code:
A1
Abstract:
A wiring board (50) for supplying a high frequency signal to an antenna module that has a first antenna element and a second antenna element, said wiring board (50) being provided with: a dielectric substrate (130) that has a multilayer structure; a first power supply line (141) which is formed on the dielectric substrate (130) so as to supply a high frequency signal to the first antenna element; a second power supply line (142) which is formed on the dielectric substrate (130) so as to supply a high frequency signal to the second antenna element; and a ground conductor (190) which is formed in a layer that is different from both of the layer in which the first power supply line (141) is formed and the layer in which the second power supply line (142) is formed. The dielectric substrate (130) is provided with a hole (150), which extends toward the ground conductor (190), in a position between the first power supply line (141) and the second power supply line (142).
Inventors:
FUJII NORIKAZU (JP)
YOKOYAMA MICHIHARU (JP)
YOKOYAMA MICHIHARU (JP)
Application Number:
PCT/JP2019/039816
Publication Date:
May 07, 2020
Filing Date:
October 09, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q1/52; H01Q13/08; H01Q21/08; H01Q23/00; H05K1/02
Foreign References:
| JP2014197811A | 2014-10-16 | |||
| JP2006165779A | 2006-06-22 | |||
| JP2016086260A | 2016-05-19 | |||
| JP2009005104A | 2009-01-08 | |||
| JP2007166115A | 2007-06-28 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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