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Patent Searching and Data


Title:
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/226049
Kind Code:
A1
Abstract:
This wiring board (10) comprises: a transparent board (11); a wiring pattern region (20) that is placed on the board (11), and that includes a plurality of first direction wirings (21); and a power feeding unit (40) that is electrically connected to the plurality of first direction wirings (21) of the wiring pattern region (20). The first direction wirings (21) have a first region (26) positioned near the power feeding unit (40), and a second region (27) other than the first region (26). A line width (W3) of the first direction wirings (21) in the first region (26) is thicker than a line width (W1) of the first direction wirings (21) in the second region (27). 

Inventors:
SUZUKI KOICHI (JP)
TAKE SEIJI (JP)
MATSUURA DAISUKE (JP)
Application Number:
PCT/JP2020/017139
Publication Date:
November 12, 2020
Filing Date:
April 21, 2020
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01Q1/38; H05K1/02; H05K3/28
Foreign References:
JP2011205635A2011-10-13
JP2006295430A2006-10-26
JP2009170474A2009-07-30
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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