Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2006/028098
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a mutilayer wiring board wherein high density wiring exceeding the application limit of the conventional build up wiring boards is made possible. [MEANS FOR SOLVING PROBLEMS] A wiring board is provided with a board, which is formed by stacking along a board flat plane direction a plurality of dielectric layers arranged along a facing direction of the both main planes of the board, and an inner conductor pattern arranged on the surface of the dielectric layer. The adjacent dielectric layers are integrally formed to be communicated with each other by being connected at the layer edges on one of the board main planes. The connecting portions of the adjacent dielectric layers are alternately provided on one of the board main planes, and the dielectric layers are formed in a shape of one dielectric sheet which is arranged by being bent.
Inventors:
TOMITA YOSHIHIRO
NAKAMURA TADASHI
NAKAMURA TADASHI
Application Number:
PCT/JP2005/016339
Publication Date:
March 16, 2006
Filing Date:
September 06, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
TOMITA YOSHIHIRO
NAKAMURA TADASHI
TOMITA YOSHIHIRO
NAKAMURA TADASHI
International Classes:
H05K3/46; H05K1/02; H05K3/00
Foreign References:
| JPS4725942B1 | ||||
| JP2003069181A | 2003-03-07 | |||
| JPH1027960A | 1998-01-27 | |||
| JP2002359448A | 2002-12-13 |
Attorney, Agent or Firm:
Okada, Kazuhide (13-38 Naniwa-cho, Kita-k, Osaka-shi Osaka 22, JP)
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