Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/216505
Kind Code:
A1
Abstract:
Provided are: a wiring board in which, even when a plurality of via conductors are arranged in parallel for each of a plurality of pads opposing each other with an insulating layer therebetween, a crack is not prone to occur in the insulating layer due to the arrangement of the plurality of via conductors; and a method for manufacturing the same. The wiring board 1 is provided with: a board body 2 which is made up of a plurality of insulating layers c1 to c5 and includes an upper surface 3 and a lower surface 4 opposing each other; a plurality of pads 5 to 7 formed on at least one of the upper surface 3, the lower surface 4, and an inner layer surface 9 of the board body 2; and a plurality of via conductors 8 which are respectively connected to the plurality of pads 5 to 7 of the board body 2 and formed in parallel along the thickness of the board body 2. In the board body 2, the plurality of via conductors 8 are connected to a plurality of pads 5 to 7 adjacent to each other on the same surfaces 3, 4, 9 in plan view, wherein the arrangement of the plurality of via conductors 8 differs among the adjacent pads 5 to 7 on the same surfaces 3, 4, 9 in plan view.
Inventors:
HAYASHI TAKAHIRO (JP)
HANDO TAKUYA (JP)
HANDO TAKUYA (JP)
Application Number:
PCT/JP2018/018291
Publication Date:
November 29, 2018
Filing Date:
May 11, 2018
Export Citation:
Assignee:
NGK SPARK PLUG CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2016052284A1 | 2016-04-07 |
Foreign References:
| JP2012028730A | 2012-02-09 | |||
| JPH06326471A | 1994-11-25 | |||
| JPH0423495A | 1992-01-27 | |||
| JP2005527122A | 2005-09-08 | |||
| JP2012028730A | 2012-02-09 |
Other References:
See also references of EP 3634093A4
Attorney, Agent or Firm:
NAKAJIMA Hiroki (JP)
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