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Patent Searching and Data


Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/193092
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure comprises: a core layer, in which a core conductor layer is provided on the upper and lower surfaces of a core insulation layer; a first buildup part; a second buildup part; a first mounting region; and a second mounting region. The first buildup part includes a first buildup insulation layer, and a first buildup conductor layer that is connected to the first mounting region. The second buildup part includes a second buildup insulation layer, and a second buildup conductor layer that is connected to the second mounting region. The second buildup insulation layer has an adhesion margin between one and another second buildup insulation layer, or between the second buildup insulation layer and the core insulation layer. The second buildup conductor layer includes a grounding conductor layer, a first opening, and a signal pad positioned inside the first opening. The grounding conductor layer has an overhanging section that overhangs in a direction approaching the outer peripheral edge following the grounding conductor layer, the overhanging section surrounding the signal pad.

Inventors:
HIWATASHI TOSHIHIRO (JP)
Application Number:
PCT/JP2021/009763
Publication Date:
September 30, 2021
Filing Date:
March 11, 2021
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/02; H05K3/46
Foreign References:
US20180212307A12018-07-26
JP2019033586A2019-02-28
JP2008218444A2008-09-18
JP2001244633A2001-09-07
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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