Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/163574
Kind Code:
A1
Abstract:
In the present invention, an insulating layer and a conductor layer are laminated on a wiring board. The insulating layer is made of glass ceramics. The conductor layer is made of a sintered body of multiple copper-based crystallites. The multiple crystallites include polygonal crystallites having a linear side. The multiple crystallites are in contact with each other via the linear side as a grain boundary.
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Inventors:
HIGASHI TOSHIFUMI (JP)
SANO HIROAKI (JP)
IMOTO AKIRA (JP)
YAMAMOTO SENTAROU (JP)
SANO HIROAKI (JP)
IMOTO AKIRA (JP)
YAMAMOTO SENTAROU (JP)
Application Number:
PCT/JP2022/002423
Publication Date:
August 04, 2022
Filing Date:
January 24, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
B22F7/04; H05K3/12; H05K3/38
Domestic Patent References:
WO2017187753A1 | 2017-11-02 |
Foreign References:
JP2000244123A | 2000-09-08 | |||
JP2001202823A | 2001-07-27 | |||
JP2003277852A | 2003-10-02 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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