Title:
WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/049242
Kind Code:
A1
Abstract:
A wiring circuit board 1 comprises: a base insulating layer 2; a conductor layer 3 that is disposed on one surface in the thickness direction of the base insulating layer 2; a cover insulating layer 4 that is disposed on the one surface in the thickness direction of the base insulating layer 2 so as to cover the conductor layer 3; and a shielding layer 5 that is disposed on the other surface in the thickness direction and both side surfaces in the width direction of the base insulating layer 2 and one surface in the thickness direction and both side surfaces in the width direction of the cover insulating layer 4. At least one of the base insulating layer 2 and the cover insulating layer 4 has a porous resin layer 10.
Inventors:
MATSUTOMI AKIHITO (JP)
HODONO MASAYUKI (JP)
HODONO MASAYUKI (JP)
Application Number:
PCT/JP2020/030723
Publication Date:
March 18, 2021
Filing Date:
August 12, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/00; H05K1/02; H05K1/03; H05K3/28; H05K9/00
Domestic Patent References:
| WO2004060660A1 | 2004-07-22 | |||
| WO2018186486A1 | 2018-10-11 |
Foreign References:
| JPS6255992A | 1987-03-11 | |||
| JP2009146694A | 2009-07-02 | |||
| JP2002118339A | 2002-04-19 | |||
| JP2003201362A | 2003-07-18 | |||
| JP2014022146A | 2014-02-03 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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