Title:
WIRING FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/151073
Kind Code:
A1
Abstract:
Provided is a wiring forming method comprising the following A and B steps: (A step) a step for applying a catalyst ink on the substrate having a lyophilic portion and a liquid repellent portion, to thereby provide a base layer; (B step) a step for immersing the substrate provided with the base layer in an electroless plating bath, and forming a metal plated film. The method can provide a fine wiring pattern having an excellent rectilinear propagation property without disconnection, such as a fine wiring pattern of 50 μm or less, by electroless plating.
Inventors:
HOSHINO YUKI (JP)
MORIMOTO YUDAI (JP)
YUKAWA SHOJIRO (JP)
KOJIMA KEISUKE (JP)
OMURA HIROYUKI (JP)
MORIMOTO YUDAI (JP)
YUKAWA SHOJIRO (JP)
KOJIMA KEISUKE (JP)
OMURA HIROYUKI (JP)
Application Number:
PCT/JP2018/004810
Publication Date:
August 23, 2018
Filing Date:
February 13, 2018
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
H05K3/18; C08F20/58; C08L33/26; C09D11/037; C09D11/322; C23C18/20; C23C18/26
Domestic Patent References:
WO2015088008A1 | 2015-06-18 |
Foreign References:
JP2016157111A | 2016-09-01 | |||
JP2013028772A | 2013-02-07 | |||
JPH11344804A | 1999-12-14 | |||
JP2014159620A | 2014-09-04 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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