Title:
WIRING MATERIAL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/200742
Kind Code:
A1
Abstract:
A wiring material comprising a conductor and, disposed on the peripheral surface thereof, an insulator layer constituted of a resin composition, wherein the resin composition comprises resin ingredients which comprise, with respect to 100 mass% the resin ingredients, 10-50 mass% polypropylene resin (A), 30-85 mass% reactor blend type polyolefin-based thermoplastic resin (B) obtained from a polypropylene ingredient (b1) and an ethylene/α-olefin copolymer rubber ingredient (b2), and 5-25 mass% polyethylene resin (C), the polypropylene ingredient (b1) comprising homopolypropylene or random polypropylene, and the resin composition contains substantially no filler; and a method for producing the wiring material.
Inventors:
ENDO HITOMI (JP)
NISHIGUCHI MASAKI (JP)
NISHIGUCHI MASAKI (JP)
Application Number:
PCT/JP2021/013088
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C08L23/06; C08L23/12; C08L23/16; H01B3/44; H01B7/02; H01B7/04; H01B13/00; H01B13/14
Foreign References:
| JP2006321934A | 2006-11-30 | |||
| JPH08180737A | 1996-07-12 | |||
| JP2000188015A | 2000-07-04 | |||
| JP2001325834A | 2001-11-22 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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