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Patent Searching and Data


Title:
WIRING MODULE
Document Type and Number:
WIPO Patent Application WO/2021/075165
Kind Code:
A1
Abstract:
A wiring module 20 is provided with a first flexible printed circuit board 21 and a second flexible printed circuit board 22 provided separately from the first flexible printed circuit board 21. The first flexible printed circuit board 21 and the second flexible printed circuit board 22 are arranged so as to link in a first direction and form a band shape extending in the first direction. Respective connectors 30 are mounted to the first flexible printed circuit board 21 and the second flexible printed circuit board 22, and a fitting direction in which the connector 30 mounted to the first flexible printed circuit board 21 fits together with a mating-side connector differs from a fitting direction in which the connector 30 mounted to the second flexible printed circuit board 22 fits together with a mating-side connector.

Inventors:
TAKASE SHINICHI (JP)
DONG XUEQING (JP)
HIRAMITSU HIROOMI (JP)
SATO YUTO (JP)
Application Number:
PCT/JP2020/033042
Publication Date:
April 22, 2021
Filing Date:
September 01, 2020
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R12/77; H01M50/20; H01M50/50; H05K1/14
Domestic Patent References:
WO2010113455A12010-10-07
WO2011024477A12011-03-03
Foreign References:
EP3432409A12019-01-23
JP2015049931A2015-03-16
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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