Title:
WIRING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/143367
Kind Code:
A1
Abstract:
A wiring structure (10) is provided with the following: a fixed member (14); a movable member (12) which moves rectilinearly with respect to the fixed member (14); a wire material (16) that connects the movable member (12) and the fixed member (14) to each other; a movable guide (18) over which the wire material (16) is stretched, and which can move rectilinearly with respect to the fixed member (14); and a movement mechanism (20) that, in response to the rectilinear movement of the movable member (12), causes the movable guide (18) to moves rectilinearly in a direction that offsets the loosening or tightening of the wire material (16), such loosening or tightening caused by the rectilinear movement of the movable member (12).
Inventors:
SEYAMA KOHEI (JP)
UTANO TETSUYA (JP)
UTANO TETSUYA (JP)
Application Number:
PCT/JP2018/003472
Publication Date:
August 09, 2018
Filing Date:
February 01, 2018
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
B65H59/36; B65H51/20; B65H57/14; B65H59/38; H05K7/00
Foreign References:
| JPH0813948A | 1996-01-16 | |||
| JP2010110180A | 2010-05-13 | |||
| JP2010011283A | 2010-01-14 | |||
| JPH04140276A | 1992-05-14 |
Attorney, Agent or Firm:
YKI PATENT ATTORNEYS (JP)
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