Title:
WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/065601
Kind Code:
A1
Abstract:
The wiring substrate according to the present invention comprises an insulating layer located at the outermost layer, electrode conductors located on the surface of the insulating layer with a seed layer therebetween, a nickel layer which covers at least one of the electrode conductors and has a contact portion that contacts the surface of the seed layer, and a gold layer that covers the nickel layer. The nickel layer includes a plurality of voids in the contact portion, at least a portion of the voids have openings toward the contact portion, and a portion of the gold layer is located in the at least a portion of the voids.
Inventors:
HASEGAWA YOSHIHIRO (JP)
HIGASHIKAWA YASUHIRO (JP)
HIGASHIKAWA YASUHIRO (JP)
Application Number:
PCT/JP2020/035743
Publication Date:
April 08, 2021
Filing Date:
September 23, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H05K1/09; H05K3/24
Foreign References:
| JP2015216344A | 2015-12-03 | |||
| JP2001274545A | 2001-10-05 | |||
| JP2002185108A | 2002-06-28 | |||
| JP2002252447A | 2002-09-06 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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