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Patent Searching and Data


Title:
WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/065601
Kind Code:
A1
Abstract:
The wiring substrate according to the present invention comprises an insulating layer located at the outermost layer, electrode conductors located on the surface of the insulating layer with a seed layer therebetween, a nickel layer which covers at least one of the electrode conductors and has a contact portion that contacts the surface of the seed layer, and a gold layer that covers the nickel layer. The nickel layer includes a plurality of voids in the contact portion, at least a portion of the voids have openings toward the contact portion, and a portion of the gold layer is located in the at least a portion of the voids.

Inventors:
HASEGAWA, Yoshihiro (6 Takeda Tobadono-cho Fushimi-ku, Kyoto-sh, Kyoto 01, JP)
HIGASHIKAWA, Yasuhiro (6 Takeda Tobadono-cho Fushimi-ku, Kyoto-sh, Kyoto 01, JP)
Application Number:
JP2020/035743
Publication Date:
April 08, 2021
Filing Date:
September 23, 2020
Export Citation:
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Assignee:
KYOCERA CORPORATION (Fushimi-ku Kyoto-sh, Kyoto 01, JP)
International Classes:
H01L23/12; H05K1/09; H05K3/24
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (7-31 Otemae 1-chome, Chuo-ku, Osaka-sh, Osaka 91, JP)
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