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Patent Searching and Data


Title:
WORKPIECE CUTTING METHOD AND WORKPIECE CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/166259
Kind Code:
A1
Abstract:
The present invention relates to a method of cutting a workpiece with a wire saw, wherein: a wire guide has a plurality of grooves formed on the outer surface at a predetermined pitch along a rotation direction; the cross-sectional shape of the groove in the unused wire guide has an upper groove part which is located at least on the outer surface side of the wire guide and has facing groove walls forming a first opening angle (θ1), a lower groove part which is located below the upper groove part and has facing groove walls forming a second opening angle (θ2), and a bottom groove part which is located at a lower end of the groove; the first opening angle (θ1) and the second opening angle (θ2) have a relationship of θ1>θ2; the maximum value (W0, max) of the groove width of the lower groove part of the unused wire guide is equal to or larger than the wire diameter (φ0) of an unused wire; the minimum value (W0, min) of the groove width of the lower groove part of the unused wire guide is smaller than the wire diameter (φ0) of the unused wire; by using the unused wire and the unused wire guide, the unused wire comes into contact with the groove wall of the lower groove part of the unused wire guide and is installed while not being in contact with the bottom groove part; and the workpiece starts to be cut in a state in which the wire is not in contact with the bottom groove part. Accordingly, a method of cutting a workpiece is provided which can obtain a good and stable Warp value from the initial use of a wire guide while suppressing a reduction in production capacity.

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Inventors:
OGIHARA YASUNORI (JP)
KURIMOTO HIROTAKA (JP)
Application Number:
PCT/JP2020/001085
Publication Date:
August 20, 2020
Filing Date:
January 15, 2020
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO LTD (JP)
International Classes:
B24B27/06; B28D5/04; H01L21/304
Foreign References:
JP2001079748A2001-03-27
JP5362053B22013-12-11
JP2014161924A2014-09-08
JPH0970821A1997-03-18
EP2347845A12011-07-27
CN103395131A2013-11-20
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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