Title:
WORKPIECE CUTTING METHOD AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2020/230423
Kind Code:
A1
Abstract:
A workpiece cutting method according to the present invention is for simultaneously cutting a workpiece, by a wire saw, at a plurality of portions arranged axially by infeeding the workpiece held by a workpiece holding means with respect to wire rows which is formed by winding a fixed abrasive grain wire on a plurality of rollers with grooves, while supplying a coolant to the fixed abrasive grain wire and axially reciprocating the fixed abrasive grain wire, the cutting method being characterized in that the flow rate of the coolant is set to 180 L/min. or higher, and the traveling speed of the fixed abrasive grain wire in the axial direction is set to 6-30 m/min. after completion of cutting the workpiece and during pulling-out of the workpiece from the wire rows. Accordingly, it is possible to provide a workpiece cutting method that enables preventing the workpiece from being caught in the fixed abrasive grain wire to suffer a saw mark or preventing the fixed abrasive grain wire from being cut off, during the pulling-out of the cut workpiece from the fixed abrasive grain wire.
Inventors:
KOBAYASHI KENJI (JP)
Application Number:
PCT/JP2020/010008
Publication Date:
November 19, 2020
Filing Date:
March 09, 2020
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B23D61/18; B24B27/06; B24B55/02; B28D5/04; H01L21/304
Foreign References:
| JP2014179418A | 2014-09-25 | |||
| JP2010194706A | 2010-09-09 | |||
| JP2017148904A | 2017-08-31 | |||
| JPH01271159A | 1989-10-30 | |||
| JP2009142912A | 2009-07-02 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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