Title:
WORKPIECE CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/186087
Kind Code:
A1
Abstract:
The present invention is a workpiece cutting method that uses a wire saw in which a fixed abrasive-grain wire, which is sent out by one side of a set of wire reels and taken up by a wire reel on the other side and has abrasive grains fixed on the surface thereof, forms a wire row by being wound around multi-grooved rollers and, by delivering a workpiece to the wire row so that the wire row cuts into the workpiece while the fixed abrasive-grain wire is made to run back and forth in the axial direction, the workpiece is cut simultaneously at multiple spots adjacently positioned in the axial direction. Said workpiece cutting method is characterized in that prior to the start of workpiece cutting, an abrasive-grain abrasion step is performed wherein, by running the fixed abrasive-grain wire without cutting a workpiece, the fixed abrasive-grain wire is chafed against itself within the wire reels to dress the surface of the fixed abrasive-grain wire, and in the abrasive-grain abrasion step, the surface of the fixed abrasive-grain wire is dressed for at least 30 minutes. Provided thereby is a workpiece cutting method that can dress the fixed abrasive-grain wire easily and at low cost and limit unevenness in wafer thickness.
Inventors:
TOYODA SHIRO (JP)
Application Number:
PCT/JP2018/008451
Publication Date:
October 11, 2018
Filing Date:
March 06, 2018
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B53/00; B24B27/06; H01L21/304; B28D5/04
Foreign References:
| JP2016500341A | 2016-01-12 | |||
| JP2013058751A | 2013-03-28 | |||
| JP2015074037A | 2015-04-20 | |||
| JP2011020197A | 2011-02-03 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
Download PDF: