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Title:
WORKPIECE DOUBLE-SIDE POLISHING DEVICE AND WORKPIECE DOUBLE-SIDE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/021871
Kind Code:
A1
Abstract:
Provided are a workpiece double-side polishing device and workpiece double-side polishing method by which, during double-side polishing, double-side polishing can be finished at a time when the shape of the workpiece becomes a target shape. A calculation unit 13 performs a first step for classifying, for each workpiece, workpiece thickness data measured by a workpiece thickness measurement instrument 11, a second step for extracting, for each workpiece, a workpiece shape component from the thickness data, a third step for, regarding each extracted shape component, specifying a position in the workpiece radial direction on the measured workpiece, a fourth step for calculating a shape distribution of the workpiece from the specified position in the workpiece radial direction and the workpiece shape component, a fifth step for obtaining a shape index of the workpiece from the calculated shape distribution, and a sixth step for determining, as a time when workpiece double-side polishing is finished, a time when the obtained shape index for each workpiece becomes a set value of the shape index of the workpiece, the set value being determined on the basis of a difference between a target value and an actual value of the shape index of the workpiece in the previous batch. The double-side polishing is finished at the determined time.

Inventors:
KUBOTA MAMI (JP)
TAKANASHI KEIICHI (JP)
Application Number:
PCT/JP2019/022350
Publication Date:
January 30, 2020
Filing Date:
June 05, 2019
Export Citation:
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Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/08; B24B37/013; B24B49/04; B24B49/12; H01L21/304
Foreign References:
JP2015047656A2015-03-16
JP2017207455A2017-11-24
JP2018012166A2018-01-25
JP2018074086A2018-05-10
JP2006231471A2006-09-07
JPH07227756A1995-08-29
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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