Title:
WORKPIECE HANDLING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND USE OF WORKPIECE HANDLING SHEET
Document Type and Number:
WIPO Patent Application WO/2022/153878
Kind Code:
A1
Abstract:
A workpiece handling sheet 1 comprises: a substrate 13; an interface abrasion layer 12 laminated on one side of the substrate 13, and capable of interface abrasion through irradiation with laser light; and an adhesive layer 11 laminated on the surface side of the interface abrasion layer 12 opposite to the substrate 13, and composed of a curable film-like adhesive. According to the workpiece handling sheet 1, a small workpiece with a film-like adhesive can be obtained satisfactorily.
Inventors:
NISHIDA TAKUO (JP)
FURUNO KENTA (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
YAMAGUCHI SEITARO (JP)
FURUKAWA YOSHIKI (JP)
FURUNO KENTA (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
YAMAGUCHI SEITARO (JP)
FURUKAWA YOSHIKI (JP)
Application Number:
PCT/JP2021/048937
Publication Date:
July 21, 2022
Filing Date:
December 28, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B23K26/57; B32B7/023; B32B27/16; B32B27/18; C09J5/00; C09J7/38; C09J11/06; C09J133/00; C09J133/14; C09J201/00; F21S2/00; G09F9/00; H01L33/48
Domestic Patent References:
| WO2019207920A1 | 2019-10-31 |
Foreign References:
| JP2014515883A | 2014-07-03 | |||
| JP2020149985A | 2020-09-17 | |||
| JP2007250598A | 2007-09-27 | |||
| JP2010251359A | 2010-11-04 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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