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Title:
WORKPIECE HANDLING SHEET, METHOD FOR HANDLING SMALL WORKPIECE ITEM, DEVICE MANUFACTURING METHOD, AND USE OF WORKPIECE HANDLING SHEET
Document Type and Number:
WIPO Patent Application WO/2022/153877
Kind Code:
A1
Abstract:
[Problem] To provide a workpiece handling sheet with which it is possible to favorably handle even a very small workpiece item. [Solution] A workpiece handling sheet 1 is provided with a base material 11 and an interface ablation layer 12 that is laminated on one surface side of the base material 11, able to hold a small workpiece item, and undergoes interface ablation through irradiation with laser light. When the workpiece handling sheet 1 that has been subjected to first ultraviolet irradiation to perform irradiation with ultraviolet rays having a wavelength of 365 nm with a light amount of 190 mJ/cm2 is further subjected to second ultraviolet irradiation to perform irradiation with ultraviolet rays having a wavelength of 365 nm with a light amount of 950 mJ/cm2, the conversion efficiency with which the interface ablation layer 12 converts the light energy of the ultraviolet rays during the second ultraviolet irradiation into thermal energy is 60% or more.

Inventors:
FURUKAWA YOSHIKI (JP)
FURUNO KENTA (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
YAMAGUCHI SEITARO (JP)
Application Number:
PCT/JP2021/048936
Publication Date:
July 21, 2022
Filing Date:
December 28, 2021
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B23K26/57; B32B7/023; B32B27/16; B32B27/18; C09J5/00; C09J7/38; C09J11/06; C09J133/00; C09J133/14; C09J201/00; F21S2/00; G09F9/00; H01L33/48
Domestic Patent References:
WO2019207920A12019-10-31
Foreign References:
JP2014515883A2014-07-03
JP2010251359A2010-11-04
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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