WOVEN MESH SUBSTRATE WITH SEMICONDUCTORS, AND METHOD AND DEVICE FOR MANUFACTURING SAME

Title:

WOVEN MESH SUBSTRATE WITH SEMICONDUCTORS, AND METHOD AND DEVICE FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2012/026142

Kind Code:

A1

Abstract:

A method of manufacturing a woven mesh substrate with semiconductors (1), which embeds a plurality of globular semiconductor elements (3), having either a light-receiving or a light-emitting function, in a mesh-shaped woven substrate (2) having a plurality of insulating wires (21) being vertical threads and a plurality of conducting wires (22) being horizontal threads, comprises the steps of: forming gaps by using a heddle mechanism (53) to make a first vertical thread group (21a), including a plurality of vertical threads, and a second vertical thread group (21b), including a plurality of vertical threads positioned parallel to, and alternating with, the first vertical thread group, move up and down; using a shuttle mechanism (54) to supply the horizontal threads (22) into said gaps; beating the horizontal threads (22) with a reed mechanism (55); coating, with a conductive binder (49), a plurality of regions of the beaten horizontal threads which correspond to either some or all of the openings in the mesh (23); and embedding the plurality of globular semiconductor elements (3) corresponding to either some or all of the plurality of regions coated with the first conductive binder (49) in the preceding step, and connecting either a plurality of first electrodes (31) or second electrodes (31) respectively to the horizontal threads.

Inventors:

NAKATA JOSUKE (JP)

Application Number:

PCT/JP2011/052579

Publication Date:

March 01, 2012

Filing Date:

February 08, 2011

Export Citation:

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Assignee:

KYOSEMI CORP (JP)
NAKATA JOSUKE (JP)

International Classes:

H01L31/042; D03D1/00; D03D41/00; H01L33/00

Domestic Patent References:

WO2005041312A1	2005-05-06
WO2004001858A1	2003-12-31
WO2003094248A1	2003-11-13
WO2004001858A1	2003-12-31
WO2005041312A1	2005-05-06

Foreign References:

JPS6068507A	1985-04-19
US4691076A	1987-09-01
US5469020A	1995-11-21
JPH0916243A	1997-01-17

Other References: