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JP7456209B2 |
To provide a machine tool with a static pressure fluid support device that suppresses vibration of a movable body in two axial directions by adjusting the flow rate of a fluid supplied to a static pressure pocket according to a disturban...
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JP7455459B2 |
To provide a processing device that can properly obtain information on a workpiece.A processing device includes: a chuck table with a holding surface for holding a workpiece; a processing unit that processes the workpiece held by the chu...
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JP2024513425A |
Apparatus and methods for monitoring slurry accumulation are disclosed. The substrate polishing apparatus includes: a surface at least partially covered with a fluorescent material; a light source configured to illuminate the surface; an...
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JP7455014B2 |
To improve registration accuracy of a division schedule line.A control unit of a processing device comprises: a machine learning unit which processes an input image and determines whether the input image is an OK image or an NG image usi...
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JP2024039510A |
[Problem] It is possible to suppress the effort required for work required before processing. [Solution] The mounting method includes an accommodation step 1001 of accommodating a plurality of cutting blades in an accommodating tray in w...
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JP2024039395A |
The present invention provides a machine tool capable of correcting a center hole without removing a workpiece from the machine tool. [Solution] A machine tool 1 includes a center member 20 that can rotate integrally with a workpiece W, ...
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JP2024512254A |
The substrate cleaning system includes a cleaner module for cleaning the substrate after polishing the substrate, a dryer module for drying the substrate after cleaning by the cleaner module, from a first position within the dryer module...
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JP7452960B2 |
To provide a processing device equipped with a cleaning unit, which can sufficiently clean dirt adhering to a lower surface of a work-piece.Carrying-out means 5 comprises a carrying pad 50 that can move in horizontal and vertical directi...
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JP2024512203A |
The present invention discloses a method for detecting the interfacial tribochemical reaction between active metal or metal oxide abrasive grains and a diamond wafer substrate, and uses a magnetron sputtering method to spread active meta...
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JP7451948B2 |
To provide a processing quality prediction system that can predict a state of an affected layer generated in a work-piece, with higher accuracy.A processing quality prediction system 1 comprises: a grinder main body 11 that performs grin...
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JP7451949B2 |
To provide a processing quality prediction system that can predict a depth of an affected layer generated in a work-piece, with higher accuracy.A processing quality prediction system 1 comprises: a grinder main body 11 that performs grin...
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JP2024511716A |
The polishing method includes holding a substrate in contact with the polishing surface of a polishing pad using a carrier head, generating relative motion between the substrate and the polishing pad, and using a first modulation functio...
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JP7450630B2 |
A method and associated system provides automated abrasive paint repair using automated abrasive paint repair devices that selectively sand, buff, and polish a substrate in response to received instructions generated by a controller. The...
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JP7450392B2 |
To provide a butting device capable of determining a closing condition of a protection cover covering a cutting blade detection unit.A cutting device is equipped with a cutting blade detection unit 30. The cutting blade detection unit 30...
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JP7450460B2 |
To provide a wafer processing method that can thin a wafer while suppressing damage to the outer circumference of the wafer.A wafer processing method includes: a blade preparation step 1001 of preparing a cutting blade whose outer periph...
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JP7449709B2 |
To provide a new prism mechanism that enables an object to be photographed to be photographed from a position deviated at 90 degrees from the object by using a prism.A prism mechanism P, which changes an advancing direction of light, com...
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JP2024034111A |
An object of the present invention is to provide a method for forming a holding surface that can grind a wafer to a uniform thickness. [Solution] A spindle 24 on which an annular holding surface grinding wheel 60b is mounted is rotated, ...
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JP2024034720A |
An object of the present invention is to provide a method for dividing a package substrate that can reduce burrs generated around half-cut grooves without damaging the top surface of the package substrate. [Solution] A method for dividin...
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JP2024033324A |
An object of the present invention is to provide a measuring device and method for a wire saw that can easily and highly accurately measure the parallelism of a wire row using images taken by a camera and determine whether the parallelis...
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JP2024033597A |
An object of the present invention is to determine the usage status of an abrasive surface in a short time and with high accuracy. An abrasive surface determination device 30 includes a storage section 44, an output section 60, a class i...
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JP2024035050A |
The present invention provides a polishing head system that can precisely control the polishing rate of a substrate such as a wafer, especially the polishing rate at an edge portion. [Solution] A polishing head system 1 includes a polish...
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JP7446722B2 |
Provided is a grinding apparatus which is able to allow a user to replace a grinding wheel in a timely manner, and to perform dressing or the like to regenerate a surface of a grinding stone. According to the present invention, the grind...
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JP7447284B2 |
A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate i...
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JP7446873B2 |
To provide a cutting blade management system capable of managing a use state of a cutting blade.A cutting blade management system 1 used for a machining device includes at least code memory portions 110A, 110B, 110C that store codes of c...
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JP7446683B2 |
The present invention aims to provide a cutting apparatus which is able to definitely replace a cutting blade and prevent the occurrence of a processing fault. The cutting apparatus comprises: a cutting means which has a rotatable cuttin...
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JP7446714B2 |
There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatu...
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JP7446415B2 |
The present invention relates to a polishing tank (100) with a metal sleeve (110) and a removable insert modular system (120) configured to be inserted into said sleeve and to be removed from said sleeve.
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JP7445852B2 |
To provide a dicing device and a dicing method capable of stabilizing the dicing quality without being affected by the waviness of a work table surface and the variation in the thickness of a dicing tape.A dicing device (10, 10A) for dic...
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JP7445844B2 |
To provide a work machining device and a work machining method capable of suppressing reduction in throughput caused by correction of an end face of a flange.A work machining device has: a sensor 300 for detecting a state of an end face ...
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JP7446055B2 |
A method for multistep machining a cutting tool comprises the steps of defining a data set (12) of the cutting tool comprising target geometries of the cutting tool, parameters of materials of the cutting tool and/or parameters of proces...
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JP2024028891A |
The present invention provides a substrate polishing method that can improve the reliability of determining control parameters and detecting an end point, avoid insufficient polishing of a wafer, and reduce non-uniformity within the wafe...
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JP7442999B2 |
To provide a grinding unit that can rotate a grinding grindstone around a unique rotation axis different from a rotation axis of a tool spindle and a complex machining machine equipped with the same.The complex machining machine comprise...
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JP7443169B2 |
Accuracy of detection of a slip out of a substrate from a polishing head is improved. A substrate processing apparatus includes a polishing table 350 to which a polishing pad 352 for polishing the substrate is attachable, a polishing hea...
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JP2024509546A |
The chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head against the surface of the substrate in contact with the polishing pad, and generating relative motion between the platen and the ca...
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JP7441889B2 |
Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data ...
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JP2024027610A |
An object of the present invention is to provide a grinding device that can perform grinding according to the conditions of a grinding wheel. [Solution] A grinding device for grinding a workpiece, which includes a chuck table that holds ...
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JP2024509181A |
The polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, and a polishing pad configured to rotate the drum about a first axis par...
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JP2024026991A |
An object of the present invention is to provide a technique that can suppress a decrease in abnormality detection accuracy. An abnormality detection device 11 is a device for a grinding device 2 that performs a grinding process on a wor...
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JP2024509159A |
The method for removing material from a substrate consists of dispensing an abrasive slurry onto a polishing pad, memorizing an indication of the relative charge on the abrasive, and transferring the surface of the substrate to the polis...
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JP2024026983A |
An object of the present invention is to provide a technique that can suppress the occurrence of data drop in which sound data cannot be acquired. An abnormality detection device 11 is a device for a grinding device 2 that performs a gri...
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JP2024508936A |
Monitoring the operation of the polishing system involves acquiring a time-based series of reference images of components of the polishing system that perform operations during test operations of the polishing system, and equivalent imag...
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JP2024508932A |
Generating a strategy for a polishing process includes receiving a target removal profile including target thicknesses to be removed for angularly spaced locations around the center of the substrate and adjusting the substrate orientatio...
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JP2024026371A |
[Problem] A wafer re-grinding method that allows the target wafer to be easily changed from a wafer with an orientation flat to a wafer with a notch, or from a wafer with a notch to a wafer with an orientation flat, in a semiconductor ma...
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JP2024508913A |
A method for optimizing polishing is to use a coordinate measuring machine to measure the bottom surface of each retaining ring attached to a particular carrier head for each retaining ring of multiple retaining rings attached to a parti...
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JP2024025137A |
The present invention provides a grinding machine and a grinding method that can separately adjust machining allowances on both end faces of a workpiece. A grinding machine 1 includes a controller 50 that controls the respective position...
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JP2024025017A |
An object of the present invention is to provide an insulator manufacturing apparatus and an insulator manufacturing method that can reduce grinding defects. An index table 2 on which a plurality of insertion pins 21, 22, 23, and 24 that...
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JP2024025138A |
The present invention provides a grinding machine and a grinding method that can separately adjust machining allowances on both end faces of a workpiece. A grinding machine 1 includes a controller 50 that controls the respective position...
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JP7436701B2 |
This curve generator comprises two cup-type grindstones having different roughness, a retaining mechanism for retaining a workpiece to be processed by the grindstones, a measurement mechanism for measuring the shape of the grindstones at...
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JP2024024325A |
[Problem] To notify and alert a worker that polishing liquid or cleaning liquid is attached to the outside of a processing chamber. [Solution] A chuck table 10 that holds a wafer W on a holding surface, a polishing mechanism 20 that poli...
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JP2024024198A |
An object of the present invention is to provide an orientation detection device that can improve the visibility of the outer periphery of a workpiece. [Solution] An orientation detection device that detects the orientation of a non-circ...
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