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JP2001131828A |
To produce a thermosetting/thermoplastic fiber, such as a melamine fiber having improved properties while maintaining noncombustibility, heat resistance and flame resistance. This thermosetting/thermoplastic fiber is obtained by modifyin...
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JP2001127444A |
To provide a method for manufacturing a multilayer printed wiring board, that can prevent scattering of adhesion force between a prepreg and an inner-layer copper foil and the decrease in the adhesion force, when producing the multilayer...
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JP2001106869A |
To obtain an epoxy resin composition which is made to be fire retarding by a non-halogen-based fire retardant and shows excellent heat resistance and to prepare an insulation film for a printed wiring board showing an excellent sheeting ...
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JP2001106783A |
To obtain a new nonhalogen-based flame retardant curing agent capable of imparting a cured material of an epoxy resin excellent in flame retardancy, heat resistance and moisture resistance. This phenol resin composition is obtained by ca...
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JP3151546B2 |
PURPOSE: To manufacture at favorable productivity a ligneous board superior in water resistance and durability, by a method wherein in the case where a ligneous board is manufactured by a steam injection method, a resin composition in wh...
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JP3152701B2 |
PURPOSE: To provide the subject curing agent mainly composed of an aromatic hydrocarbon-modified phenol resin synthesized by reacting a specified phenolic compound with an aromatic hydrocarbon-formaldehyde resin in the presence of an aci...
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JP3152883B2 |
To obtain a phenolic resin composition capable of being quickly cured, having a good moldability and giving cured products excellent in toughness, mechanical characteristics and heat resistance. This phenolic resin composition comprises ...
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JP2001064480A |
To obtain the subject composition capable of shortening a curing time in molding without reducing characteristics of the cured product such as strength and the like by bringing the composition to contain a phenol novolak resin, hexamethy...
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JP2001064341A |
To obtain a modified phenolic resin having a low melt viscosity and high reactivity with an epoxy resin simply and stably in one step by mixing a heavy oil or a pitch with a specified concentration of a phenol and a specified concentrati...
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JP3145380B2 |
Mannich polyols of low viscosity and reduced reactivity are prepared by condensing a phenolic compound with formaldehyde and a mixture of diethanolamine and at least one other alkanol amine. The condensation product is the alkoxylated to...
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JP2001002914A |
To obtain a nonhalogen-based and nitrogen-based flame retardant without adversely affecting polyamide resins by composing the flame retardant of a compound prepared by reacting a specific triazine compound with phenols and formaldehydes ...
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JP2000344848A |
To provide a benzothiophene-containing aromatic oligomer excellent not only for use in an adhesive, a pressure-sensitive adhesive and a coating but also for use in modifying, e.g. an epoxy resin composition for an electronic material, an...
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JP2000319487A |
To obtain a phenol resin composition which gives a product, such as a laminate, excellent in cold punch resistance, silver through-hole properties, etc. by combining a phenol resin with a polyester resin which has, in its molecular chain...
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JP2000309679A |
To obtain an epoxy resin forming material capable of attaining flame retardant property with non-halogen and non-antimony, having a good molding property and excellent in reliability such as reflow resistance, moisture resistance and cha...
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JP2000309617A |
To provide phenol/amino condensed resin having especially excellent curability and excellent heat resistance, water resistance, flame retardance, strength, etc., and to provide a method for producing the phenol/amino condensed resin, cap...
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JP3107316B2 |
PURPOSE:To obtain a new high-performance condensate useful as water reducing agent of concrete, dispersant, etc., by reacting a bisphenol with an aldehyde and a sulfite or an amino acid or an aliphatic sulfonic acid containing amino grou...
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JP2000302846A |
To provide a flame-retardant epoxy resin composition for sealing semiconductors, which shows a low moisture absorption, an excellent solder resistance and a high flame retardance and generates no harmful halogen compound such as dioxin, ...
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JP2000290351A |
To obtain a curing agent used to give a cured product being excellent in heat resistance and humidity resistance and having low stress properties by using a phenol/alkylbenzene/aldehyde resin prepared by reacting an alkylbenzene/aldehyde...
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JP2000281865A |
To obtain a halogen-free curable resin composition imparted with sufficient flame-retardancy by including a polyphenylene ether resin, a benzoguanamine-modified phenolic resin and a phosphoric acid ester as essential components. The obje...
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JP2000281866A |
To obtain a heat-resistant phenolic resin composition giving a sliding part having high limit PV value and high normal limit temperature by including a specific heat-resistant phenolic resin, a specific fibrous inorganic filler, polytetr...
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JP3092103B2 |
A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60 DEG C, flowable under shear and self-adhesive at temperatures in the range 60-150 DEG C and hardenable at...
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JP3084238B2 |
To provide a compsn. having good toughness, weatherability, water resistance, etc., and comprising a polymer having hydroxyl groups at both terminals and obtd. from a wide variety of vinyl monomers including a polar vinyl monomer such as...
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JP2000219716A |
To produce an amino-modified phenol-aralkyl resin excellent in resistances to heat and water, flame retardance, strengths, etc., in high productivity and yield by reacting a phenolic hydroxy-containing compound with a triazine derivative...
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JP2000219798A |
To obtain a resin composition having excellent moldability and giving a molding excellent in flame retardancy and mechanical properties by compounding a thermoplastie resin with a novolak phenolic resin having a specified ratio of combin...
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JP2000212259A |
To obtain a partially allyl-etherified resin which is useful as a curing agent for an epoxy resin and gives a cured epoxy resin item having a high glass transition point by reacting a phenol compound, a xylylene compound, and an aromatic...
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JP2000178331A |
To provide an oil modified phenol resin excellent in flexibility, impact strength, and tracking resistance, and also in economy.Production method of this phenol resin suitable for a molding material is, first, a drying oil such as tall o...
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JP2000178332A |
To obtain an oxazine resin composition permitting improvement in the conditions for molding an oxazine resin and being capable of low- temperature curing by mixing a polyfunctional oxazine compound having a plurality of oxazine rings and...
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JP2000154235A |
To obtain a curing agent which can give a low-stress cured product excellent in heat resistance and humidity resistance by using a resin obtained by reacting an alkylbenzene/aldehyde resin with a phenol in a specified weight ratio in the...
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JP2000505493A |
PCT No. PCT/EP97/00981 Sec. 371 Date Aug. 28, 1998 Sec. 102(e) Date Aug. 28, 1998 PCT Filed Feb. 28, 1997 PCT Pub. No. WO97/31958 PCT Pub. Date Sep. 4, 1997Condensation products obtained by condensation of (A) a mixture consisting of (a)...
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JP2000103829A |
To provide a process for producing an aqueous composition containing a phenolic resin and desirably used in surface coating, which process is characterized in that the aqueous solution obtained by the process contains no organic solvent ...
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JP3025351B2 |
PURPOSE: To provide a liquid curing agent for formalin-based adhesive, composed of a strong acid ammonium salt, a strong acid (anhydride), an amino group- containing compound and hexamethylene tetramine, having long pot life at normal te...
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JP3008992B2 |
PURPOSE: To obtain a heat-resistant resin dust capable of keeping original friction coefficient, having excellent mechanical strength and useful for friction material, etc., by compounding a specific epoxy resin with a curable cyanic aci...
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JP2000019726A |
To provide a product excellent in photosensitivity, resolution and printing aptitude by containing a compound containing a specific diazonium group, and specific xylene resin at a specific ratio. This product contains xylene resin at the...
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JP2999371B2 |
PURPOSE: To obtain a cement-dispersing agent for improving the flow properties and fluidity retention by using a cocondensate between an aromatic compound bearing oxyalkylene groups, an aromatic compound bearing carboxyl groups and forma...
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JP2000001523A |
To obtain a resin composition which can give a cured product having improved water-resistant strength by incorporating an amino resin with resorcinol. 100 pts.wt. (in terms of the solid matter) amino resin obtained by reacting an amino c...
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JP2982817B2 |
The present invention relates to heat-reactive crosslinking agents for paint resin binders based on phenolic Mannich bases, obtainable by reacting A) one equivalent of a polyphenol with B) 0.5 to 2 equivalents of formaldehyde or a formal...
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JPH11315128A |
To obtain a novolak-type phenol-modified copoly (aromatic hydrocarbon/formaldehyde) resin having a short setting time and a high thermal hardness. This resin is obtained by reacting (A) a copoly (aromatic hydrocarbon/formaldehyde) resin ...
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JP2966899B2 |
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JPH11279248A |
To obtain a melamine/phenol co-condensation resin excellent in heat resistance, water resistance, flame-retardant property and strength, and to provide a method for productively producing the melamine/phenol co-condensation resin. This r...
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JPH11279247A |
To provide a method for producing a melamine/phenol co-condensation resin excellent in heat resistance, water resistance, flame-retardant property and strength. The characteristic of this method comprises; reacting 1 mol. of melamine, 1 ...
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JPH11269242A |
To obtain a phenol resin composition which cures fast, gas a good moldability and has a high toughness, vibration absorbing property/flexibility and heat stability. This composition is obtained by modifying with a boric acid or boron oxi...
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JP2952419B2 |
Flame-retardant and heat-resistant plastics are obtained by curing a curable resin which, at least partially, comprises a mixture of (a) a resin component which contains or comprises at least one thermocurable compound containing 1-oxa-3...
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JP2947652B2 |
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JPH11217416A |
To provide a thermosetting composition of a liquid dihydrobenzoxazine compound with a good operability which composition has a stable and uniform composition and a viscosity at 25°C of not more than 20,000 PS and does not emit volatile ...
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JP2929168B2 |
PURPOSE: To produce a low-viscosity polyol composition, containing nitrogen and useful for producing rigid polyurethane foams according to spray expansion, etc., by using water alone or water and a volatile physical foaming agent as a fo...
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JPH11209453A |
To improve mechanical properties, electrical characteristics and incombustibility by reacting a polyhydric phenol with a formalin compound and a primary amine in a specific ethylene glycol type compound as a solvent. A polyhydric phenol ...
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JPH11172073A |
To provide an alkaline binder which evolves less formaldehyde upon being sprayed onto glass fibers and is good in stability and quickly curable in an acidic region. From an initial phenol-formaldehyde resol resin containing 0.5-2.5% free...
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JP2910957B2 |
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JPH11140148A |
To obtain a condensate having low water absorptivity and improved heat resistance, adhesiveness, mechanical properties and filling properties by reacting a mixture of a specified bis(alkoxymethyl)biphenyl with diformylbiphenyl with a phe...
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JPH11106466A |
To easily produce the subject flame-retardant resin containing no halogen element by reacting a phenolic compound with an aldehyde and an aromatic amine in a solvent, and subsequently reacting the reaction product with an phosphoric acid...
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