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Patent Searching and Data


Matches 601 - 650 out of 3,010

Document Document Title
WO/2003/086751
The invention relates to a multi-layer, tubular packaging casing for filling with a pasty product. The inventive packaging casing has a significantly reduced permeability to steam and atmospheric oxygen.  
WO/2003/082947
A thermosetting resin composition comprising the following components (A) and (B); an adhesive comprising the thermosetting resin composition and an organic solvent and/or water; and adhesive films comprising the thermosetting resin comp...  
WO/2003/080699
A modifier for polylactic acid which comprises a block polymer (C) which has a glass transition temperature of 0°C or lower and comprises a polymer block (A) satisfying the relationship 7.80=$g(s)/$g(r)<8.54 (wherein $g(s) indicates the...  
WO/2003/076985
An optically compensating film comprising a polymer film having a retardation value Re ( &equals (nx - ny) x d) of 0 to 100 nm and a retardation value Rth (&equals {(nx + ny)/2 - nz} x d) of 70 to 500 nm, and an optically anisotropic lay...  
WO/2003/074601
Additives to organic conducting polymers are described which enhance adhesion and resolution of printed films while retaining adequate electrical conductivity. The conductive polymer films are useful in printing conductive portions of th...  
WO/2003/072680
Polymeric phosphors characterized by containing in the molecule structural units represented by the general formula (1) and having a molecular weight of 500 or above; a process for the production thereof; phosphorescent compositions cont...  
WO/2003/068837
The invention relates to epoxy resins having indole structures which are excellent in flame retardance, adhesion, moisture resistance, and heat resistance and favorably usable in lamination, molding, casting, bonding, or the like; indole...  
WO/2003/068842
A polymerizable composition which is significantly improved in coefficient of linear expansion, etc. while retaining intact excellent properties of norbornene resins, such as heat resistance and mechanical strength. The polymerizable com...  
WO/2003/067333
The invention pertains to a photo-sensitive composition which comprises a photochemical initiator, a polyacid or a salt thereof, and a poly(3,4-alkylenedioxythiophene) wherein the alkylene moiety is -(CH2)n-, n being an integer from 1 to...  
WO/2003/064531
Polymer compositions comprising poly-glycolic acid (PGA) or a functional derivative thereof with a tensile strength of at least 1200 MPa are disclosed. Processes suitable for manufacturing said compositions are also described, comprising...  
WO/2003/059984
The present invention provides a composition comprising: (a) thermosetting component comprising (1) optionally at least one monomer of Formula (I) as set forth below and (2) at least one oligomer or polymer of Formula (II) set forth belo...  
WO/2003/061029
The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, ...  
WO/2003/059964
The invention relates to a supramolecular polymer containing units which are linked by hydrogen bonds, said units being monomers or prepolymers comprising at least one function selected from functions (1) and (3) and a second function se...  
WO/2003/060979
The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond...  
WO/2003/057749
The present composition provides a composition comprising: (a) thermosetting component wherein the thermosetting component comprises monomer having the structure dimer having the structure or a mixture of the monomer and the dimer wherei...  
WO/2003/053721
Tyre for vehicle wheels, comprising at least one component made of a crosslinked elastomeric material, in which said component includes an elastomeric composition comprising: (a) at least one diene elastomeric polymer; (b) at least one c...  
WO/2003/054052
An aqueous dispersion of a copolymer of at least one 3,4−alkylenedioxythiophene compound with a solubility in water at 25°C of less than 2.2 g&sol L with at least one 3,4−alkylenedioxythiophene compound with a solubility in water at...  
WO/2003/052777
An organic NTC element composition which is obtained by mixing a conjugated organic semiconductor polymer with either a thermoplastic resin or a thermosetting resin. The amount of the thermoplastic resin or thermosetting resin is prefera...  
WO/2003/048227
A process for preparing an aqueous or non-aqueous solution or dispersion of a polythiophene or thiophene copolymer, containing structural units according to formula (I) in which R?1¿ and R?2¿ independently of one another represent hydr...  
WO/2003/048228
A method for preparing a composition containing between 0.08 and 3.0% by weight of polymer or copolymer of a 3,4-dialkoxythiophene in which the two alkoxy groups may be the same or different or together represent an optionally substitute...  
WO/2003/048229
Composition containing a polymer or copolymer of a 3,4-dialkoxythiophene and non-aqueous solvent A method for preparing a composition containing between 0.08 and 3.0% by weight of a polymer or copolymer of a 3,4-dialkoxythiophene in whic...  
WO/2003/040207
The present invention is directed to poly(dioxythiophene)/poly(acrylamidoalkylsulfonic acid) complexes and the oxidative polymerization process for making them. Aqueous dispersions of these poly(dioxythiophene)/poly(acrylamidoalkylsulfon...  
WO/2003/035713
A process for preparing a conjugated polymer, which comprises polymerising in a reaction mixture (a) an aromatic monomer having at least two boron derivative functional groups selected from a boronic acid group, a boronic ester group and...  
WO/2003/032696
A thermoplastic resin composition having a dielectric loss tangent of 0.01 or less at 1 kHz to 20 GHz, an Izot impact strength of 2 kJ&sol m or more, and a heat distortion temperature of 110 °C or more under 18.6 kgf load is formed on a...  
WO/2003/031505
A method for bonding a material to a first substrate surface that includes providing a catalyst at the first substrate surface and then contacting that surface with a material that undergoes a metathesis reaction to bond the material to ...  
WO/2003/029354
An organic semiconductor material which comprises a conjugated polymer and carbon nanotubes dispersed therein, the proportion of the carbon nanotubes being 3 wt.% or lower based on the conjugated polymer. The organic semiconductor materi...  
WO/2003/027203
This invention is directed to the synthesis of double-stranded conducting polymers, fonnulation for surface treatment reagents, and the use of water-borne double-stranded conducting polymers. The double-stranded conducting polymer provid...  
WO/2003/020504
The present invention relates to novel compositions comprising porous materials infused with polymers obtained from metathesis reactions, for example ROMP derived polymers and ADMET derived polymers. The invention further relates to cycl...  
WO/2003/018674
An intermediate for composite material molding which comprises carbon fibers and a resin composition containing a benzoxazine compound having, in the molecule, structural units I represented by the following structural formula (I), each ...  
WO/2003/011952
A low−permittivity and high−heat−resistance organic polymer film applicable to the insulation layer of a semiconductor device, a production method therefor, and a semiconductor device using it. A polyparaxylylene film including a p...  
WO/2003/011961
The present invention provides polymer blends having a first component of a polymeric material capable of being cross-linked and selected from the group consisting of an ethylene containing polymer, the first component present in an amou...  
WO/2003/007687
The present invention relates to a polymer-matrix material including a non-ionic solid matrix and a polymer, wherein the polymer is present on a surface of the non-ionic solid matrix and within an interior bulk of the non-ionic solid mat...  
WO/2003/000765
A non-dye containing flexographic ink containing a polymer or copolymer of a 3,4-dialkoxythiophene in which the two alkoxy groups may be the same or different or together represent an optionally substituted oxy-alkylene-oxy bridge, a pol...  
WO/2002/102566
Process for producing and storing a semi-finished product in strip form made of crosslinkable elastomeric material, which includes : - preparing an elastomeric composition ; - forming said elastomeric composition to obtain a semi-finishe...  
WO/2002/098974
A curable resin composition comprising 100 parts by weight of an alicyclic olefin polymer ingredient and 10 to 90 parts by weight of a thermosetting ingredient, characterized in that (1) at least one of the polymers constituting the alic...  
WO/2002/096804
Disclosed are processes for the recovery and purification of higher diamondoids from a hydrocarbonaceous feedstock. Specifically disclosed is a multi-step recovery process for obtaining diamondoid compositions enhanced in tetramantane co...  
WO/2002/083783
Product in subdivided form comprising: a) at least one additive for crosslinkable elastomeric compositions; and b) a thermoplastic binder comprising at least (i) one copolymer of ethylene with at least one aliphatic or aromatic $g(a)-ole...  
WO/2002/081488
The invention relates to novel organometallic compounds which are phosphorescence emitters. Such compounds can be used as active constituents (= functional materials) in a series of different applications which can be associated with the...  
WO/2002/080627
An electroluminescent device comprising a transparent or translucent support, a transparent or translucent first electrode, a second conductive electrode and an electroluminescent phosphor layer sandwiched between the transparent or tran...  
WO/2002/079316
An aqueous composition containing a polymer or copolymer of a 3,4-dialkoxythiophene in which the two alkoxygroups may be the same or different or together represent an optionally substituted oxy-alkylene-oxy bridge, a polyanion and a non...  
WO/2002/077078
A method for bonding a material to a fibrous substrate surface that includes providing a catalyst at the fibrous substrate surface, then contacting that surface with a material that undergoes a metathesis reaction and then bonding the fi...  
WO/2002/074854
Compositions and methods are described herein for use in packaging having improved moisture vapor barrier properties. In certain embodiments of the present invention, packaging articles can be made having improved oxygen barrier properti...  
WO/2002/069395
New precursors and processes to generate fluorinated poly(para-xylylenes) ('PPX') and their chemically modified films suitable for fabrications of integrated circuit ('Ics') of <0.15 µm are disclosed. The films so prepared have low diel...  
WO/2002/062889
A polyolefin resin composition which comprises (A) a polyolefin (I) obtained from at least one monomer selected among $g(a)-olefins, cycloolefins, and styrene and derivatives thereof, (B) a polyolefin (II) which is obtained from the at l...  
WO/2002/058139
Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, thermally conductive films in integrated circuit packaging, low-k dielectric layers in integrated ...  
WO/2002/057202
Higher diamondoids ranging from tetramantanes through undecamantanes are disclosed in isolated and enriched forms. Methods for obtaining these higher diamondoids are disclosed, as well.  
WO/2002/057201
Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as are intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.  
WO/2002/057203
Disclosed are compositions comprising C¿26?H¿30? hexamantane, referred to herein as peri-condensed hexamantane, fully condensed hexamantane, and cyclohexamantane. These enriched cyclohexamantane compositions comprise at least 5 percent...  
WO/2002/042352
The invention relates to dispersible polymer powders, the production and the use thereof by compounding the powder into molding compounds that preferably consist of polycarbonate, polyamide, polyurethane, polyacrylnitril or an polyalkylene.  
WO/2002/028966
A melt-moldable thermoplastic norbornene resin composition characterized by being obtained by compounding (A) a base polymer comprising a thermoplastic norbornene resin with (B) an olefin compound having a number-average molecular weight...  

Matches 601 - 650 out of 3,010