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JP2019119820A |
To provide an encapsulation film capable of encapsulating an electronic component by adding excellent followability to unevenness generated due to loading of the electronic component equipped with an electronic component loading substrat...
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JP2019519622A |
A polyester composition and a method for producing and using such a polyester are disclosed. In some embodiments, the polyester is formed from a monomer derived from a natural oil. In some embodiments, the polyester is a hyperbranched po...
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JP6542927B2 |
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JP2019516820A |
A polyester composition and a method for producing and using such a polyester are disclosed. In some embodiments, the polyester is formed from a monomer derived from natural oil.
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JP6531658B2 |
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JP2019089888A |
To provide a laminate having a liquid receiving layer which has good ink transferability, in other words, liquid development property and satisfies adhesiveness as a hot-melt adhesive, in printing represented by off-set printing, gravure...
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JP2019087471A |
To provide a bus bar and a laminated bus bar which are usable under high temperature environment.A bus bar has a conductor and an insulator covering the surface of the conductor, in which the insulator is an adhesive film that has a resi...
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JP2019085518A |
To provide a polyester adhesive composition which is less in haze variation even under high temperature and high humidity condition, and is also excellent in durability, a polyester adhesive, an adhesive sheet, and an optical member with...
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JP6516533B2 |
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JP6515808B2 |
Provided are reinforcing tape for a flat cable, which can maintain sufficient adhesive force for a long time in a high-temperature, high-humidity environment, and a flat cable that uses this reinforcing tape for a flat cable. The present...
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JP6515809B2 |
Provided are: a polyester resin composition for which no special device or base material is required and which has excellent adhesiveness, heat and humidity resistance, and corrosion resistance; and an adhesive composition in which said ...
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JP6506756B2 |
An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. A...
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JP6504051B2 |
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JP6500440B2 |
The present invention is a copolymerized polyester resin which contains a dicarboxylic acid component and diol components as constituting components, wherein greater than or equal to 90 mol % of terephthalic acid is contained as the dica...
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JP6494264B2 |
A surface protective pressure-sensitive adhesive sheet being less staining, less likely to trap air bubbles, and attachable by hand and having good wetting ability on an adherend and having an appropriate level of adherability and light ...
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JP2019038944A |
To provide a biodegradable polyester resin which exhibits excellent appearance of a laminate obtained when used in an adhesive layer between a PVA resin and a polylactic acid.The biodegradable polyester resin contains 0.01 to 500 ppm of ...
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JP6483585B2 |
An object of the present invention is to provide a polyarylate resin having an adequate ultraviolet-absorbing property and an adequate dissolving property in an organic solvent, which is excellent in a solution stability even when it is ...
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JP2019026650A |
To provide an adhesive composition for bonding a convex face of a base sheet [I] to a flat face of a base sheet [II], the adhesive composition having excellent adhesiveness, and a laminate comprising the same.The present invention provid...
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JP2019023277A |
To provide a polyester-based adhesive which is excellent in characteristics of adhesive force, heat resistance, holding power, and transparency and is used for labels, adhesive tapes or sheets, and the like.The adhesive contains a polyes...
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JP6465788B2 |
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JP6461001B2 |
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JP2019502012A |
Predominantly bio-sourced polymer compositions that can be used as hot melt adhesives. The polymer formulation has the following structure: [Chemical 1][During the ceremony, G1And G2Independently (CH2)xThe variable x is an integer from 1...
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JP6457078B2 |
The present invention provides: a reinforcing tape which has an excellent conductor-adhesive property and can prevent troubles such as a peeling from a conductor when terminals of the conductor are processed by gold plating or the like, ...
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JP2019006100A |
To provide a thermal transfer sheet that has sufficient adhesion to both a transfer-receiving body made of a polyethylene terephthalate resin and a transfer-receiving body made of a polypropylene resin.A thermal transfer sheet 10 compris...
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JP2019006925A |
To provide a pressure-sensitive adhesive that improves processability when an adhesive film is produced and less likely causes rising or peeling from an adherend after exposed to a high temperature environment or high temperature and hig...
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JP6451267B2 |
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JP6443823B2 |
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JP6443343B2 |
The film for temporary fixing of the present invention is a film for temporary fixing which is used in a processing method of a semiconductor wafer, the method including a temporary fixing step of temporarily fixing the semiconductor waf...
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JP6439962B2 |
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JP2018193537A |
To provide a polyester-based adhesive which is excellent in characteristics such as adhesive force, heat resistance, holding power and transparency and is used for a label, an adhesive tape, a sheet or the like.There is provided an adhes...
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JP6428656B2 |
To provide a laminated polyester film which can be suitably used in various applications requiring good adhesive characteristics and ultraviolet absorption, for instance, applications such as a surface protective film used in scratch pre...
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JP6428662B2 |
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JP6428878B2 |
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JP6428879B2 |
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JP6428028B2 |
The purpose of the present invention is to provide an adhesive composition that has excellent post-hardening heat resistance, appearance, flame retardancy, and electrical characteristics. The adhesive composition according to one embodim...
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JP6424621B2 |
Provided are a polyester resin aqueous dispersion composition and a bonding agent composition incorporating same. The polyester resin aqueous dispersion composition demonstrates excellent adhesion to a variety of substrates such as texti...
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JP6423459B2 |
The invention relates to a two- or multi-component system having: at least one polyester component 1 which comprises: i) at least one unsaturated polyester; ii) at least one ethylenically unsaturated monomer; iii) at least one inorganic ...
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JP6419376B1 |
To provide a manufacturing method capable of easily preparing a polylactic acid-based hot melt adhesive having thermal stability that can withstand practical use. A method for producing a polylactic acid-based hot melt adhesive. (1) At a...
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JP6417722B2 |
To provide an electrochemical element electrode conductive adhesive composition that can form a conductive adhesive layer having a sufficient wettability to a current collector as well as having a high adhesiveness between the electrode ...
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JP6418197B2 |
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JP6420062B2 |
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JP6416450B1 |
It contains 100 parts by mass of polyester resin (A), 0.1 to 5 parts by mass of silane coupling agent (B), and 1 to 5 parts by mass of isocyanate compound (C), and the polyester resin (A) has a glass transition temperature. A polyester r...
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JP6412747B2 |
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JP2018159929A |
To provide an optical member using an optical member surface protective film that has good adhesive characteristics while suppressing charging by peeling or friction, reduces squeeze-out of an adhesive by cutting, and can be suitably use...
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JP2018154004A |
To provide a laminated film excellent in adhesibility between a substrate layer and a hard coat layer, and excellent in adhesiveness between layers under high temperature and high humidity.The laminated film is provided which has a subst...
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JP6400070B2 |
A hot melt adhesive (HMA), which is solid at room temperature, comprises the reaction product of 5 to 25% by weight of an isocyanate component having an NCO content of from about 20 to about 50% by weight, 75 to 85% by weight of a polyes...
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JP6396062B2 |
Provided are a polyester-based pressure-sensitive adhesive composition having high wetting ability and superior adherability and light peelability, and a pressure-sensitive adhesive sheet produced with such a pressure-sensitive adhesive ...
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JPWO2017090440A1 |
A film-like resin composition that is interposed between the opposing electrodes and electrically connects the opposing electrodes, and the cured product of the resin composition has a glass transition temperature of 150 to 350 ° C. , A...
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JP6380710B1 |
An adhesive composition with a high degree of moisture and heat resistance that can be used for lead-free soldering under high humidity while maintaining good adhesion to various plastic films, metals such as copper, aluminum, and stainl...
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JP6383158B2 |
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