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WO/2013/038966A1 |
Provided is a dicing sheet substrate film which, without requiring additional physical energy such as an electron beam or gamma rays, can reduce dicing debris generated during dicing of an object being cut. This dicing sheet substrate fi...
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WO/2013/034305A1 |
The present invention is directed to a pressure sensitive adhesive obtainable by reacting a) a polycondensate obtainable from a1) a furan derivative and a2) a dimer of a fatty alcohol, a dimer of a fatty acid and/or ester thereof, a dime...
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WO/2013/034867A1 |
A compound of formula (I), in which: R = H, CH3 or CH2-CH3, R' and R" = H, CH3, CH2-CH3 or trimethylcyclohexane, n is an integer between 4 and 8, preferentially between 5 and 6, y + x > 0, a + b > 0.
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WO/2013/036369A1 |
This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and...
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WO/2013/031678A1 |
Provided is a curable resin composition exhibiting high adhesion durability. The curable resin composition contains: a (meth)acrylate oligomer (A) selected from the group consisting of urethane-based (meth)acrylate oligomers, polyester-b...
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WO/2013/030136A1 |
The present invention relates to a curing agent for moisture-curing compositions which comprises at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated ...
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WO/2013/029131A1 |
"PROCESS FOR MANUFACTURING PLANT RESIN-BASED ADHESIVE, AND PLANT RESIN-BASED ADHESIVE", wherein the present process is based on the use of crude glycerin from the step of transesterification found in the manufacturing process of biodiese...
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WO/2013/029889A1 |
A two part non-sag polyurethane construction sealant or adhesive is provided with the properties of low modulus, high elongation, good paint adhesion, and primerless adhesion to concrete surfaces. The sealant or adhesive is prepared usin...
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WO/2013/027489A1 |
The present invention addresses the problem of providing a urethane resin composition for forming a surface skin layer of a leather-like sheet, said urethane resin composition enabling the formation of the surface skin layer which has an...
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WO/2013/027609A1 |
The present invention addresses the problem of providing: a resin composition for adhesives, which is mainly composed of a resin having excellent adhesive power or excellent oxygen barrier properties; and an adhesive which is obtained by...
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WO/2013/027657A1 |
An adhesive composition is obtained by blending a crosslinking agent and an organic acid into an acrylic resin that is a copolymer of the components (A-1)-(A-3) described below, and the adhesive composition is formed into a sheet shape, ...
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WO/2013/026654A1 |
The invention relates to cross-linkable materials containing (A) 100 parts by weight of compounds (A) of formula Y- [ (CR1 2)b-SiRa(OR2)3-a]x (I), (B) more than 50 parts by weight of silicone resins containing units of formula R3 c(R4O)d...
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WO/2013/023545A1 |
The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is b...
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WO/2013/013598A1 |
The present invention relates to an adhesive composition, which comprises, based on the total weight of the adhesive composition: (1) from 38.0 to 75.0 percent by weight of a urethane oligomer carrying (meth)acryloyloxy group; (2) from 0...
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WO/2013/013590A1 |
The present invention relates to an optically clear liquid adhesive composition and the use thereof. The composition comprises at least one of the following components (a) and (b): (a) 10 to 80 parts of one or more aliphatic polyether ur...
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WO/2013/014837A1 |
Provided are: an aqueous polyurethane resin composition having excellent adhesiveness to synthetic resins, and tackiness and blocking resistance after application, said composition having (A) a polyol, (B) a polyisocyanate, (C) a hydroph...
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WO/2013/011825A1 |
The purpose of the present invention is to provide an adhesive composition which can be processed by a dry lamination method and which is applicable to battery packaging materials that are required to have excellent electrolyte solution ...
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WO/2013/012037A1 |
The present invention addresses the problem of providing: an organic solvent-borne two-pack curable adhesive composition for laminates, which has both pot life stability and fast curing properties even with high solid content by being pr...
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WO/2013/008455A1 |
Provided is a solar cell backside protective sheet which has excellent long-term reliability and moist heat resistance, and has excellent adhesiveness in low-temperature environments, and also has low cost and excellent coating propertie...
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WO/2013/005767A1 |
The present invention relates to a multilayer film having gas barrier properties, an adhesive, and a coating material, and further relates to a polyester resin composition that makes it possible to provide the multilayer film having gas ...
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WO/2013/004023A1 |
Disclosed are a sealant of a liquid crystal panel and a modification method thereof. The sealant includes modified epoxy resin which is generated by a cross-linking cure reaction of a tri-functional terminal isocyanate monomer and epoxy ...
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WO/2013/006562A1 |
A flexible molded element affixed to a sidewall of a tire. The molded element includes a top surface with an exposed area, and a bottom surface including an area in contact with a surface portion of the tire sidewall. The molded element ...
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WO/2013/002489A2 |
The present invention relates to an adhesive composition, and a polarizing plate and a liquid crystal display device including the same, and more specifically to an adhesive composition, and a polarizing plate and a liquid crystal displa...
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WO/2012/171777A1 |
The invention relates to a 2-component polyurethane adhesive consisting of a component A, which contains a polymer having two to ten groups with an acidic H atom and a component B which contains a reaction product produced from (i) trime...
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WO/2012/173066A1 |
Provided is a light-diffusing adhesive composition comprising an acrylic resin and spherical microparticles, wherein the difference between the refractive index of the acrylic resin and the refractive index of the spherical microparticle...
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WO/2012/173182A1 |
The present invention addresses the problem of providing a two-pack curable adhesive composition for laminating which can be applied even when having a nonvolatile content of 50 mass% or higher and which has excellent laminating properti...
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WO/2012/169535A1 |
Disclosed is a film-shaped circuit connecting material including: an adhesive component having an adhesive layer placed between opposing circuit electrodes and used in order to electrically connect the circuit electrodes, the adhesive la...
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WO/2012/168233A1 |
The present invention relates to adhesives on the basis of silane-modified polymers and to substrates coated therewith and connected thereto.
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WO/2012/168234A1 |
The present invention relates to polyurethane polymers, to a method for the production thereof, and to the use thereof as binding agents for adhesives, coatings, or foams.
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WO/2012/161337A1 |
An object of the present invention is to provide a moisture-curable hot melt adhesive which has high initial adhesive strength and is also excellent in heat resistance. Disclosed is a moisture-curable hot melt adhesive including a uretha...
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WO/2012/162641A2 |
The present invention provides peelable floor surface coating systems and methods for producing the same.
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WO/2012/160916A1 |
The present invention provides an adhesive composition which comprises a polyurethane resin and a thermosetting component and which exhibits a flow of 500μm or more in B-stage at 120°C and a flow of less than 500μm in C-stage at 120°...
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WO/2012/162640A2 |
A coating system for a surface (such as a floor) including a liquid adhesive layer composition including a heat-activated adhesive that forms an adhesive layer upon drying after application to a surface, and a liquid maintenance layer co...
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WO/2012/158664A2 |
Two-part polyurea-urethane adhesive compositions comprising a Part A prepolymer component having an isocyanate component comprising polymeric isocyanate and an oligomer content greater than 15 weight percent, polyol having a molecular we...
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WO/2012/157627A1 |
The present invention relates to a curable heat-dissipating composition comprising (A) a urethane resin having a carboxyl group and produced by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol compound and (c) a dihydroxy...
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WO/2012/157630A1 |
A provided is a pressure-sensitive adhesive composition for an optical component, which is obtained by formulating (d) 0.12 to 1 parts by weight of an isocyanate based curing agent having an isocyanurate skeleton as a curing agent, relat...
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WO/2012/154940A1 |
An adhesive composition that includes: one or more polyester polyether copolymers of formula I:[Formula should be inserted here] wherein Nu is a predominately cyclic nucleus and R1 is randomly selected from either a C2-6 alkylene or an a...
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WO/2012/151085A1 |
A composition comprising: a) one or more isocyanate functional prepolymers; and b) one or more compounds containing one or more hydroperoxide groups; wherein components a) and b) are kept separate until cure is desired. The composition c...
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WO/2012/151151A1 |
Pressure sensitive adhesives for use primarily in medical applications are disclosed. The pressure sensitive adhesives are urethane elastomeric adhesives that include a polyurethane polymer and a compatible tackifier and/or compatible pl...
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WO/2012/151086A1 |
The present invention is a composition comprising: a) one or more isocyanate functional prepolymers, optionally containing free acrylate groups; b) one or more compounds containing a cycloaliphatic tertiary amine; c) one or more compound...
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WO/2012/144329A1 |
Provided are: a resin composition which has excellent adhesion to bases under wet heat conditions; a two-pack type adhesive for laminates, which contains the resin composition; a multilayer film which has a layer that is composed of the ...
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WO/2012/144351A1 |
Provided is a novel surface-protecting film that exhibits sufficiently high wettability even without the use of a plasticizer, prevents the formation of stop marks, and exhibits excellent reworkability. This surface-protecting film has a...
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WO/2012/144349A1 |
Provided is a novel surface-protecting film that exhibits excellent reworkability and, even without the use of a plasticizer, exhibits sufficiently high wettability. This surface-protecting film has a base layer and a pressure-sensitive ...
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WO/2012/144350A1 |
Provided is a novel surface-protecting film that exhibits excellent reworkability and, even without the use of a plasticizer, exhibits sufficiently high wettability. This surface-protecting film has a base layer and a pressure-sensitive ...
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WO/2012/139940A1 |
The invention relates to a crosslinkable composition containing reactive polymers selected from among (i) prepolymers having reactive NCO groups or (ii) polymers which have reactive silane groups, optionally further additives and at leas...
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WO/2012/141275A1 |
[Problem] The purpose of the invention is to provide an active energy ray-curable adhesive composition with which adhesiveness to a substrate is excellent, there is little warping over time of the resulting laminate, and there is little ...
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WO/2012/141030A1 |
The present invention is an epoxy resin composition comprising: an epoxy resin (A); a urethane resin (B) in which the terminal isocyanate of the urethane pre-polymer is blocked by at least one of an ε-polycaprolactam, an oxime, or a pyr...
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WO/2012/142148A1 |
Adhesive compositions using modified diphenylmethane diisocyanate are disclosed along with methods and articles using the adhesive compositions. The adhesive compositions are especially suited for making flexible laminates for use in foo...
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WO/2012/132520A1 |
The present invention relates to a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer on at least one surface of a backing, wherein: the pressure sensitive adhesive layer has a two-layer configuration of a first...
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WO/2012/133418A1 |
The issue of the present invention is to provide an adhesive tape for processing semiconductor wafers and the like, with which a quantity of an adhesive left on the surface of a material that has had a tape adhered thereon can be suffici...
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