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JP6981846B2 |
To provide a heat sink of low thermal expansion and high thermal conductivity, which is made of a clad material in which a Cr-Cu composite layer and a Cu layer are laminated, and in particular, a heat sink excellent in thermal conductivi...
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JP6979184B2 |
To provide an alloy made of a multicomponent system having high strength and high ductility.Provided is an alloy made of a multicomponent system containing titanium, zirconium, niobium and tantalum and further including at least one kind...
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JP6977021B2 |
Provided are a flaked tantalum powder and method for preparation thereof; said flaked tantalum powder contains 300-1800ppm of nitrogen, 10-100ppm of phosphorus, and 1-40ppm of boron. The flaked tantalum powder has high capacity and low l...
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JP6965181B2 |
The purpose of the present invention is to provide an alloy product which has both of high corrosion resistance enough to withstand severe corrosive/high-temperature environments and mechanical properties equivalent to or better than tho...
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JP6960718B2 |
A solid electrolytic capacitor that comprises an anode that comprises a porous anode body and a dielectric layer is provided. The anode body is formed from a pressed and sintered valve metal powder having a specific charge of about 200,0...
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JP6954491B2 |
An object is to provide an alloy composition that has a sufficient melting point for casting of an aluminum alloy, also has high hardness, and can suppress an occurrence of galling. The alloy composition of the present invention includes...
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JP2021527162A |
The present invention relates to molybdenum-silicon-boron based, density-optimized, high temperature resistant alloys in which vanadium is alloyed with the base alloy to reduce the density.
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JP6945622B2 |
The present invention relates to a method and an apparatus for coating large area solid substrates with metal based alloys or compounds by contacting the substrate surface with an unoxidised metal powders formed by in situ reaction of a ...
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JP6943992B2 |
Provided are a molybdenum alloy target, a method of preparing the same, and a molybdenum alloy layer. The molybdenum alloy target includes molybdenum and a first additive metal, the first additive metal contains rhenium, ruthenium or a c...
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JP6946539B1 |
To provide a high-purity niobium powder, a member for producing niobium powder, a method for producing these, and a method for producing a niobium member, which can be used for manufacturing a member by a 3D printer. The contents of Mg, ...
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JP2021152203A |
To provide a sputtering target capable of suppressing a formation of a silicon oxide or a silicon nitride due to a contamination of an impurity silicon element in the sputtering target, suppressing a reduction in an electrical conductivi...
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JP6934878B2 |
A method for producing a multifilament NbsSn superconducting wire comprising:- packing a plurality of Cu encased Nb rods within a matrix which is surrounded by an intervening Nb diffusion barrier and a further matrix on the other side of...
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JP2021127494A |
To provide a Cr-Al alloy sputtering target that has reduced variations in Al content and prevents occurrence of abnormal discharge during sputtering.The present disclosure provides a Cr-Al alloy sputtering target of a sintered body conta...
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JP6930051B2 |
To provide a versatile coating tool which exhibits an excellent corrosion resistance to a coating liquid of strong acidity to weak alkalinity simultaneously with an abrasion resistance.In a coating tool mounted on coating equipment, at l...
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JP2021123750A |
To provide a Cr-Ni alloy member having excellent corrosion resistance and abrasion resistance and having mechanical characteristics, and to provide a method for producing the Cr-Ni alloy member.There is provided a Cr-Ni based alloy that ...
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JP6919814B2 |
Provided is a target material which suppresses contamination of a gate electrode during sputtering and which is used to form a gate electrode capable of achieving stable TFT characteristics. This target material contains a total of 50 at...
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JP6913281B2 |
To provide a MoW target material capable of forming a MoW alloy thin film capable of acquiring a stable TFT characteristic by suppressing deviation of a film composition.There is provided a MoW target material having a composition contai...
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JP6914251B2 |
A method for producing nanoplates derived from a layered material, includes the steps: (a) mixing particles of said layered material with a carrier liquid to form a dispersion of said particles in said carrier liquid; (b) pressurizing th...
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JP6910406B2 |
A monofilament (100) for producing an Nb3 Sn-containing superconductor wire (33) includes a powder core (1) with an Sn-containing powder, a reaction tube (3) composed of an Nb alloy that includes Nb and at least one further alloy compone...
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JP2021102815A |
To provide a method for producing a non-metallic feedstock powder suitable for reduction to a metal having a homogeneous and controlled chemical quantity in a narrow range.A method of producing a non-metallic feedstock powder suitable fo...
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JP6904034B2 |
A soft magnetic powder has a composition represented by Fe100-a-b-c-d-e-fCuaSibBcMdM′eXf (at %) (wherein M is at least one element selected from the group consisting of Nb and the like, M′ is at least one element selected from the gr...
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JP6899397B2 |
A method of producing a magnetic material of compound having magnetocaloric effect is disclosed. The method may include producing a product by reacting a raw material that is to constitute the magnetic material in melt including an alkal...
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JP6895259B2 |
The present invention concerns substrates coated with an Mo1-x-ySiXBY layer, said layer comprising the T2 phase, and a method for the production thereof.
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JP6892914B2 |
The invention concerns a timepiece component containing a high-entropy alloy, the high-entropy alloy containing between 4 and 13 main alloying elements forming a single solid solution, the high-entropy alloy having a concentration of eac...
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JP6886911B2 |
To provide a molybdenum material small in warpage.A molybdenum material has a thickness of 3 mm or more, a surface roughness Rz of 1.2 μm or less, a warpage of 0.3 μm/mm or less, and a warpage after annealing at 2200°C of 1 μm/mm or ...
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JP2021086937A |
To provide a heat sink material that can achieve both thermal conductivity and thermal expansion without problems in terms of stable supply and high cost, and that has a high degree of freedom in shape, and a method for manufacturing the...
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JP2021086938A |
To provide a heat sink material that can achieve both thermal conductivity and thermal expansion without problems in terms of stable supply and high cost, and that has a high degree of freedom in shape, and a method for manufacturing the...
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JP6879162B2 |
To provide a hydrogen storing alloy particle excellent in discharge characteristic when electric current density is enhanced.There is provided a hydrogen storing alloy particle containing Ti, Cr, V, and 5 at.% to 10 at.% of Ni, having a ...
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JP2021080524A |
To provide an alloy film having excellent environmental resistance even when being subjected to an environment where corrosion and wear act thereon simultaneously, and to provide a heat transfer pipe including the alloy film and a method...
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JP6878409B2 |
The present invention provides: a tungsten-containing metal production method that includes simple steps and that enables lowering of impurities content; and a tungsten-containing metal. A tungsten-containing raw material, silicon and/or...
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JP2021075737A |
To provide a Cr-based alloy-added product that has high density and a low thermal expansion property comparable to that of an Fe-36%Ni alloy and a method for producing the same, as well as a method for producing Cr-based alloy powder.A C...
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JP2021075736A |
To provide a Cr-based alloy-added product that has high density and a low thermal expansion property comparable to that of an Fe-36%Ni alloy and a method for producing the same, as well as a method for producing Cr-based alloy powder.A C...
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JP6871524B1 |
To provide a laminated bonding material, a semiconductor package and a power module capable of alleviating strain generated in a bonding portion particularly in a high temperature environment. In a laminated bonding material 10, the coef...
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JP6866964B1 |
Provided are a product provided with a Ni-based alloy, a Ni-based alloy powder, a Ni-based alloy member, and a Ni-based alloy member that can be melt-solidified and have excellent corrosion resistance and abrasion resistance. By mass%, i...
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JP6858140B2 |
A container includes at least two interconnected parts which are connected to one another at least in some regions by a thermally sprayed layer. At least one part is formed of a refractory metal or a refractory metal alloy. The container...
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JP6860300B2 |
To provide a light-weight tungsten alloy that is more lightweight than the conventional one while maintaining high temperature characteristics possessed by the conventional rhenium tungsten alloy and when applied to an industrial tool or...
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JP6855614B2 |
To provide a sputtering target material comprising a sintered alloy having high mechanical strength (in particular, high toughness suitable for a sputtering target material).The sputtering target material comprises a sintered alloy conta...
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JP6842345B2 |
A wear-resistant iron-based sintered alloy made of a mixed powder including first hard particles, second hard particles, graphite particles, and iron particles is produced. The first hard particles are Fe—Mo—Ni—Co—Mn—Si—C all...
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JP2021508760A |
Coatings are described herein. The coating can, for example, catalyze the gasification of carbon. In some examples, the coating has a first thickness, a first region containing manganese oxide, chromium manganese oxide, or a combination ...
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JP6841441B2 |
[Problem] To provide a Mo-Si-B alloy having more excellent high-temperature strength characteristics, a method for manufacturing a Mo-Si-B alloy, and a tool for friction stir welding applicable to an Ni-based superalloy and a Ti alloy. [...
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JP6840904B1 |
The present invention provides a tungsten alloy wire having sufficient X-ray impermeableness, an adjustable Young's modulus, and easy bonding between the wires or other materials, and a medical device using the tungsten alloy wire. That ...
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JP2021025123A |
To provide a heat-generating body that does not distort the heat-generating body even when the heat-generating body is immersed in fresh water or the like.Provided is a heat-generating body containing, for chromium iron and indium or nic...
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JP6829313B2 |
A tantalum powder having a value of hydrogen (H) content (ppm) of the tantalum powder divided by Brunauer-Emmett-Teller (BET) surface area (m2/g) of the tantalum powder (H/BET) is greater than 100 is provided. The tantalum powder can be ...
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JP6827683B2 |
To provide an iron-based sintered alloy-made valve sheet for internal combustion engine having excellent abrasion resistance and excellent dropout resistance, and a manufacturing method therefor.There is provided a valve sheet having a s...
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JP2021011628A |
To provide a powder alloy that can ensure predetermined hardness as welded in build-up welding.A powder alloy has a composition comprising, by mass%, C: 0.005-0.50%, Si: 0.10-0.50%, Mn: 0.01-0.50%, Cr: 30-50%, Al: 3.5-6.0%, Fe: 20% or le...
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JP6823799B2 |
The present invention provides a laminate wiring layer for an electronic component, having a conductive layer consisting of Al and Al alloy and a novel coating layer capable of securing adhesiveness, corrosion resistance and oxidation re...
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JP6824045B2 |
To provide a Nb-Si based alloy product having more excellent characteristics than the conventional one, to provide a method for manufacturing the product and to provide a heat engine using the product.The Nb-Si based alloy product has a ...
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JP6824320B2 |
To provide, in relation to the rare metal smelting field, particularly a tantalum powder for preparing capacitors, a process for preparing the tantalum powder, and a sintered anode prepared from the tantalum powder.As to the tantalum pow...
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JP6820084B2 |
The present invention provides a thermoelectric module comprising: plural thermoelectric elements comprising thermoelectric semiconductor; an electrode for connecting between the plural thermoelectric elements; and a joining layer for jo...
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JP6814758B2 |
The present invention addresses the problem of providing a target material (2) that is not prone to cracking during sputtering, and in order to solve this problem, the present invention provides a sputtering target material (2) including...
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