Title:
熱電モジュール
Document Type and Number:
Japanese Patent JP6820084
Kind Code:
B2
Abstract:
The present invention provides a thermoelectric module comprising: plural thermoelectric elements comprising thermoelectric semiconductor; an electrode for connecting between the plural thermoelectric elements; and a joining layer for joining the thermoelectric element and electrode, positioned between each thermoelectric element and electrode, wherein the thermoelectric module further comprises a barrier layer comprising Cu-Mo-Ti alloy, positioned between the thermoelectric element and joining layer, thereby preventing heat diffusion of the material of a joining layer, preventing the oxidation and deformation of the thermoelectric element under high temperature environment, and exhibiting improved operational stability due to excellent adhesion to a thermoelectric element.
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Inventors:
Su Jin Kim
Il Ha I
Bomb Suk Park
Hyunju Oh
Dong Sik Kim
Byung Kyu Im
Gi fan kim
Chor Hee Park
Il Ha I
Bomb Suk Park
Hyunju Oh
Dong Sik Kim
Byung Kyu Im
Gi fan kim
Chor Hee Park
Application Number:
JP2019541454A
Publication Date:
January 27, 2021
Filing Date:
December 26, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H01L35/08; C22C9/00; C22C14/00; C22C27/04; C23C14/14; H01L35/34; H02N11/00
Domestic Patent References:
| JP2012522380A | ||||
| JP2003092435A | ||||
| JP2014086623A | ||||
| JP2015050272A | ||||
| JP2006128522A | ||||
| JP2001028462A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe