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WO/2000/046413A1 |
A jewellery alloy, having a substantially purple hue and sufficient toughness to withstand Rockwell B hardness testing with a 100 kg load without shattering, comprises 76 to 83.5 wt.% gold and 16.5 to 21.5 wt.% aluminium. In one embodime...
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WO/2000/032829A1 |
A platinum alloy containing 1 to 5 percent gallium and 0 to 3 percent palladium as a property enhancing additives. This alloy can be heat-treated to a Vickers hardness that is increased by at least over 20 % beyond its initial, untreated...
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WO/2000/029352A2 |
Metal and ceramic members are joined together by a braze joint including a member made of bar stock molybdenum, a first ductile member brazed between the molybdenum member and the metal member, and a second ductile member brazed between ...
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WO/2000/026423A1 |
A personal ornament comprising a silver alloy consisting of germanium, indium and silver, the contents of them being 1 to 9 wt % based on the alloy, 2 to 20 wt % relative to germanium and the balance, respectively. Such an alloy can be u...
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WO/2000/022180A1 |
A platinum alloy has a white finish and comprises platinum, rhodium and ruthenium, with the platinum being present at a concentration of about 95 % by weight, the rhodium being present at a concentration from about 2.5 % to about 3.5 % b...
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WO/2000/021079A2 |
An optical data storage disk has two interfaces in its direction of thickness (d). A reflective layer (L¿1?) is provided on one interface and a partially reflective, partially transmissive layer (L¿0?) is located on the other. The two ...
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WO/2000/021110A1 |
A cathode material of an electron beam device comprising 0.5 to 9.0 % by weight of a rare-earth metal of the cerium group, 0.5 to 15.0 % by weight of tungsten and/or rhenium, 0.5 to 10 % by weight of hafnium and the balance of iridium is...
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WO/2000/015858A1 |
A metal alloy composite comprising a phase of a highly-conductive base metal in the form of a matrix and a phase of another metal positioned within the matrix, the base metal being present in a major amount and the other metal being pres...
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WO2000003463A9 |
A wear-resistant electrode tip for a spark plug, and a spark plug which incorporates the wear-resistant tip. The wear-resistant tip includes an alloy of platinum, iridium, and tungsten. Surprisingly by addition of a small amount of tungs...
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WO/2000/004202A1 |
A high purity ruthenium sputtering target suitable for use in forming a semiconductor thin film, having a low content of impurities and being reduced in occurrence of particles, which may be prepared by a method comprising adding a crude...
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WO/1999/067084A1 |
A copper-based or silver-based alloy thin film is provided for the highly reflective (219) or semi-reflective (215) layer of optical discs. Alloy additions to silver include gold, palladium, copper, rhodium, ruthenium, osmium, iridium, a...
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WO/1999/061260A1 |
A paste gold which is used for the decorating fire of glass or pottery and turns gold by burning and which comprises a metal component having a metal composition in the range: 82.0 to 99.1 wt.% of gold, 5.0 to 0.4 wt.% of bismuth, 3.0 to...
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WO/1999/049092A1 |
A magnetic shape memory alloy which can undergo very large magnetostriction is prepared by causing magnet-induced martensitic phase transformation through applying an external magnetic energy to an iron-based magnetic shape memory alloy,...
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WO/1999/001584A1 |
A sliding contact material having an alloy composition which is free from any harmful material such as Cd and excellent in particularly contact resistance, has good electrical functions, does not change with the elapse of time, and has e...
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WO/1999/000813A1 |
A microswitch comprising a fixed contact member (13) and a movable contact member (17), either one of which is formed of a silver-carbon sintered metal, the other of which is formed out of a silver-metal oxide alloy, wherein the silver-c...
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WO/1998/044894A2 |
The invention concerns silver-palladium alloys for producing a dental prosthesis. Due to the contents of indium, tin and zinc selected as alloying elements, no discoloration arises in the combination with low-melting dental ceramic with ...
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WO/1998/045489A1 |
A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying ...
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WO/1998/014137A1 |
A radially expandable stent which is formed of a fine wire (10) bent into a serpentine flat ribbon and helically wound around a mandrel (14), is disclosed. The stent is formed into a cylindrical sleeve (18) for mounting on a balloon cath...
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WO/1998/003688A1 |
The present invention relates to a matrix alloy for making, by adding gold, dental alloys for dental crowns and bridges, which alloy comprises on a rate by weight base, at least palladium from 0.0 to 16.0 %, copper from 20.0 to 41.0 %, s...
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WO/1998/002242A1 |
The present invention relates to a novel platinum palladium alloy catalyst useful in hydrofinishing and hydrocracking non low sulfur content feedstock and the process of hydrofinishing and hydrocracking such non low sulfur content feedst...
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WO/1997/047778A1 |
Electronic member: in a trend for finer line using a high purity gold alloy wire, this gold alloy wire further improves breaking strength, hardness, heat resistance and the like as compared with a conventional gold allow wire, and achiev...
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WO/1997/040200A1 |
A platinum alloy which contains at least 80 wt.% platinum and at least a binary addition of from 0.001 to 6.1 wt.% selected from the following: titanium, zirconium, vanadium, tin, germanium and gallium.
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WO/1997/033288A1 |
Contact materials with an oxide active component have the disadvantage of a shorter shelf life, principally in comparison with contact materials with a metal active component for which allowance has to be made for a higher tendency to fu...
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WO/1997/026384A1 |
The invention relates to amalgamable alloys for low mercury dental amalgam compositions. According to the invention, powders comprising silver and 5 % to 70 % by weight copper, are used as amalgamable alloys for obtaining dental amalgams...
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WO/1997/016579A1 |
A living body contacting metal material is provided which is capable of easily preventing the elution of noble metal ions, effectively preventing the occurrence of allergy due to a noble metal, and being advantageously used as an implant...
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WO/1997/015694A1 |
A decorative artifact made of a precious metal composition is disclosed in which the hardness of the composition is at least 600 on the Vickers scale. The artifact preferably has a precious metal content complying with hallmarking standa...
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WO/1997/014164A1 |
A switch is provided with a snap-action contact mechanism (10) which brings a movable contact (7) into contact with fixed contacts (5) and (6) and separates the contact (7) from the contacts (5) and (6) through snapping actions. Each con...
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WO/1996/031632A1 |
A high-purity gold alloy having a hardness comparable to that of 18-karat gold, produced at a comparatively slow processing rate by (1) adding minute amounts of certain elements and (2) conducting heat treatment, thereby improving the wo...
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WO/1996/026526A1 |
Disclosed herein are several sliding contact materials of which compositions are AuAgCu, AuAgPdCu, PtAuAgCu, AgCuNi, AgPdCuNi and PtAgCuNi. The sliding contact material can be employed for forming a three-pole commutator which then may b...
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WO/1996/025595A1 |
There is described a film cooled thrust chamber of a liquid propellant rocket engine, the thrust chamber having at least a surface lining within which bipropellant combustion occurs, the lining comprising a first portion of a material in...
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WO/1996/022400A1 |
Firescale resistant bright silver alloys are provided exhibiting lack of significant firescale formation under normal casting an hot working conditions and a comparatively high copper content. A deoxidizing additive (silicon) provides th...
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WO/1996/005330A1 |
A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, up to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modif...
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WO/1995/020696A1 |
The invention relates to a spinneret of a very specific geometry which provides more strength compared with the commonly applied spinnerets, and to a spinneret made of a specific metal alloy which also provides a further high strength. I...
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WO/1995/017759A1 |
A sintered contact material made of silver and nickel is characterised in that it contains from 5 to 50 % by mass nickel, and in that nickel is homogeneously distributed in the silver structure as particles of 1 'mu'm to 10 'mu'm average...
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WO/1995/014112A1 |
Silver alloys having properties of fire scale resistance, reduced porosity and oxide formation and reduced grain size relative to traditional sterling silver alloys and useful work hardening performance are provided, comprising about 80 ...
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WO/1995/013900A1 |
A method of joining two elements using a silver based alloy having a germanium content, which method comprises the steps of: providing two elements to be joined together, at least one of the elements comprising a silver based alloy havin...
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WO/1995/007367A1 |
A golden ornament material hardened by alloying pure gold having a purity of 99 % or above with 200-2000 ppm of one or more elements selected from Ca, Be, Ge and B, and, when necessary, 10-500 ppm of one or more elements selected from Mg...
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WO/1995/006321A1 |
Materials based on silver/iron oxide have been proposed as substitutes for the silver/nickel materials frequently used for contact pieces in low-tension switchgear in particular. The invention proposes a material containing an additional...
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WO/1994/024322A1 |
This invention provides a gold alloy wire for bonding a semiconductor device to improve long term reliability of wire bonds to electrodes, reduce wire bending, increase the resistance against the flow of molding resin, and form a high wi...
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WO/1994/024323A1 |
A gold-alloy bonding wire comprising a group of elements consisting of 2-10 wt. ppm of scandium, 3-20 wt. ppm of beryllium and 2-50 wt. ppm of indium and the balance consisting of gold and inevitable impurities. This wire serves to secur...
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WO/1994/021833A1 |
A fine palladium alloy wire for semiconductor element wire bonding, which has a configuration superior to the looped configuration of a fine gold alloy wire and a secured junction reliability, and hence can substitute for a gold alloy bo...
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WO/1994/008061A1 |
A method of producing a sintered metal component from powder comprises mixing a high alloy steel powder with a low alloy steel or an iron powder in the presence of a free carbon powder in the range 0.1 to 1.5 wt %, optionally with a lubr...
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WO/1994/003305A1 |
A ductile brazing material containing 75-98 % gold, 0-20 % nickel, 0.5-6 % vanadium and, optionally chromium and/or molybdenum at less than about 6 % is disclosed for directly bonding ceramic to ceramic or ceramic to metal over an optimu...
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WO/1993/026021A1 |
A material for electrical contacts based on silver-tin oxide which contains tin oxide regions and further oxides and/or carbides in a matrix of silver or an alloy consisting mainly of silver. The further oxides and carbides are contained...
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WO/1993/023092A1 |
Anti-microbial coatings and method of forming same on medical devices are provided. The coatings are formed by depositing a biocompatible metal by vapour deposition techniques to produce atomic disorder in the coating such that a sustain...
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WO/1993/015517A1 |
Contact materials with the composition AgSnO¿2?Bi¿2?O¿3?CuO have proved their worth, especially for low-voltage switching devices. Other metal oxides may be added to these materials. Besides the required useful life and a suitable ove...
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WO/1993/014238A1 |
A method of making silver-metal oxide materials suitable for use in electrical contacts includes oxidizing a silver-solute metal alloy in an oxidizing atmosphere. The oxidizing atmosphere has a sufficient amount of halide to inhibit the ...
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WO/1993/010927A1 |
Oxide-free metallic, alloy or intermetallic compound formed by coating a powder of at least one member selected from the group consisting of elemental metallic, alloy and intermetallic compound with an oxide-replacing metal. The oxide-fr...
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WO/1993/009756A1 |
The invention relates to a method of preparing a dental amalgam that is devoid of harmful free mercury, to be used as a filler for dental cavities and in particular the invention relates to processes by which two separate compositions ch...
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WO/1993/001050A1 |
A palladium alloy containing 3 to 25 atomic percent niobium exhibits oxidation resistance and low electrical contact resistance. The alloy is particularly suited for electrical applications such as coatings (14, 20) for electrical contac...
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