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WO/2021/186885A1 |
This boiling cooling device is used with a refrigeration cycle apparatus. The boiling cooling device includes: a boiling unit; a condensing unit; and refrigerant piping. The refrigerant piping connects the boiling unit and the condensing...
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WO/2021/186886A1 |
In this boiling-cooling device, a thermo valve is provided to a boiling-device refrigerant pipe that connects a condensing unit and a boiling unit. The thermo valve is provided with a bypass flow path. The thermo valve is provided with a...
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WO/2021/188128A1 |
Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. Th...
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WO/2021/182751A1 |
The present invention relates to an evaporation device for cooling. In the present invention, a working fluid can move by means of capillary force by a wick (16) in an evaporation space (12) formed inside a housing (10). While the workin...
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WO/2021/182644A1 |
A vapor chamber equipped with, for example, a metal plate-shaped first member having a first center section and a first peripheral section at the periphery of the first center section, a metal plate-shaped second member having a second c...
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WO/2021/176604A1 |
This superconducting electromagnet device is provided with a superconducting coil (2), a refrigerant container (3), a freezer (8), a heat exchanger (11), and a cooling tube (13). The refrigerant container (3) accommodates a refrigerant t...
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WO/2021/170975A1 |
A cryogenic cooling system is provided comprising: a cooled plate (2) thermally coupled to a cryogenic refrigerator (9), a heat switch assembly and a target assembly (5). The target assembly (5) comprises a target refrigerator (12) confi...
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WO/2021/168914A1 |
Disclosed is a temperature equalization plate radiator, comprising a first cover plate (1) and a second cover plate (2), wherein an upward protruding cavity (101) is provided in a center area of the first cover plate (1); after an outer ...
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WO/2021/172479A1 |
The heat dissipation member (1, 1A to 1G) according to the present disclosure has: a flat plate-shaped intermediate member (30, 30A, 30B) made from ceramic; a first member (10, 10F); and a second member (20). The intermediate member (30,...
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WO/2021/129692A9 |
An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
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WO/2021/167871A1 |
A wick assembly for use with a heat pipe is disclosed. The wick assembly includes an end plug including a wick receiving area, a wick, and a crimp. A portion of the wick is positioned about the wick receiving area. The crimp is positione...
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WO/2021/167202A1 |
Introduced is a thermoelectric power generation system for recovering casting waste heat which generates power by recovering waste heat of a cast manufactured through thermal processing. The thermoelectric power generation system for rec...
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WO/2021/157506A1 |
A vapor chamber 1 is provided with a housing 10, a working medium 20 sealed into an inner space 50 of the housing 10, a wick 30 which is disposed in the inner space 50 of the housing 10, and a pillar (e.g., a first pillar 41) disposed in...
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WO/2021/156233A1 |
Method for manufacturing a heat exchanger or a heat pipe, comprising at least the following steps: – obtaining an assembly comprising at least one part (53) comprising at least 90% by mass of a metal or an alloy of metals, the part hav...
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WO/2021/156563A1 |
Device for regulating the temperature of one or more electrical elements likely to generate heat in operation, the device comprising a main housing defining a main compartment subdivided into a first compartment which is intended to rece...
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WO/2021/152668A1 |
A heat-pipe-type cooler (100) according to the present disclosure comprises: a heat pipe unit having a main pipe body (1) that has a heat-receiving part (5) having a surface on which a heat-emitting body (4) is placed and connecting part...
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WO/2021/153443A1 |
Provided is a vapor chamber configured so that it is possible to save space in and reduce the weight of a device in which the vapor chamber is mounted. A vapor chamber having a container in which a hollow section is formed from one pla...
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WO/2021/153444A1 |
The present invention provides a vapor chamber in which a container interior of a wick structure exhibits excellent fixation stability, and which affords a liquid-phase working fluid an excellent reflux characteristic due to the excellen...
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WO/2021/149308A1 |
This heat pipe comprises a cylindrical container with both ends in the longitudinal direction sealed, and a wick structure that is provided inside the container. In the container, an evaporation portion that evaporates the working fluid ...
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WO/2021/145252A1 |
A wavelength conversion element according to an embodiment of the present disclosure comprises: a phosphor layer including a plurality of phosphor particles and having one surface and the other surface that face each other; a coolant for...
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WO/2021/143674A1 |
A mobile terminal, a vapor chamber (100) and a preparation method therefor, and an electronic device. The vapor chamber (100) comprises: a housing (110) comprising a first cover plate (10) and a second cover plate (20), the first cover p...
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WO/2021/143663A1 |
A heat dissipation component, comprising a heat absorbing body (1) and a heat dissipating body (2), a heat absorption flow path within the heat absorbing body (1) and a heat dissipation flow path within the heat dissipating body (2) are ...
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WO/2021/145332A1 |
This heat transfer member is made from a metal material and is provided with, for example, a surface layer having a porous structure that intersects a first direction and extends across a predetermined segment in the first direction on a...
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WO/2021/139924A1 |
The invention relates to a cooling device (1) for cooling components (101), comprising a baseplate (2) which can be heat-conductively connected to a component (101) to be cooled, a deflection region (3), an intermediate region (4) betwee...
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WO/2021/141110A1 |
The vapor chamber wick sheet according to the present invention is provided with: a sheet body having a first body surface and a second body surface; a first vapor flow path portion for passing a vapor of an operating fluid; a liquid pat...
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WO/2021/137116A1 |
A system for heating/cooling a target unit. The system including a heater/cooler unit and a heat transfer fluid module. The heater/cooler unit including a heater/cooler that includes a heater/cooler element and a heater/cooler pump, and ...
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WO/2021/136073A1 |
Provided is a heat dissipation device, comprising a first cover plate, a second cover plate, a capillary structure and working fluid. The first cover plate and the second cover plate are combined to form an airtight accommodating space; ...
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WO/2021/133970A1 |
A micro-channel pulsating heat pipe, preferably closed loop, includes a plate with micro-channels with obstructions along interior walls to increase surface area, add nucleation sites for the working fluid vaporization, and otherwise enh...
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WO/2021/127590A1 |
Methods and apparatus for processing hydrocarbon and other feedstocks that contain lighter volatile component(s) along with heavier volatile or non-volatile component(s) and/or contaminant(s). The principal benefit being that a feedstock...
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WO/2021/124518A1 |
This power conversion device is provided with a power conversion module, a phase-change material, a heat-dissipating member, a cooling means, and a control means. A semiconductor switching element and a freewheeling diode constitute a po...
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WO/2021/114144A1 |
The present application provides a heat pipe. Multiple condensation flow channels are provided inside a condensation end, and each condensation flow channel comprises a condensation inlet end and a condensation outlet end. Multiple evapo...
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WO/2021/117105A1 |
A cooling apparatus (100) cools an electronic device (2) or other heat-generating device mounted on a satellite or other such carrier. The cooling apparatus (100) is provided with an annular refrigerant flow path (10) formed by sequentia...
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WO/2021/114146A1 |
The present application provides a heat pipe, comprising an upper heat pipe layer, a lower heat pipe layer disposed opposite to the upper heat pipe layer to define an accommodating space, and a flow channel layer accommodated in the acco...
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WO/2021/117106A1 |
A cooling device (1) comprises: a heat-receiving block (11); and at least one heat pipe (12) that has a portion attached to the heat-receiving block (11), extends in a direction away from the heat-receiving block (11), and is filled with...
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WO/2021/109175A1 |
Provided by the present invention is a thin temperature-equalizing plate, which enables a temperature-equalizing plate to have a reduced thickness, increased heat exchange capacity, and reduced overall weight, and meet continually increa...
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WO/2021/111575A1 |
An element module according to an embodiment is provided with a cooler, a plurality of elements, and electrically conductive members. The cooler includes a first element disposed section and a second element disposed section which are pr...
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WO/2021/110235A1 |
An apparatus (102; 202; 302; 402; 502) for transferring heat from a heat source (104) to air when the apparatus (102; 202; 302; 402; 502) is connected to the heat source (104) is disclosed. The apparatus (102; 202; 302; 402; 502) has a h...
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WO/2021/109937A1 |
Disclosed in the present invention is a magnetic fluid heat exchange device. The magnetic fluid heat exchange device comprises two heat exchange pipelines; one ends of the same side of the two heat exchange pipelines are communicated wit...
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WO/2021/104962A1 |
A thermal ground plane comprises top and bottom layers that are substantially impervious to fluid and together defining an inner space, a vapour transport mesh layer having a relatively coarse mesh structure and located within said space...
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WO/2021/102686A1 |
Provided by the present application is a fabrication method for a vapor chamber, comprising: providing a copper-clad substrate having a copper foil layer; pressing a photoresist layer, exposing and developing so as to form an outer side ...
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WO/2021/097974A1 |
The present invention provides a pulsating heat pipe taking liquid metal micro-nano liquid drops as a working medium, comprising a pulsating heat pipe body. The working medium of the pulsating heat pipe body is a mixed working medium mai...
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WO/2021/094874A1 |
The invention relates to a heating support for objects to be heated. The heating support (1) comprises support elements arranged next to each other and together providing a support base for objects to be placed thereon. The support eleme...
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WO/2021/096125A1 |
The present invention relates to a sheet-type heat pipe and a method for manufacturing same, the sheet-type heat pipe comprising: a lower plate brought into contact with a heat source at the bottom surface thereof; an upper plate hermeti...
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WO/2021/095147A1 |
The present invention provides a technique for quickening hardening of a liquid gasket. A cooler according to the present invention is provided with: a body; a cover; a pair of first fins; and a plurality of second fins. A flow path thro...
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WO/2021/090840A1 |
This invention provides a vapor chamber that has excellent heat dissipation performance and resistance to pressure from an external environment and in which the flow of a working fluid is made smoother. The vapor chamber comprises: a c...
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WO/2021/086588A1 |
A vapor chamber that includes a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein; a working fl...
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WO/2021/085315A1 |
Provided are: a composition that has high magnetic particle dispersibility and realizes a long shelf life; and a heat transport device that uses this composition. This composition contains: particles; and an aqueous medium including wate...
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WO/2021/086013A1 |
A temperature control device for a motorcycle handle according to the present invention comprises: a grip part; a plurality of heat pipes which are disposed on the outer surface of the grip part; a Peltier element which is disposed at on...
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WO/2021/078957A1 |
The invention relates to a planar heat transfer apparatus for heat distribution and for removal of heat from a planar heat source (50). The apparatus comprises: a cavity (100), which is delimited by a first wall (110) for coupling to the...
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WO/2021/073159A1 |
The present invention provides a thin integrated structure vapor chamber. A vapor chamber body and a plastic component are integrated into an integral component so that the vapor chamber is high in precision and good in strength, additio...
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