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Patent Searching and Data


Matches 751 - 800 out of 14,110

Document Document Title
WO/2003/074958A1
A passive cooling unit for integrated electronics in form of flat-plate heat-pipe device (20) having a shallow cavity base member (26), a cover plate (28), and a lanced-offset fin member (36) and associated porous metal wick material san...  
WO/2003/073032A1
A capillary evaporator (100) for removing heat from a heat source (102), particularly under high heat-flux conditions. The capillary evaporator includes a housing (104) having a plurality of ribs (108) in thermal communication with the h...  
WO2003017365A3
The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a compositi...  
WO/2003/071215A1
A heat pipe assembly (10&sol 110), under vacuum and having a working substance charged therein, comprising generally an evaporator (12&sol 112) adapted to evaporate the working fluid and a condenser (16&sol 116). The condenser (16&sol 11...  
WO/2003/068626A1
A heat pipe (5) is provided having a vessel (10) with a closed first end, a second end (24), and a wick (15) on an inner surface that defines a passageway. A convex wall (20) is positioned at the second end (22) so as to block the passag...  
WO/2003/062686A2
A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat p...  
WO/2003/059958A2
A polymerization reactor (10) comprises a heat pipe jacket (44) for the removal of large heat fluxes and capable of maintaining essentially isothermal conditions without the use of complicated and maintenance intensive circulation heat e...  
WO2003016044A8
A heat transfer medium is shown, having a very high heat transfer rate that is simple in structure, easy to make, environmentally sound, rapidly conducts heat, and preserves heat in a highly efficient manner. Also shown is a heat transfe...  
WO/2003/058144A1
The present invention relates to a kind of integrated heat pipe and a method of heat exchange. The heat pipe includs a tank(1-2) as a heating potion and a lot of heat carriers(1-4) as a radiating portion. The tank(1-2) and the heat carri...  
WO/2003/057361A1
A polymerization reactor (10) for exothermic liquid phase reactions comprises a reaction zone (31) which is divided into a plurality of channels by thermally conductive heat transfer fins (22) which are conductively mounted on one or mor...  
WO/2003/057358A1
A vapor-phase tubular reactor in a shell heat exchanger for removal of the heat of reaction at essentially isothermal conditions has porous wicking surface (211) applied to the external surface of reactor tubes (210). The porous wicking ...  
WO/2003/056265A1
An evaporator (23) disposed between an exhaust manifold (22) and an exhaust pipe (24), comprising, in order, a first exhaust gas passage (56) having a third stage heat exchanger (H3) extending from an upstream side to a downstream side, ...  
WO2003004944A3
A novel fluid heat transfer agent suitable for use in a closed heat transfer system, for example, wherein heat energy is transferred between an evaporator and a condenser in heat exchange relationship with the heat transfer agent that is...  
WO/2003/056626A1
The invention provides an ebullition cooling device 1 for a heat generating component B which device comprises a boiling unit 2 for boiling a refrigerant A contained therein with the heat generated by the heat generating component B as a...  
WO/2003/054469A1
An advanced Loop Heat Pipe ('ALHP') apparatus, for passively transporting waste heat over a long distance and rejecting it to a heat sink for heat rejection, an evaporator capillary pump ('ECP') (100) for heat acquisition, includes a res...  
WO/2003/052819A2
A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the com...  
WO/2003/050465A1
A small and thin cooling device with high cooling performance, an electronic equipment device, and a method of manufacturing the cooling device, the cooling device (1) comprising rectangular first glass substrate (2) and second glass sub...  
WO2003025475A3
The modular CPL cooling system transfers heat from high-power circuit components (22) in a chassis to other locations within or external to the chassis, where the heat can be more easily removed. The CPL cooling system includes one or mo...  
WO/2003/050466A1
A cooling device capable of being reduced in size and thickness and capable of increasing a cooling performance, an electronic equipment device, and a method of manufacturing the cooling device, the cooling device (1) comprising a lower ...  
WO/2003/047942A1
A steering wheel (1) has a hub (2) which incorporates a heat exchange element (9) which is connected by spokes (3, 4, 5) to a rim (6). The heat exchanger (10) may be heated or cooled and is connected by means of heat pipes in the spokes ...  
WO/2003/046463A2
A stacked array of low profile heat pipes (410) each with a plurality of micro tubes (21) therethrough which cools an electronic device (420).  
WO/2003/031897A1
A heat collector (50) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame (40) which may be stamped and formed or molded. The heat collector has flanges (53) which...  
WO/2003/029731A2
A micro heat exchanger (200) comprised of an electroosmotic pump (300) and a heat producing device (50).  
WO/2003/025475A2
The modular CPL cooling system transfers heat from high-power circuit components (22) in a chassis to other locations within or external to the chassis, where the heat can be more easily removed. The CPL cooling system includes one or mo...  
WO/2003/026109A2
A power conversion method wherein solar power,thermal power or radiation energy is directly fed to the evaporator (4) of a heat pipe by means of a focusing system or a radiation conductor (20) and is converted into the power of the worki...  
WO/2003/025489A1
A heat dissipation device (300) comprised of a heat pipe member (310) and a heat dissipating member (320).  
WO/2003/023307A1
A heat sink (1), comprising a vertical plate‚ąílike heat sink body (2) having a heat receiving part (3) and a heat radiating part (4) and heat radiating fins (5) provided on at least one of the faces of the heat radiating part (4), where...  
WO/2003/023317A1
A tactical missile (10) includes a heat pipe (22) connecting heat sources with heat sinks within the missile. The system includes a removable external heat dissipation device (24) that connects to the heat pipe (22) while the missile (10...  
WO/2003/019098A1
A very flexible heat pipe is provided constructed of multiple layers of material laminated into the final structure. The center of the symmetrical structure is a coarse screen (18) which creates a vapor space. The layers on either side o...  
WO/2003/016810A1
The invention relates to a method for preventing the formation of a gas film in an evaporation area in a two-phase cooling system and a device for carrying out said method. According to the invention, mechanical vibrations in the ultraso...  
WO2002052644A3
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit packag...  
WO/2003/016811A2
Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly effic...  
WO/2003/015908A1
An apparatus for carrying out a process of converting hydrocarbon fuel to a hydrogen rich gas utilizes heat pipes (504) to control the temperatures of the reactor beds (502), manage heat and integrate the heat management in a simple and ...  
WO/2003/017365A2
The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a compositi...  
WO/2003/016044A1
A heat transfer medium is shown, having a very high heat transfer rate that is simple in structure, easy to make, environmentally sound, rapidly conducts heat, and preserves heat in a highly efficient manner. Also shown is a heat transfe...  
WO2002002201A3
A capillaray pump two phase heat transport system that combines the most favorable characteristics of a capillary pump loop (CPL) with the robustness and reliability of a loop heat pipe (LHP). Like a CPL, the hybrid loop has plural paral...  
WO/2003/014648A1
The invention relates to heat engineering, in particular to heat pipes and can be used for removing heat from miniature high-heat objects, in particular elements of radiotechnical instruments and computers requiring efficient removal of ...  
WO/2003/015234A2
Featured is a heat transferring device (200) being configured and arranged so that at least some of the heat energy being generated by a heat producing device, such as the a bearing assembly of a flywheel energy storage system, is commun...  
WO/2003/014697A2
This invention comprises devices, compositions and methods for quantitative detecting analytes in complex solutions by Raman spectroscopy. Passivating agents associated with enhancing surfaces can decrease direct, non-specific interactio...  
WO/2003/012357A2
A heat exchanger includes a manifold having a number of parallel heat pipes extending between a head pipe and a tail pipe or feeder pipe. The tail pipe is parallel to the head pipe. The heat pipes define many capillaries extending in par...  
WO/2003/009663A1
The present invention provides a thermal energy management architecture (5) for a functioning system of electronic components and subsystems (10) comprising a hierarchical scheme in whic thermal management components are: (i) operatively...  
WO2002072378A9
A solar-based power generating system (10) including an electrical alternator (32) or generator for generating electrical power in which the alternator or generator is driven by a refrigerant circulating through a closed-loop heat transf...  
WO2002058138A3
An electronic assembly (10) is described including a motherboard (12), a semiconductor die (20) mounted to the motherboard (12), and a heat pipe (22) having an evaporator portion (34) adjacent the die n (20), and a condenser portion (36)...  
WO/2003/006910A1
A thermal bus (5) is provided for cabinets (10) housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators (30) interconnected in flow communication with a condenser (36). Each evap...  
WO/2003/004944A2
A novel fluid heat transfer agent suitable for use in a closed heat transfer system, for example, wherein heat energy is transferred between an evaporator and a condenser in heat exchange relationship with the heat transfer agent that is...  
WO/2003/002916A1
An underfloor heating system having a main conduit (2) transporting a heat transfer medium therethrough, at least one heatpipe (4) contactable with said conduit, said heatpipe having means (6) for adjusting its positioning relative to th...  
WO/2003/001861A1
The heat management system (10) for an electronic cabinet (15) which is provided with a first heat exchanger (100) having a cold plate (103) with channels filled with liquid coolant, a second liquid-to-air heat exchanger (200) and tertia...  
WO/2002/099344A1
A refrigeratory for a refrigerating device comprising a refrigerating agent channel (4) which is guided between two side walls (2, 3). At least one of the side walls (3) is made of a non-rigid bending material which can be adapted intern...  
WO2002081996A3
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28)...  
WO/2002/090846A2
A heat transfer system first comprises an air conditioner (111) which includes an evaporator (112). The system further includes a chamber (113) having an air duct (114) comprised of an input end (115) for receiving fresh ambient make up ...  

Matches 751 - 800 out of 14,110