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Patent Searching and Data


Matches 751 - 800 out of 15,066

Document Document Title
WO/2007/096313A1
There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5),...  
WO/2007/097762A1
An apparatus for vaporizing a liquid and heating the vaporized liquid to an elevated temperature. The apparatus has a heat transfer wall having an outer surface for receiving heat and transferring the heat to an inner surface. A wick mat...  
WO/2007/086418A1
Provided is an apparatus for efficiently cooling the much heat of a hot object such as an exhaust gas to be cooled, neither by enlarging the size of a cooling device such as a radiator nor by needing either a piping to connect an evapora...  
WO/2007/085767A1
A method, dedicated to manufacturing panels having one or more integrated heat pipes and/or inserts, consists in a) providing a lower plate (SI) comprising, at selected points situated on either side of reception zones for a heat pipe or...  
WO/2007/083441A1
This invention provides a cooling room comprising a high-temperature side thermosyphon, a Sterling refrigerator, a cooling space, a fan, and a control unit. The high-temperature side thermosyphon is provided for transferring heat from an...  
WO/2007/082013A3
A tank for use in a system that outputs a liquid at a user defined constant temperature in order to regulate the temperature of a piece of equipment includes a body of material having a top wall and a plurality of other walls which colle...  
WO/2007/082012A3
A tank for use in a system that outputs a liquid at a user defined constant temperature in order to regulate the temperature of a piece of equipment includes a body of material having a top wall and a plurality of other walls which colle...  
WO/2007/081617A3
A microchannel heat sink is manufactured from graphite materials. A heat sink member (300) has at least a first thermal contact surface (308) for making thermal contact with an electronic device (312). The heat sink member is constructed...  
WO/2007/080154A1
The invention relates to a continuous method for carrying out an exothermal reaction of a reaction medium containing at least one liquid phase in an adiabatic solid bed reactor, characterized in that one or several thermally conductive p...  
WO/2007/079371A2
Heat sealable mesh-like planar or 3D heat transferring material with improved weight characteristics has high surface area and air breathable surface uniquely advantageous to tasks of heat dissipation or harvesting. Material is heat seal...  
WO/2007/079427A2
A heat conducting material that utilizes phase transitions to transport heat. The material can be used to produce heat pipe devices by simple creation of hermetic seams that isolate segments of the material. The material provides superio...  
WO/2007/079371A3
Heat sealable mesh-like planar or 3D heat transferring material with improved weight characteristics has high surface area and air breathable surface uniquely advantageous to tasks of heat dissipation or harvesting. Material is heat seal...  
WO/2007/079427A3
A heat conducting material that utilizes phase transitions to transport heat. The material can be used to produce heat pipe devices by simple creation of hermetic seams that isolate segments of the material. The material provides superio...  
WO/2007/076090A2
A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use...  
WO/2007/075130A1
The invention relates to an apparatus and method for cooling a power device. The apparatus comprises a heat sink (12) , in thermal contact with the electric and/or magnetic power device and comprises a closed cavity .(16) containing a ph...  
WO/2007/076090A3
A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use...  
WO/2007/070243A1
An evaporator (105) includes a cylindrical barrier wall (200) , and a cap that fits at an end of the cylindrical barrier wall (200) . The cylindrical barrier (200) wall defines a central axial opening and an outer cylindrical surface. Th...  
WO/2007/066038A1
The invention relates to a cooling device comprising a heat pipe (6) which is provided with an electrically-isolating part (15) between the evaporating (8) and condensing (7) parts thereof, such that the hot and cold areas are isolated e...  
WO/2007/035295A1
The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal...  
WO/2007/029125A2
A heat transfer device (100) includes a vapor chamber (130) that houses a phase change material such as water. The heat transfer device (100) may be selectively formed from a combination of polymeric and non-polymeric materials. In one e...  
WO/2007/030411A3
A spray cooling system for transverse evaporative spray cooling in a narrow gap, which may generally include a mixing zone, a converging zone, a plurality of cooling conduits, and a re-circulation conduit. The spray cooling system in som...  
WO/2007/029125A3
A heat transfer device (100) includes a vapor chamber (130) that houses a phase change material such as water. The heat transfer device (100) may be selectively formed from a combination of polymeric and non-polymeric materials. In one e...  
WO/2007/029359A1
A thin and flat type heat pipe with enhanced heat conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate pl...  
WO/2007/026909A1
A steam engine of a simple structure capable of efficiently providing mechanical energy from not only hot heat sources but also various heat sources in a low temperature state such as the exhaust heat of internal combustion engine. In th...  
WO/2007/026833A1
To provide a small-sized and thin heat pipe (1) enabling a remarkable increase in heat conductivity. An upper intermediate plate (7) and a lower intermediate plate (8) in which a plurality of steam diffusing flow passages (10) in a horiz...  
WO/2007/027663A3
Evaporative cooling is an effective and efficient method for rapidly removing heat from a system device. In accordance with the disclosure herein, a microfluidic Y-junction apparatus is provided which can produce low temperatures and can...  
WO/2007/024361A3
A heat transfer fluid can be circulated through an LNG vaporizer, then to a liquid-to-air heat exchanger. Ambient air can be introduced into liquid-to-air heat exchanger to warm the heat transfer fluid while a pump circulates the heat tr...  
WO/2007/019558A3
A heat pipe comprising a chamber; a wick in the chamber, and a heat sink, which is adjacent to a first portion of the wick. A heat source adjacent to a second portion of the wick, wherein the wick is configured such that a gas condenses ...  
WO/2007/010527A3
A method and apparatus for cooling eletronic or other devices (CD) by bringing the device to be cooled into contact with one face of a cold plate (30) having high thermal conductivity; and applying a plurality of liquid jets of a liquid ...  
WO/2007/009868A1
The invention relates to an arrangement (1) of at least one electrical component (2) and at least one cooling device (3) for dissipating heat from the component, the cooling device having at least one two-phase cooling device with at lea...  
WO/2007/010005A1
The invention relates to an arrangement (1) of an at least one electric component (2) and at least one cooling device (3) for dissipating heat from the component, the cooling device having at least a two-phase cooling device having at le...  
WO/2007/002429A3
According to some embodiments, a capillary tube may be utilized to facilitate bubble containment in liquid cooling systems. For example, a system may comprise a first volume to contain a liquid, a second volume to contain the liquid and ...  
WO/2007/000243A3
Reforming reactor for the conversion of a process fluid into hydrogen comprising: a reforming section (4) which is contained within a closed volume (8), a boiler section (3) and a combustion section (2), in which said reforming section c...  
WO/2007/001317A2
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a firs...  
WO/2007/000243A2
Reforming reactor for the conversion of a process fluid into hydrogen comprising: a reforming section (4) which is contained within a closed volume (8), a boiler section (3) and a combustion section (2), in which said reforming section c...  
WO/2007/001317A3
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a firs...  
WO/2007/000624A1
A real temperature output air conditioner which lowers the ambient temperature of an interior space to a desired temperature and, one that has been achieved, delivers a constant flow of air at that specific temperature thereto. The prese...  
WO2006107492A3
A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid- vapor manifold in fluid communication with a capillary structure thermally connec...  
WO2006019219A3
A coolant phase changeable cooling apparatus using a capillary action is provided. The cooling apparatus prevents a generation of bubbles inside a wick of an evaporator (100) or an inverse flow of a vaporized gaseous coolant through a wi...  
WO/2006/119684A1
An integrative heat pipe heat exchanging structure includes a evaporating part, a condensing part, a liquid absorbing core, working fluid and heat exchanging fins. The evaporating part is connected with the condensing part so as to form ...  
WO/2006/112586A1
Provided is a flat plate-type heat pipe formed of a flat pipe having a predetermined through-hole formed therein and a plurality of grooves extending from an inner surface of the through-hole in a longitudinal direction so that, while th...  
WO2006000205A3
The invention relates to a thermal energy discharge device comprising a coolant circuit, a heat exchanger wherein thermal energy is transferred to the coolant, also comprising a coolant pump for pumping coolant through the heat exchanger...  
WO/2006/107492A2
A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid- vapor manifold in fluid communication with a capillary structure thermally connec...  
WO/2006/105605A1
A heat exchanger (10) has an outer housing (16) and a first helical fluid flow path or coil (12) located in the housing (16) defining a plurality of turns and having an inlet (24) and an outlet (22) for entry and exit of fluid into the f...  
WO/2006/102838A1
A method for smoothing the sealed end of a tube and a heat conductive pipe manufactured by the method. First, the sealed end of a metal tube for manufacturing a heat conductive pipe is fixed into a female mold; next, a male mold is inser...  
WO/2006/099837A1
In a cooling system for cooling a hard disk (2) or similar components which produce heat losses in an electronic appliance, for example a computer, using a heatpipe (11) which can be thermally connected to an area (5) which absorbs heat ...  
WO/2006/098535A1
This invention relates to a heat transfer pipe structure of a heat pipe heat exchanger for enhancing durability and workability by connecting with a heat pipe and extruding in an integral structure which partitions the heat transfer pipe...  
WO2006006170A3
A heat-exchanging device comprising a heat exchanging layer, having a heat transfer contact surface designed to be subjected to a heat flux of a heat dissipating element and flow passages whose inlets and outlets are located on at least ...  
WO2006054015A3
The invention concerns a heat exchanger (4) for a combustion oven, said exchanger comprising a heat exchanging zone (2) provided with means for the passage of hot fumes derived from a burner of the oven, said zone being traversed by at l...  
WO/2006/085943A2
The present invention provides a heat exchange system for a closed loop fuel delivery system (80). The heat exchange system generally includes a first pump (82), a heat exchanger (84), a high pressure pump (86) and a circulating pump. Th...  

Matches 751 - 800 out of 15,066