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Patent Searching and Data


Matches 751 - 800 out of 14,682

Document Document Title
WO2005043059A3
A method of making an evaporator (115) includes orienting a vapor barrier wall (117) , orienting a liquid barrier wall (135) , and positioning a wick (145) between the vapor barrier wall and the liquid barrier wall. The vapor barrier wal...  
WO/2005/125296A1
A cooling device to which an electric circuit may be mounted includes a cooling body provided with a front edge having bores forming V-shaped channels inside the body. Intersecting V-shaped channels are closed by plugs to thereby define ...  
WO2005094224A3
A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sec...  
WO/2005/114084A1
A heat pipe (10) with superior heat transfer between the heat pipe (10) and the heat source and heat sink (16) is provided. The heat pipe (10) is held tightly against the heat source by mounting holes (12) which penetrate the structure o...  
WO/2005/114061A2
A heat transfer system (100) comprising a primary heat exchanger (102) for receiving heat from a heat source (104); a secondary heat exchanger (106) for exhausting heat to a heat sink (108); a conduit (110) connecting the primary heat ex...  
WO/2005/114061A3
A heat transfer system (100) comprising a primary heat exchanger (102) for receiving heat from a heat source (104); a secondary heat exchanger (106) for exhausting heat to a heat sink (108); a conduit (110) connecting the primary heat ex...  
WO2004083742A3
A method of cooling at least one heat generating device (220) using a cooling system (200) is disclosed. The method comprises the steps of using at least one pump (240) to cause a fluid to flow in at least on heat exchanger (210) and adj...  
WO/2005/108897A2
A capillary structure (90) for a heat transfer device, such as a heat pipe is provided having a plurality of particles including a first species (71) having a first diameter and a second species (73) having a second diameter that are joi...  
WO/2005/100897A1
A heat transport apparatus, a method of manufacturing the heat transport apparatus, and electronic equipment on which the heat transport apparatus is mounted. In the heat transport apparatus, since a heat absorbing base plate (2) and a c...  
WO/2005/100899A2
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions re...  
WO/2005/098335A2
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant...  
WO/2005/098335A3
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant...  
WO/2005/098336A1
An evaporator is formed, having an inflow opening from which a liquid or substantially liquid refrigerant flows in, heat exchanging piping for evaporating the refrigerant, and an outflow opening from which the refrigerant flows out. The ...  
WO/2005/098338A1
A thermal transfer device (20) comprises a housing having a base assembly (23) and a cover (22). The base assembly (23) comprises a thermal transfer base (25) and a fluid-porous, thermally conductive mesh structure (26). The thermal tran...  
WO/2005/094224A2
A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sec...  
WO/2005/089197A3
An RF amplifier assembly employing a finned heat sink (16) and a heat pipe enhanced aluminum pallet (10) is disclosed. The hybrid heat pipe enhanced aluminum pallet (10) reduces the spreading thermal conduction resistance associated with...  
WO/2005/086615A2
A cryogenic receiver front-end includes a heat sink having a mounting surface and a plurality of fins, a cryocooler mounted to the mounting surface of the heat sink, a heat rejector surrounding the cryocooler, the heat rejector including...  
WO2005063566A3
With a cooling system for expelling heat from a heat source (30) located in the interior of an aircraft to a heat reducer (32), with a piping system (10) sealed against the surrounding atmosphere which is thermally coupled to a heat inta...  
WO2004040218A3
A system includes a heat transfer system (105) and a priming system (110) coupled to the heat transfer system. The heat transfer system includes a main evaporator (115) having a core (135), a primary wick (140), and a secondary wick (145...  
WO/2005/083345A1
A flexible loop thermosyphon (50) is provided having a flexible, hermetic, outer tube (86) and a flexible, non-hermetic, inner tube, (85) positioned concentrically within the outer tube, forming an annulus between the outer tube and inne...  
WO/2005/081812A2
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...  
WO/2005/081812A3
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...  
WO2005055319A3
The present invention relates to a closed system for cooling without moving mechanical parts and at a low noise level, one or more heat-emitting elements. The system comprises a first heat-receiving part that is adapted to receive heat f...  
WO2004083760A3
An apparatus and method of circulating a heat-absorbing material within a heat exchanger (100) is disclosed. The apparatus comprises a manifold layer (101) coupled to an interface layer (150). The manifold layer (101) comprises an inlet ...  
WO2004040218A9
A system includes a heat transfer system (105) and a priming system (110) coupled to the heat transfer system. The heat transfer system includes a main evaporator (115) having a core (135), a primary wick (140), and a secondary wick (145...  
WO/2005/071747A1
A heat pipe radiator of heat-generating electronic component comprises a tubular housing and flow channel having tubular thin wall mounted within the tubular housing. The edge of tubular housing and flow channel are hermetically connecte...  
WO2005036075A3
The inventive device for cooling electronic device components comprises coolers disposed on the cooled electronic device components, a remote radiator and a heat pipe. Said heat pipe consists of four sections embodied in the form of heat...  
WO2003029731A3
A micro heat exchanger (200) comprised of an electroosmotic pump (300) and a heat producing device (50).  
WO2004071139A3
A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, ...  
WO2004061908A3
A cooling apparatus has a low profile extrusion (20) with a plurality of micro tubes (21) extended there through. In the caps interconnect the ends of the micro tubes (21) in fluid communications and to inlet (18) and outlet (22) tubes. ...  
WO2005005903A3
A capillary structure (25) for a heat transfer device (2), such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound (30) are formed...  
WO2004042307A3
Methods and apparatus for cooling a device are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid that near or above its critical pres...  
WO/2005/063566A2
With a cooling system for expelling heat from a heat source (30) located in the interior of an aircraft to a heat reducer (32), with a piping system (10) sealed against the surrounding atmosphere which is thermally coupled to a heat inta...  
WO2004019379A3
A number of compact, high-efficiency thermoelectric system utilizing the advantages of thermal isolation in the direction of a working medium flow or movement, in manufacturable systems, are described. Such configurations exhibit high sy...  
WO/2005/060370A3
A system (200) to extract heat from a high power density device (202) and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit (203a) using one or more electronmagnetic pumps (211) for carrying ...  
WO/2005/054766A1
The heat pipe radiator (10) is intended to be included into a heating system of the kind comprising a heat source arranged internally or externally to the radiator itself, a conduit (11) containing a heat carrier fluid which is heated by...  
WO/2005/055319A2
The present invention relates to a closed system for cooling without moving mechanical parts and at a low noise level, one or more heat-emitting elements. The system comprises a first heat-receiving part that is adapted to receive heat f...  
WO2004097900A3
A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid co...  
WO/2005/045134A1
According to the invention, a railway installation (11) is heated by a heat source with the aid of at least one heating pipe (1) that is filled with a working fluid. Said working fluid is heated by means of the heat source in the vicinit...  
WO2005015104A3
A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular en...  
WO2004042302A3
A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfe...  
WO2005003503A3
A temperature management system for managing the temperature of a discrete, thermal component.The temperature management system comprises a heat exchanger in thermal contact with the thermal component.The system also comprises a fluid tr...  
WO/2005/043059A2
A method of making an evaporator (115) includes orienting a vapor barrier wall (117) , orienting a liquid barrier wall (135) , and positioning a wick (145) between the vapor barrier wall and the liquid barrier wall. The vapor barrier wal...  
WO/2005/038859A2
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implemen...  
WO2005006395A3
A capillary structure (25) for a heat transfer device, such as a heat pipe (2) is provided having a plurality of particles (27) joined together by a brazing compound (30) such that fillets (33) of the brazing compound are formed between ...  
WO/2005/038859A3
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implemen...  
WO/2005/038860A2
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implement...  
WO2004059696A3
The invention provides to thermal management devices constructed from flexible graphite. In one embodiment, the thermal management device includes a wick structure (16) inside a shell (14). In certain preferred embodiments, the wick stru...  
WO/2005/038860A3
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implement...  
WO/2005/036075A2
The inventive device for cooling electronic device components comprises coolers disposed on the cooled electronic device components, a remote radiator and a heat pipe. Said heat pipe consists of four sections embodied in the form of heat...  

Matches 751 - 800 out of 14,682