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Patent Searching and Data


Matches 751 - 800 out of 15,099

Document Document Title
WO/2007/116461A1
A cooler having cooling part (6A) capable of cooling heating element (7) with a refrigerant and heat radiation part (6C) capable of releasing heat from the refrigerant heated at the cooling part (6A) and including a bubble pump capable o...  
WO/2007/113311A1
Disclosed are a heat pipe and a method for operating such a heat pipe which remains active for an extended period of time especially during use in a pressurized gasification atmosphere, i.e. in a hydrogen-rich environment. Also disclosed...  
WO/2007/115242A2
The invention is directed to binary oligonucleotide probes for nucleic analysis, which probes can be made of DNA or RNA that recognize nucleic acid analytes (both DNA and RNA) with unprecedented high selectivity under mild conditions and...  
WO/2007/114913A3
A micro scale cooling system comprises a first heat exchanger (120) thermally coupled to a first heat source (115). The cooling system also has a second heat exchanger (130) thermally coupled to a second heat source ( 125) and a connecti...  
WO/2007/114497A1
A working liquid for latent heat transport apparatus that without the danger of inducing a negative impact on environment, such as disruption of the ozone layer or global warming, stably exhibits high performance at a working temperature...  
WO/2007/115241A3
A low cost boiling cooler that utilizes boiling two-phase cooling is presented. As boiling vaporization becomes primary means of spreading heat in a boiling cooler utilizing a boiling enhancement surface to significantly augment nucleate...  
WO/2007/112060A3
The present invention is a heat pipe (20) having a specified volume of working fluid determined in relation to the interior volume of the heat pipe (20) and a target temperature TT, to provide self-temperature regulation and pressure man...  
WO/2007/112060A2
The present invention is a heat pipe (20) having a specified volume of working fluid determined in relation to the interior volume of the heat pipe (20) and a target temperature TT, to provide self-temperature regulation and pressure man...  
WO/2007/105450A1
This invention provides a heat removing apparatus which can realize heat removal of a high heat flux from a large area. A heat removing apparatus (1) comprises a heat removing flow passage (31) provided adjacent to an object (HO), from w...  
WO/2007/103166A2
Apparatus and method for cooling a comestible fluid. The method can include cooling a plate with ice. A heat pipe with a condenser portion can be in heat transfer relationship with the plate, and an evaporator portion can be in heat tran...  
WO/2007/101693A1
The invention relates to a device for cooling, comprising an evaporator, a gas cooler, a first coolant conduit for connecting an evaporator outlet to a gas cooler inlet, and a second coolant conduit for connecting a gas cooler outlet to ...  
WO/2007/102498A1
A method of ebullient cooling, in which any noise/vibration accompanying bubble atomization ebullient cooling can be effectively reduced to thereby realize efficient ebullient cooling; a relevant ebullient cooling apparatus and flow chan...  
WO/2007/096313A1
There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5),...  
WO/2007/097762A1
An apparatus for vaporizing a liquid and heating the vaporized liquid to an elevated temperature. The apparatus has a heat transfer wall having an outer surface for receiving heat and transferring the heat to an inner surface. A wick mat...  
WO/2007/086418A1
Provided is an apparatus for efficiently cooling the much heat of a hot object such as an exhaust gas to be cooled, neither by enlarging the size of a cooling device such as a radiator nor by needing either a piping to connect an evapora...  
WO/2007/085767A1
A method, dedicated to manufacturing panels having one or more integrated heat pipes and/or inserts, consists in a) providing a lower plate (SI) comprising, at selected points situated on either side of reception zones for a heat pipe or...  
WO/2007/083441A1
This invention provides a cooling room comprising a high-temperature side thermosyphon, a Sterling refrigerator, a cooling space, a fan, and a control unit. The high-temperature side thermosyphon is provided for transferring heat from an...  
WO/2007/082013A3
A tank for use in a system that outputs a liquid at a user defined constant temperature in order to regulate the temperature of a piece of equipment includes a body of material having a top wall and a plurality of other walls which colle...  
WO/2007/082012A3
A tank for use in a system that outputs a liquid at a user defined constant temperature in order to regulate the temperature of a piece of equipment includes a body of material having a top wall and a plurality of other walls which colle...  
WO/2007/081617A3
A microchannel heat sink is manufactured from graphite materials. A heat sink member (300) has at least a first thermal contact surface (308) for making thermal contact with an electronic device (312). The heat sink member is constructed...  
WO/2007/080154A1
The invention relates to a continuous method for carrying out an exothermal reaction of a reaction medium containing at least one liquid phase in an adiabatic solid bed reactor, characterized in that one or several thermally conductive p...  
WO/2007/079371A2
Heat sealable mesh-like planar or 3D heat transferring material with improved weight characteristics has high surface area and air breathable surface uniquely advantageous to tasks of heat dissipation or harvesting. Material is heat seal...  
WO/2007/079427A2
A heat conducting material that utilizes phase transitions to transport heat. The material can be used to produce heat pipe devices by simple creation of hermetic seams that isolate segments of the material. The material provides superio...  
WO/2007/079371A3
Heat sealable mesh-like planar or 3D heat transferring material with improved weight characteristics has high surface area and air breathable surface uniquely advantageous to tasks of heat dissipation or harvesting. Material is heat seal...  
WO/2007/079427A3
A heat conducting material that utilizes phase transitions to transport heat. The material can be used to produce heat pipe devices by simple creation of hermetic seams that isolate segments of the material. The material provides superio...  
WO/2007/076090A2
A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use...  
WO/2007/075130A1
The invention relates to an apparatus and method for cooling a power device. The apparatus comprises a heat sink (12) , in thermal contact with the electric and/or magnetic power device and comprises a closed cavity .(16) containing a ph...  
WO/2007/076090A3
A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use...  
WO/2007/070243A1
An evaporator (105) includes a cylindrical barrier wall (200) , and a cap that fits at an end of the cylindrical barrier wall (200) . The cylindrical barrier (200) wall defines a central axial opening and an outer cylindrical surface. Th...  
WO/2007/066038A1
The invention relates to a cooling device comprising a heat pipe (6) which is provided with an electrically-isolating part (15) between the evaporating (8) and condensing (7) parts thereof, such that the hot and cold areas are isolated e...  
WO/2007/035295A1
The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal...  
WO/2007/029125A2
A heat transfer device (100) includes a vapor chamber (130) that houses a phase change material such as water. The heat transfer device (100) may be selectively formed from a combination of polymeric and non-polymeric materials. In one e...  
WO/2007/030411A3
A spray cooling system for transverse evaporative spray cooling in a narrow gap, which may generally include a mixing zone, a converging zone, a plurality of cooling conduits, and a re-circulation conduit. The spray cooling system in som...  
WO/2007/029125A3
A heat transfer device (100) includes a vapor chamber (130) that houses a phase change material such as water. The heat transfer device (100) may be selectively formed from a combination of polymeric and non-polymeric materials. In one e...  
WO/2007/029359A1
A thin and flat type heat pipe with enhanced heat conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate pl...  
WO/2007/026909A1
A steam engine of a simple structure capable of efficiently providing mechanical energy from not only hot heat sources but also various heat sources in a low temperature state such as the exhaust heat of internal combustion engine. In th...  
WO/2007/026833A1
To provide a small-sized and thin heat pipe (1) enabling a remarkable increase in heat conductivity. An upper intermediate plate (7) and a lower intermediate plate (8) in which a plurality of steam diffusing flow passages (10) in a horiz...  
WO/2007/027663A3
Evaporative cooling is an effective and efficient method for rapidly removing heat from a system device. In accordance with the disclosure herein, a microfluidic Y-junction apparatus is provided which can produce low temperatures and can...  
WO/2007/024361A3
A heat transfer fluid can be circulated through an LNG vaporizer, then to a liquid-to-air heat exchanger. Ambient air can be introduced into liquid-to-air heat exchanger to warm the heat transfer fluid while a pump circulates the heat tr...  
WO/2007/019558A3
A heat pipe comprising a chamber; a wick in the chamber, and a heat sink, which is adjacent to a first portion of the wick. A heat source adjacent to a second portion of the wick, wherein the wick is configured such that a gas condenses ...  
WO/2007/010527A3
A method and apparatus for cooling eletronic or other devices (CD) by bringing the device to be cooled into contact with one face of a cold plate (30) having high thermal conductivity; and applying a plurality of liquid jets of a liquid ...  
WO/2007/009868A1
The invention relates to an arrangement (1) of at least one electrical component (2) and at least one cooling device (3) for dissipating heat from the component, the cooling device having at least one two-phase cooling device with at lea...  
WO/2007/010005A1
The invention relates to an arrangement (1) of an at least one electric component (2) and at least one cooling device (3) for dissipating heat from the component, the cooling device having at least a two-phase cooling device having at le...  
WO/2007/002429A3
According to some embodiments, a capillary tube may be utilized to facilitate bubble containment in liquid cooling systems. For example, a system may comprise a first volume to contain a liquid, a second volume to contain the liquid and ...  
WO/2007/000243A3
Reforming reactor for the conversion of a process fluid into hydrogen comprising: a reforming section (4) which is contained within a closed volume (8), a boiler section (3) and a combustion section (2), in which said reforming section c...  
WO/2007/001317A2
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a firs...  
WO/2007/000243A2
Reforming reactor for the conversion of a process fluid into hydrogen comprising: a reforming section (4) which is contained within a closed volume (8), a boiler section (3) and a combustion section (2), in which said reforming section c...  
WO/2007/001317A3
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a firs...  
WO/2007/000624A1
A real temperature output air conditioner which lowers the ambient temperature of an interior space to a desired temperature and, one that has been achieved, delivers a constant flow of air at that specific temperature thereto. The prese...  
WO2006107492A3
A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid- vapor manifold in fluid communication with a capillary structure thermally connec...  

Matches 751 - 800 out of 15,099