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Patent Searching and Data


Matches 751 - 800 out of 14,125

Document Document Title
WO/2003/104726A1
An improved thermoelectric power generation system (100) utilizes rotary thermoelectric (135) configurations to improve and increase thermal power throughput. These systems are further enhanced by the use of hetrostructure thermoelectric...  
WO/2003/105316A1
The invention relates to an electric motor (22) comprising a fixed stator (25) which is arranged around a rotatably mounted rotor (3). Said electric motor comprises at least one cooling unit (14) to which parts (25i) of the stator (25) w...  
WO2003015234A3
Featured is a heat transferring device (200) being configured and arranged so that at least some of the heat energy being generated by a heat producing device, such as the a bearing assembly of a flywheel energy storage system, is commun...  
WO/2003/098138A1
The invention concerns a water cooler operating by direct expansion on the water of the distribution system, comprising a cold producing unit (1) operating on refrigerant gas and an insulated-water cooling tank (4), the refrigerant gas c...  
WO/2003/098645A1
Disclosed is a device (2) comprising a superconducting magnet (3) that is provided with at least one cooling agent-free superconducting coil (4a, 4b), and a cooling unit that is provided with at least one cold head (6). A conduit system ...  
WO/2003/098786A1
The invention relates to a superconductive device (2) containing a rotor (5) that can be rotated about an axis of rotation (A) and that comprises a superconductive winding (10) in a winding support (9). Said winding support has a central...  
WO/2003/098141A1
A heat transfer device includes a base chamber (110), a fin chamber (120), and at least one fin (130). The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi...  
WO2003052819A3
A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the com...  
WO2003059958A3
A polymerization reactor (10) comprises a heat pipe jacket (44) for the removal of large heat fluxes and capable of maintaining essentially isothermal conditions without the use of complicated and maintenance intensive circulation heat e...  
WO/2003/095920A1
The invention relates to a method for transmitting heat energy, wherein the heat energy is transmitted into an inner chamber (3) of a rotating centrifuge via a first heat exchanger (4,4a,4b), in which inner chamber (3) a gaseous energy t...  
WO/2003/093750A1
A thermal system (100) comprising a top sheet (101a) and a bottom sheet (101b).  
WO2003014697A3
This invention comprises devices, compositions and methods for quantitative detecting analytes in complex solutions by Raman spectroscopy. Passivating agents associated with enhancing surfaces can decrease direct, non-specific interactio...  
WO/2003/088022A1
A chipset cooling device of a video graphics adapter (VGA) card that includes two heatsinks mounted on respective opposite surfaces of a VGA card to collectively cool a chipset of the VGA card is provided. In the chipset cooling device o...  
WO/2003/086950A2
The invention relates to a dispenser for liquid foodstuffs and beverages, in particular juices. A device (3) for transporting the liquid foodstuff, in particular a spiral tube (4) is located in a container (1) and is surrounded by a liqu...  
WO/2003/087695A1
A self-excited vibration heat pipe high in heat transfer performance and reliability, low in price, allowing to be reduced in size and weight, and having a flexibility, and a computer with the heat pipe, the heat pipe wherein at least a ...  
WO2003062686A3
A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat p...  
WO/2003/085345A1
A loop-type thermosiphon that is operable stably independently of fluctuation in thermal load, and a Stirling refrigerator using the loop-type thermosiphon. A loop-type thermosiphon where heat is carried by a working fluid from a high te...  
WO/2003/083398A1
The present invention relates to a method for assembling a heat absorption block and a plurality of heat pipes with each other and an assembly thereof, and more particularly, to a method for assembling a heat absorption block, which is u...  
WO/2003/083391A1
A method wherein refrigeration is generated, preferably using a pulse tube cryocooler (100) or refrigerator, to produce cold working gas which is used to liquefy coupling fluid circulating (24, 18) between a coupling fluid liquid reservo...  
WO/2003/078906A1
Disclosed is a refrigeration plant for parts of an installation, which are to be chilled. Said refrigeration plant (2) comprises at least two cold heads (7, 8) which are thermally coupled to parts (3a) of a particularly supraconducting i...  
WO/2003/079396A1
An x-ray tube ((10) includes an evacuated envelope (14), a cathode assembly (20) located in the evacuated envelope and a disk shaped anode assembly (18) located in the evacuated envelope in operative relationship with the cathode assembl...  
WO2003046463A3
A stacked array of low profile heat pipes (410) each with a plurality of micro tubes (21) therethrough which cools an electronic device (420).  
WO/2003/074958A1
A passive cooling unit for integrated electronics in form of flat-plate heat-pipe device (20) having a shallow cavity base member (26), a cover plate (28), and a lanced-offset fin member (36) and associated porous metal wick material san...  
WO/2003/073032A1
A capillary evaporator (100) for removing heat from a heat source (102), particularly under high heat-flux conditions. The capillary evaporator includes a housing (104) having a plurality of ribs (108) in thermal communication with the h...  
WO2003017365A3
The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a compositi...  
WO/2003/071215A1
A heat pipe assembly (10&sol 110), under vacuum and having a working substance charged therein, comprising generally an evaporator (12&sol 112) adapted to evaporate the working fluid and a condenser (16&sol 116). The condenser (16&sol 11...  
WO/2003/068626A1
A heat pipe (5) is provided having a vessel (10) with a closed first end, a second end (24), and a wick (15) on an inner surface that defines a passageway. A convex wall (20) is positioned at the second end (22) so as to block the passag...  
WO/2003/062686A2
A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat p...  
WO/2003/059958A2
A polymerization reactor (10) comprises a heat pipe jacket (44) for the removal of large heat fluxes and capable of maintaining essentially isothermal conditions without the use of complicated and maintenance intensive circulation heat e...  
WO2003016044A8
A heat transfer medium is shown, having a very high heat transfer rate that is simple in structure, easy to make, environmentally sound, rapidly conducts heat, and preserves heat in a highly efficient manner. Also shown is a heat transfe...  
WO/2003/058144A1
The present invention relates to a kind of integrated heat pipe and a method of heat exchange. The heat pipe includs a tank(1-2) as a heating potion and a lot of heat carriers(1-4) as a radiating portion. The tank(1-2) and the heat carri...  
WO/2003/057361A1
A polymerization reactor (10) for exothermic liquid phase reactions comprises a reaction zone (31) which is divided into a plurality of channels by thermally conductive heat transfer fins (22) which are conductively mounted on one or mor...  
WO/2003/057358A1
A vapor-phase tubular reactor in a shell heat exchanger for removal of the heat of reaction at essentially isothermal conditions has porous wicking surface (211) applied to the external surface of reactor tubes (210). The porous wicking ...  
WO/2003/056265A1
An evaporator (23) disposed between an exhaust manifold (22) and an exhaust pipe (24), comprising, in order, a first exhaust gas passage (56) having a third stage heat exchanger (H3) extending from an upstream side to a downstream side, ...  
WO2003004944A3
A novel fluid heat transfer agent suitable for use in a closed heat transfer system, for example, wherein heat energy is transferred between an evaporator and a condenser in heat exchange relationship with the heat transfer agent that is...  
WO/2003/056626A1
The invention provides an ebullition cooling device 1 for a heat generating component B which device comprises a boiling unit 2 for boiling a refrigerant A contained therein with the heat generated by the heat generating component B as a...  
WO/2003/054469A1
An advanced Loop Heat Pipe ('ALHP') apparatus, for passively transporting waste heat over a long distance and rejecting it to a heat sink for heat rejection, an evaporator capillary pump ('ECP') (100) for heat acquisition, includes a res...  
WO/2003/052819A2
A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the com...  
WO/2003/050465A1
A small and thin cooling device with high cooling performance, an electronic equipment device, and a method of manufacturing the cooling device, the cooling device (1) comprising rectangular first glass substrate (2) and second glass sub...  
WO2003025475A3
The modular CPL cooling system transfers heat from high-power circuit components (22) in a chassis to other locations within or external to the chassis, where the heat can be more easily removed. The CPL cooling system includes one or mo...  
WO/2003/050466A1
A cooling device capable of being reduced in size and thickness and capable of increasing a cooling performance, an electronic equipment device, and a method of manufacturing the cooling device, the cooling device (1) comprising a lower ...  
WO/2003/047942A1
A steering wheel (1) has a hub (2) which incorporates a heat exchange element (9) which is connected by spokes (3, 4, 5) to a rim (6). The heat exchanger (10) may be heated or cooled and is connected by means of heat pipes in the spokes ...  
WO/2003/046463A2
A stacked array of low profile heat pipes (410) each with a plurality of micro tubes (21) therethrough which cools an electronic device (420).  
WO/2003/031897A1
A heat collector (50) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame (40) which may be stamped and formed or molded. The heat collector has flanges (53) which...  
WO/2003/029731A2
A micro heat exchanger (200) comprised of an electroosmotic pump (300) and a heat producing device (50).  
WO/2003/025475A2
The modular CPL cooling system transfers heat from high-power circuit components (22) in a chassis to other locations within or external to the chassis, where the heat can be more easily removed. The CPL cooling system includes one or mo...  
WO/2003/026109A2
A power conversion method wherein solar power,thermal power or radiation energy is directly fed to the evaporator (4) of a heat pipe by means of a focusing system or a radiation conductor (20) and is converted into the power of the worki...  
WO/2003/025489A1
A heat dissipation device (300) comprised of a heat pipe member (310) and a heat dissipating member (320).  
WO/2003/023307A1
A heat sink (1), comprising a vertical plate−like heat sink body (2) having a heat receiving part (3) and a heat radiating part (4) and heat radiating fins (5) provided on at least one of the faces of the heat radiating part (4), where...  
WO/2003/023317A1
A tactical missile (10) includes a heat pipe (22) connecting heat sources with heat sinks within the missile. The system includes a removable external heat dissipation device (24) that connects to the heat pipe (22) while the missile (10...  

Matches 751 - 800 out of 14,125