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Patent Searching and Data


Matches 751 - 800 out of 14,763

Document Document Title
WO/2006/054015A2
The invention concerns a heat exchanger (4) for a combustion oven, said exchanger comprising a heat exchanging zone (2) provided with means for the passage of hot fumes derived from a burner of the oven, said zone being traversed by at l...  
WO2005100899A3
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions re...  
WO2005081371A3
The invention relates to a method for producing stacks of plates, especially for producing coolers, cooling elements, or heat sinks which are composed of at least one stack of plates and are used for electric and/or optoelectric components.  
WO/2006/036856A3
A conduit passage (10) for use in transfer of hydrogen gas within a hydride system, including tubular members (20, 220, 230) semi-permeable to hydrogen gas, selectively permitting hydrogen gas to pass through but not oxygen or other gase...  
WO/2006/029324A3
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device furth...  
WO/2006/029324A2
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device furth...  
WO/2006/025852A3
A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high po...  
WO/2006/026460A3
The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system....  
WO/2006/025852A2
A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high po...  
WO2005086615A3
A cryogenic receiver front-end includes a heat sink having a mounting surface and a plurality of fins, a cryocooler mounted to the mounting surface of the heat sink, a heat rejector surrounding the cryocooler, the heat rejector including...  
WO/2006/023737A2
One embodiment of the system is implemented as a device for two-phase heat transfer. This device comprises a chamber containing a fluid, where a heated wall makes up a portion of the chamber. The device also comprises an actuator that em...  
WO/2006/019219A2
A coolant phase changeable cooling apparatus using a capillary action is provided. The cooling apparatus prevents a generation of bubbles inside a wick of an evaporator (100) or an inverse flow of a vaporized gaseous coolant through a wi...  
WO/2006/017579A3
A high energy transport gas and a method to transport the high energy transport gas are used to increase the energy content of a pipeline and other vessels that are designed to carry natural gas under ambient conditions, in a compressed ...  
WO/2006/017579A2
A high energy transport gas and a method to transport the high energy transport gas are used to increase the energy content of a pipeline and other vessels that are designed to carry natural gas under ambient conditions, in a compressed ...  
WO/2006/016293A1
The present invention relates to a cooling system for an electronic substrate comprising a heat transfer fluid (4, 10). The heat transfer fluid (4, 10) is arranged to flow along a path (5, 11, 12) by capillary force.  
WO/2006/014288A1
A heat pipe is disclosed comprising an elongated hollow housing having a condenser end and an evaporator end. A corrugated wick is disposed within the housing. The wick comprises a plurality of wedge-shaped capillaries extending from the...  
WO/2006/010541A1
A thermosiphon comprising a tight container (1) containing a heat carrying substance partially as a liquid, partially as vapor, and a heat sink (5) arranged on a first wall (4) of the container (1). Capillary lines are provided on the in...  
WO/2006/010538A1
A refrigerating device comprising a dual-walled container (1), wherein an inner wall (4) thereof defines an inner area (2) for receiving an object that is to be refrigerated and a cavity (6), which is surrounded by an outer wall (5), is ...  
WO/2006/007721A1
The present invention relates to hybrid wicking materials for use in high performance heat pipes and other fields where a bi-modal distribution of pore sizes offers advantages over a homogeneous monolithic porous structure. In one aspect...  
WO/2006/009267A1
In a heat sink (1), heat pipes (3) are arranged from a high temperature part to low temperature parts (B) in different directions, on one high temperature part (A) of a base board (2) whereupon a heating element (4) is provided.  
WO/2006/007488A3
A fluid-containing cooling plate includes a bottom plate (10), a top plate (30), and metal wire (20)or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire (30) is plated or otherwise coated with a b...  
WO/2006/007163A1
A heat dissipating device (100). The heat dissipating device comprises a receptor plate (102) to be placed over a device that generates heat, an evaporator (106) coupling to the receptor plate (102), a condenser column (108) placed in fl...  
WO2005108897A3
A capillary structure (90) for a heat transfer device, such as a heat pipe is provided having a plurality of particles including a first species (71) having a first diameter and a second species (73) having a second diameter that are joi...  
WO2004076857A3
An electroosmotic pump (22) used in a closed loop cooling system (10). The pump includes a fluid chamber, a pumping element (104), an inlet electrode (1 12A), an outlet electrode (112B), and means for providing electrical voltage to the ...  
WO/2006/000205A2
The invention relates to a thermal energy discharge device comprising a coolant circuit, a heat exchanger wherein thermal energy is transferred to the coolant, also comprising a coolant pump for pumping coolant through the heat exchanger...  
WO/2006/001980A2
Steady-state cooling of the skin is achieved by a support surface without requiring external power or circulation of air. Heat is transferred from via a thermally conductive layer or layers of material(s) that are soft, pliable, and comf...  
WO/2005/124256A1
A metal hydride heat pump (10) comprising a first compartment (18), including a first fluid inlet (32) and a first fluid outlet (34), wherein the first fluid inlet (32) is configured for fluid communication with the first fluid outlet (3...  
WO/2005/124257A1
A heat transfer assembly for transferring heat from a heat generating device (5) to a circulating fluid, said heat transfer assembly comprising - an evaporator device (3) having at least one microchannel (1) formed therein, in thermally ...  
WO2005043059A3
A method of making an evaporator (115) includes orienting a vapor barrier wall (117) , orienting a liquid barrier wall (135) , and positioning a wick (145) between the vapor barrier wall and the liquid barrier wall. The vapor barrier wal...  
WO/2005/125296A1
A cooling device to which an electric circuit may be mounted includes a cooling body provided with a front edge having bores forming V-shaped channels inside the body. Intersecting V-shaped channels are closed by plugs to thereby define ...  
WO2005094224A3
A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sec...  
WO/2005/114084A1
A heat pipe (10) with superior heat transfer between the heat pipe (10) and the heat source and heat sink (16) is provided. The heat pipe (10) is held tightly against the heat source by mounting holes (12) which penetrate the structure o...  
WO/2005/114061A2
A heat transfer system (100) comprising a primary heat exchanger (102) for receiving heat from a heat source (104); a secondary heat exchanger (106) for exhausting heat to a heat sink (108); a conduit (110) connecting the primary heat ex...  
WO/2005/114061A3
A heat transfer system (100) comprising a primary heat exchanger (102) for receiving heat from a heat source (104); a secondary heat exchanger (106) for exhausting heat to a heat sink (108); a conduit (110) connecting the primary heat ex...  
WO2004083742A3
A method of cooling at least one heat generating device (220) using a cooling system (200) is disclosed. The method comprises the steps of using at least one pump (240) to cause a fluid to flow in at least on heat exchanger (210) and adj...  
WO/2005/108897A2
A capillary structure (90) for a heat transfer device, such as a heat pipe is provided having a plurality of particles including a first species (71) having a first diameter and a second species (73) having a second diameter that are joi...  
WO/2005/100897A1
A heat transport apparatus, a method of manufacturing the heat transport apparatus, and electronic equipment on which the heat transport apparatus is mounted. In the heat transport apparatus, since a heat absorbing base plate (2) and a c...  
WO/2005/100899A2
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions re...  
WO/2005/098335A2
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant...  
WO/2005/098335A3
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant...  
WO/2005/098336A1
An evaporator is formed, having an inflow opening from which a liquid or substantially liquid refrigerant flows in, heat exchanging piping for evaporating the refrigerant, and an outflow opening from which the refrigerant flows out. The ...  
WO/2005/098338A1
A thermal transfer device (20) comprises a housing having a base assembly (23) and a cover (22). The base assembly (23) comprises a thermal transfer base (25) and a fluid-porous, thermally conductive mesh structure (26). The thermal tran...  
WO/2005/094224A2
A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sec...  
WO/2005/089197A3
An RF amplifier assembly employing a finned heat sink (16) and a heat pipe enhanced aluminum pallet (10) is disclosed. The hybrid heat pipe enhanced aluminum pallet (10) reduces the spreading thermal conduction resistance associated with...  
WO/2005/086615A2
A cryogenic receiver front-end includes a heat sink having a mounting surface and a plurality of fins, a cryocooler mounted to the mounting surface of the heat sink, a heat rejector surrounding the cryocooler, the heat rejector including...  
WO2005063566A3
With a cooling system for expelling heat from a heat source (30) located in the interior of an aircraft to a heat reducer (32), with a piping system (10) sealed against the surrounding atmosphere which is thermally coupled to a heat inta...  
WO2004040218A3
A system includes a heat transfer system (105) and a priming system (110) coupled to the heat transfer system. The heat transfer system includes a main evaporator (115) having a core (135), a primary wick (140), and a secondary wick (145...  
WO/2005/083345A1
A flexible loop thermosyphon (50) is provided having a flexible, hermetic, outer tube (86) and a flexible, non-hermetic, inner tube, (85) positioned concentrically within the outer tube, forming an annulus between the outer tube and inne...  
WO/2005/081812A2
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...  
WO/2005/081812A3
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...  

Matches 751 - 800 out of 14,763