Title:
【発明の名称】熱膨張率をコントロールするための銅層に形成された可変的穿孔密度の使用
Document Type and Number:
Japanese Patent JP2000503489
Kind Code:
A
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Inventors:
Hanson, David A.
Nodin, David Bee.
Sylvester, Mark F.
Nodin, David Bee.
Sylvester, Mark F.
Application Number:
JP52146598A
Publication Date:
March 21, 2000
Filing Date:
October 17, 1997
Export Citation:
Assignee:
W.L. GORE & ASSOCIATES, INCORPORATED
International Classes:
H01L23/28; H01L23/12; H01L23/14; H01L23/29; H01L23/31; H01L23/367; H01L23/373; H01L23/498; H01L23/538; H05K1/02; (IPC1-7): H01L23/29; H01L23/12; H01L23/28; H01L23/31
Attorney, Agent or Firm:
Takashi Ishida (4 others)