Title:
【発明の名称】高密度チップパッケージに使用する寸法的に安定な芯およびその製法
Document Type and Number:
Japanese Patent JP2000503490
Kind Code:
A
Abstract:
A dimensionally stable core for use in high density chip packages is provided. The stable core is a metal core, preferably copper, having clearances formed therein. Dielectric layers are provided concurrently on top and bottom surfaces of the metal core. Metal cap layers are provided concurrently on top surfaces of the dielectric layers. Blind or through vias are then drilled through the metal cap layers and extend into the dielectric layers and clearances formed in the metal core. If an isolated metal core is provided then the vias do not extend through the clearances in the copper core. The stable core reduces material movement of the substrate and achieves uniform shrinkage from substrate to substrate during lamination processing of the chip packages. This allows each substrate to perform the same. Additionally, a plurality of chip packages having the dimensionally stable core can be bonded together to obtain a high density chip package.
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Inventors:
Fisher, Paul Jay.
Gorell, Robin Y.
Sylvester, Mark F.
Gorell, Robin Y.
Sylvester, Mark F.
Application Number:
JP52153798A
Publication Date:
March 21, 2000
Filing Date:
October 30, 1997
Export Citation:
Assignee:
W.L. GORE & ASSOCIATES, INCORPORATED
International Classes:
H01L23/14; H01L23/498; H01L23/12; H05K3/44; H05K3/46; H05K3/32; H05K3/42; (IPC1-7): H01L23/12; H01L23/14
Attorney, Agent or Firm:
Takashi Ishida (4 others)