Title:
【発明の名称】誘電層の堆積およびエッチングのための方法および装置
Document Type and Number:
Japanese Patent JP2002507067
Kind Code:
A
Abstract:
A method for depositing a conformal layer on a substrate disposed in a process chamber, said method comprising: flowing into said chamber a deposition gas and an inert gas; forming a plasma in said chamber; and selectively decreasing said deposition gas present in said process chamber, thereby decreasing the relative concentration of said deposition gas to said inert gas, during deposition of said conformal layer.
Inventors:
Rossmann, Kent
Application Number:
JP2000536906A
Publication Date:
March 05, 2002
Filing Date:
March 22, 1999
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C23C16/04; C23C16/40; C23C16/455; H01J37/32; H01L21/302; H01L21/3065; H01L21/31; H01L21/3105; H01L21/316; H01L21/768; C23C16/44; (IPC1-7): H01L21/316; C23C16/40; H01J37/32; H01L21/3065; H01L21/31
Attorney, Agent or Firm:
Yoshiki Hasegawa (1 person outside)