Title:
半導体部品の製造方法および前記方法により製造される半導体部品
Document Type and Number:
Japanese Patent JP2004524983
Kind Code:
A
Abstract:
A method for manufacturing a semiconductor component, such as, for example, a multilayer semiconductor component including a micromechanical component, such as, for example, a heat transfer sensor having a semiconductor substrate of silicon, and a sensor region. For inexpensive manufacture of a thermal insulation between the semiconductor substrate and the sensor region a porous layer is provided in the semiconductor component.
Inventors:
Hubert Benzel
Heli belt weber
Frank shafer
Heli belt weber
Frank shafer
Application Number:
JP2002579360A
Publication Date:
August 19, 2004
Filing Date:
February 21, 2002
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
B81C1/00; B81B1/00; B81B3/00; (IPC1-7): B81C1/00
Attorney, Agent or Firm:
Toshio Yano
Einzel Felix-Reinhard
Reinhard Einsel
Einzel Felix-Reinhard
Reinhard Einsel