Title:
部品の支持プレート、支持プレートを備えたパッケージング・ユニット並びにパッケージング・ユニットの作成及び使用
Document Type and Number:
Japanese Patent JP2005538563
Kind Code:
A
Abstract:
The present invention relates to a support plate ( 1 ), preferably made from glass, granite or ceramic, for supporting components ( 3 ), in particular ICs or other semiconductor components. The top face of the support plate ( 1 ) is at least partially roughened (roughened areas ( 2 )), resulting in a roughness Ra of preferably about 0.3 micrometer. Further, the present invention relates to a packaging unit ( 4 ) comprising the support plate ( 1 ).
Inventors:
Francis Cous, S. Em. De, Haas
Johannes, M.A.Fan, Lahrhofen
Johannes, M.A.Fan, Lahrhofen
Application Number:
JP2004535740A
Publication Date:
December 15, 2005
Filing Date:
August 18, 2003
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L25/18; H01L21/00; H01L21/687; H01L25/04; (IPC1-7): H01L25/04; H01L25/18
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki