Title:
温度固定されたチャックを用いた温度可変プロセスにおける基板の加熱方法
Document Type and Number:
Japanese Patent JP2005538566
Kind Code:
A
Abstract:
A method is provided for heating a substrate in a process chamber using a heated chuck. In accordance with the method, the substrate is lowered onto the chuck and heated to a first temperature less than a temperature of the chuck. The substrate is then raised away from the chuck, and a process is carried out on the substrate while the substrate is supported above the chuck. The substrate is then lowered back to the chuck and heated to a second temperature greater than the first temperature for further processing of the substrate.
Inventors:
Cox, gerald
Application Number:
JP2004536230A
Publication Date:
December 15, 2005
Filing Date:
September 10, 2003
Export Citation:
Assignee:
AXCELIS TECHNOLOGIES, INC.
International Classes:
H01L21/00; H01L21/027; H01L21/02; G03F7/42; (IPC1-7): H01L21/02; H01L21/027
Domestic Patent References:
| JP2785027A | ||||
| JPH03135011A | 1991-06-10 |
Foreign References:
| US20010047979A1 | 2001-12-06 |
Attorney, Agent or Firm:
Takahisa Sato