Title:
インコンフォーマルな堆積を用いて半導体プロセス技術において基板を垂直にパターニングする方法
Document Type and Number:
Japanese Patent JP2006500763
Kind Code:
A
Abstract:
Structurization of process area (2) of substrate (1) with relief, inclined and/or perpendicular to horizontal substrate surface (101) and extending into relief to given coating depth (102) between relief depth (103) and substrate surface, involves depositing liner (3) from precursors in process chamber; limited deposition of at least one precursor and coating in uniform thickness almost only on upper part between substrate surface and coating depth.
Inventors:
Hecht, thomas
Goldbach, Mathias
Schroeder, Uwe
Goldbach, Mathias
Schroeder, Uwe
Application Number:
JP2004528398A
Publication Date:
January 05, 2006
Filing Date:
July 21, 2003
Export Citation:
Assignee:
Infineon Technologies AG
International Classes:
H01L21/768; C23C16/04; C23C16/455; H01L21/28; H01L21/285; H01L21/3065; H01L21/314; H01L21/316; H01L21/334; H01L21/8242; H01L27/108; H01L29/78; H01L29/94; C23C16/44
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita